公开(公告)号：US20140008331A1

公开(公告)日：2014-01-09

申请号：US13798060

申请日：2013-03-12

申请人： LINCOLN GLOBAL, INC.

发明人： Jonathan S. OGBORN

IPC分类号： B23K3/053 ,  B23K35/02

CPC分类号： B23K3/053 ,  B23K9/1093 ,  B23K9/173 ,  B23K26/034 ,  B23K26/211 ,  B23K35/02 ,  B23K35/0227 ,  B23K35/0261

摘要： A system and method for using filler wire in hot wire applications, e.g., brazing, cladding, building up, filling, overlaying, welding, and joining applications, is provided. The filler wire has a first section that has a first resistance per unit length. The filler wire has a second section that has a second resistance per unit length, which is higher than the first resistance per unit length. The second section of the filler wire is configured to melt before the first section during hot-wire applications. In some embodiments, a resistivity of the first section and a resistivity of the second section are equal and the second section has a cross-sectional area that is smaller than a cross-sectional area of the first section. In some embodiments, a resistivity of filler material in the first section and a resistivity of filler material in the second section are different.

摘要翻译： 提供了一种用于在热线应用中使用填充线的系统和方法，例如钎焊，包层，建立，填充，覆盖，焊接和连接应用。 填充线具有第一部分，其具有每单位长度的第一电阻。 填充线具有第二部分，其具有每单位长度的第二电阻，其高于每单位长度的第一电阻。 填充焊丝的第二部分构造成在热丝应用期间在第一部分之前熔化。 在一些实施例中，第一部分的电阻率和第二部分的电阻率相等，第二部分的横截面面积小于第一部分的横截面面积。 在一些实施例中，第一部分中的填充材料的电阻率和第二部分中填充材料的电阻率是不同的。

公开(公告)号：US07238919B2

公开(公告)日：2007-07-03

申请号：US11348482

申请日：2006-02-07

申请人： Hisashi Kaneko ,  Mie Matsuo ,  Hirokazu Ezawa

发明人： Hisashi Kaneko ,  Mie Matsuo ,  Hirokazu Ezawa

IPC分类号： B23K3/053 ,  H05B3/20

CPC分类号： B23K1/0016 ,  B23K2101/40 ,  B29C65/222 ,  B29C65/229 ,  B29C66/1122 ,  B29C66/43 ,  B29C66/472 ,  B29C66/818 ,  B29C66/81811 ,  B29C66/8362 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  Y10T29/49211 ,  Y10T29/49826 ,  H01L2224/0401

摘要： According to an aspect of the present invention, there is provided a bonding method, comprising disposing on a first body a second body with a bump interposed therebetween; and electrically and mechanically bonding the first body and the second body with the bump by passing a heating element between the first body and the second body to melt the bump by the heating element, the heating element being heated to a melting point or more of a material configuring the bump.

摘要翻译： 根据本发明的一个方面，提供了一种接合方法，包括：在第一主体上设置有插入其间的凸块的第二主体; 并且通过使第一主体和第二主体之间的加热元件通过加热元件熔化凸起而使第一主体和第二主体与凸起电气地和机械地结合，加热元件被加热到熔点以上 材料配置凸块。

公开(公告)号：US20050109823A1

公开(公告)日：2005-05-26

申请号：US10721494

申请日：2003-11-25

申请人： Peter Gruber ,  Lannie Bolde

发明人： Peter Gruber ,  Lannie Bolde

IPC分类号： B23K3/053 ,  B23K3/06 ,  B23K31/02

CPC分类号： B23K3/0638 ,  B23K3/053 ,  B23K3/0607

摘要： A solder feeding device having a reservoir, a drive unit, a first lead, and a second lead is provided. The reservoir melts solid solder wire into molten solder, while the drive unit selectively feeds the solid solder wire into the reservoir. The first and second leads are in electrical communication with the drive unit. The first lead is positioned in the reservoir so that it electrically communicates with the second lead through the molten solder when the molten solder reaches a triggering level, but so that it does not electrically communicate with the second lead when the level is below the triggering level. The drive unit feeds the solid solder wire into the reservoir based upon a state of electrical communication between the first and second leads.

摘要翻译： 提供具有储存器，驱动单元，第一引线和第二引线的焊料馈送装置。 储存器将固体焊丝熔化成熔融焊料，而驱动单元选择性地将固体焊丝馈送到储存器中。 第一和第二引线与驱动单元电连通。 第一引线定位在储存器中，使得当熔融焊料达到触发水平时，其通过熔融焊料与第二引线电连通，但是当电平低于触发电平时它不与第二引线电连通 。 驱动单元基于第一和第二引线之间的电连通状态将固体焊丝馈送到储存器中。

公开(公告)号：US4700040A

公开(公告)日：1987-10-13

申请号：US11405

申请日：1987-02-04

申请人： John M. Driggers

发明人： John M. Driggers

IPC分类号： B23K3/053 ,  C21D9/08 ,  F22B37/00 ,  H05B6/38 ,  B23K1/02

CPC分类号： F22B37/003 ,  B23K3/053 ,  C21D9/08 ,  H05B6/38 ,  B23K2201/14 ,  Y02P10/253

摘要： Both an apparatus and a process for accurately applying a correct amount of brazing heat to a conduit are disclosed herein. The apparatus generally comprises a mandrel including an electrical resistance wire heating element and a heat sensor for sensing the temperature of the inside walls of the conduit which were heated. The mandrel is preferably formed from a refractory material, and the heat sensor is located beneath the surface of the mandrel in order to insulate it from heat radiated from the electrical resistance wire wound about the mandrel body. The mandrel further includes an opening in the portion of the mandrel which surrounds the heat sensor in order that the sensor may be selectively exposed to a section of conduit to which heat was applied by sliding the mandrel to a position which aligns the opening with the wall of the heated conduit. The temperature of the conduit may then be determined as a function of the radiant heat received by the heat sensor. The invention is particularly useful in producing high quality braze joints between reinforcing sleeves inserted within damaged heat exchange tubes of a nuclear steam generator since the heat sensor allows the operator to determine whether or not a proper amount of brazing heat was applied to the sleeve/tube configuration.

公开(公告)号：US1370136A

公开(公告)日：1921-03-01

申请号：US28690219

申请日：1919-04-02

申请人： CUTLER HAMMER MFG CO

发明人： LIGHTFOOT EDWIN N

IPC分类号： B23K3/053

CPC分类号： B23K3/053

公开(公告)号：US20220080520A1

公开(公告)日：2022-03-17

申请号：US17299007

申请日：2019-12-19

申请人： Alexander Binzel Schweisstechnik GmbH & Co. KG

发明人： Sascha ROSE ,  Andreas NOLL

IPC分类号： B23K9/29 ,  B23K9/16 ,  B23K9/32 ,  H05H1/34 ,  B23K1/005 ,  B23K3/053

摘要： A gas nozzle for the outflow of a protective/shielding gas stream from a gas outlet of the gas nozzle having a gas distributor/diffuser section has a double-walled configuration at least in a partial area of the gas distributor/diffuser section in order to create a flow space for the protective/shielding gas stream. The invention also relates to a torch neck and to a method for thermally joining at least one workpiece, in particular for arc joining, preferably for arc welding or arc brazing/soldering, with an electrode which is arranged in the torch neck or with a wire for producing an arc between the electrode or the wire and the workpiece, and having a gas nozzle for the outflow of a protective/shielding gas stream from a gas outlet.

公开(公告)号：US20130334290A1

公开(公告)日：2013-12-19

申请号：US13592051

申请日：2012-08-22

申请人： Young Ju LEE ,  Yun Bog KIM ,  Seon Young MYOUNG ,  Suk Jin HAM ,  Seong Chan PARK ,  Hyun Jung LEE

发明人： Young Ju LEE ,  Yun Bog KIM ,  Seon Young MYOUNG ,  Suk Jin HAM ,  Seong Chan PARK ,  Hyun Jung LEE

IPC分类号： B23K3/053 ,  B23K1/00

CPC分类号： B23K3/0623

摘要： Disclosed herein is a solder paste droplet ejection apparatus including: a nozzle cap forming an appearance and including a heating electric wire provided inside thereof; a nozzle unit formed inside the nozzle cap, spaced apart from the nozzle cap, and surrounded by the nozzle cap; an ejection probe formed inside the nozzle unit, spaced apart from the nozzle unit, and surrounded by the nozzle unit; and a transfer unit formed in a top portion of the nozzle cap and used for a minute movement, wherein a solder paste supplied in a space between the nozzle unit and the ejection probe is ejected in a droplet shape along the ejection probe.

摘要翻译： 这里公开了一种焊锡膏液滴喷射装置，其包括形成外观的喷嘴帽，并且包括设置在其内部的加热电线; 喷嘴单元，其形成在所述喷嘴盖的内部，与所述喷嘴帽间隔开并且被所述喷嘴盖包围; 形成在喷嘴单元内的喷嘴，与喷嘴单元间隔开并被喷嘴单元包围; 以及形成在所述喷嘴帽的顶部并用于微小移动的转印单元，其中在所述喷嘴单元和所述喷射探针之间的空间中供应的焊膏沿着所述喷射探针以液滴形式喷射。

公开(公告)号：US5700987A

公开(公告)日：1997-12-23

申请号：US615562

申请日：1996-03-15

申请人： Nagesh Ramamoorthy Basavanhally

发明人： Nagesh Ramamoorthy Basavanhally

IPC分类号： B23K1/005 ,  B23K31/02 ,  G02B6/42 ,  H05K1/02 ,  H05K3/34 ,  B23K1/00 ,  B23K3/053

CPC分类号： H05K3/3436 ,  G02B6/4225 ,  G02B6/4238 ,  G02B6/4226 ,  H05K1/0212 ,  H05K2203/1476 ,  H05K3/3494 ,  Y02P70/613

摘要： A method for aligning and soldering a first device (11) to a substrate (16) comprises the steps of providing a plurality of solder elements (17) between the first device and the substrate, aligning the first device, and then reflowing and cooling the solder elements to bond the first device to the substrate. The improvement comprises, first, reflowing only a first group of solder elements and then cooling the elements of the first group, thereby to tack the first device to the substrate. Thereafter, we reflow only a second group of the plurality of solder elements and cool the second group, thereby to provide a more secure bond between the device and the substrate without interfering with the alignment of the first device. This method reduces the amount of energy needed for each fellow step, thereby reducing stresses and maintaining better alignment. In an illustrative embodiment, three groups of solder elements are provided, each group containing four solder elements to be heated by individual heater elements (39). Separate circuits (27, 28, 29) are provided for energizing sequentially the three groups for reflow. Thus, four solder elements are initially reflowed and cooled to provide good tacking between the first device and the substrate. Thereafter, the other groups are actuated sequentially with heat dissipation occurring between each successive actuation. Thermal barriers (34, 38) are preferably included between each heater element and the first device and between the heater element and the substrate to concentrate heat on the solder element (17). The first device is illustratively a laser (11) that is aligned with an optical fiber (12) prior to bonding.

摘要翻译： 用于将第一装置（11）对准和焊接到基板（16）的方法包括以下步骤：在第一装置和基板之间提供多个焊料元件（17），对准第一装置，然后回流和冷却 焊接元件将第一器件结合到衬底。 改进之处在于，首先仅回流第一组焊料元件，然后冷却第一组的元件，从而将第一器件固定到衬底上。 此后，我们仅回流第二组多个焊料元件并冷却第二组，从而在不干扰第一器件的对准的情况下，在器件和衬底之间提供更牢固的结合。 该方法减少了每个步骤所需的能量，从而减少了应力并保持了更好的对准。 在说明性实施例中，提供了三组焊接元件，每组包含四个待单独加热元件（39）加热的焊料元件。 提供独立电路（27,28,29），用于顺序地激励三组用于回流。 因此，首先回流和冷却四个焊料元件以在第一器件和衬底之间提供良好的粘合。 此后，其他组依次致动，每个连续致动之间发生散热。 优选地，在每个加热器元件和第一装置之间以及加热器元件和基板之间包括热障（34,38）以将热量集中在焊料元件（17）上。 第一装置示例性地是在接合之前与光纤（12）对准的激光器（11）。

公开(公告)号：US4700053A

公开(公告)日：1987-10-13

申请号：US938369

申请日：1986-12-04

申请人： John M. Driggers ,  William E. Pirl

发明人： John M. Driggers ,  William E. Pirl

IPC分类号： B23K3/053 ,  C21D9/08 ,  F22B37/00 ,  H05B6/38 ,  H05B3/06

CPC分类号： C21D9/08 ,  B23K3/053 ,  F22B37/003 ,  H05B6/38 ,  B23K2201/14 ,  Y02P10/253

摘要： Both an apparatus and a process for accurately applying a correct amount of brazing heat to a conduit are disclosed herein. The apparatus generally comprises a mandrel including an electrical resistance wire heating element and a heat sensor for sensing the temperature of the inside walls of the conduit which were heated. The mandrel is preferably formed from a refractory material, and the heat sensor is located beneath the surface of the mandrel in order to insulate it from heat radiated from the electrical resistance wire wound about the mandrel body. The mandrel further includes an opening in the portion of the mandrel which surrounds the heat sensor in order that the sensor may be selectively exposed to a section of conduit to which heat was applied by sliding the mandrel to a position which aligns the opening with the wall of the heated conduit. The temperature of the conduit may then be determined as a function of the radiant heat received by the heat sensor. The invention is particularly useful in producing high quality braze joints between reinforcing sleeves inserted within damaged heat exchange tubes of a nuclear steam generator since the heat sensor allows the operator to determine whether or not a proper amount of brazing heat was applied to the sleeve/tube configuration.

摘要翻译： 本文公开了用于将准确地施加正确量的钎焊热量的设备和方法。 该设备通常包括一个心轴，它包括一个电阻线加热元件和一个热传感器，用于感测被加热的导管内壁的温度。 心轴优选由耐火材料形成，并且热传感器位于心轴表面下方，以使其与缠绕在心轴本体上的电阻丝辐射的热绝缘。 心轴还包括在心轴的围绕热传感器的部分中的开口，以便传感器可以选择性地暴露于通过将心轴滑动到将开口与壁对准的位置而施加热量的导管部分 的加热导管。 然后可以将导管的温度确定为由热传感器接收的辐射热的函数。 本发明特别可用于在插入核蒸汽发生器的损坏的热交换管内的加强套管之间生产高品质的钎焊接头，因为热传感器允许操作者确定是否适当量的钎焊热施加到套筒/管 组态。

公开(公告)号：US4310304A

公开(公告)日：1982-01-12

申请号：US168320

申请日：1980-07-10

申请人： Andre Decrulle

发明人： Andre Decrulle

IPC分类号： B23K3/053 ,  H05K13/04 ,  F24J3/00 ,  F27B9/22

CPC分类号： B23K3/053 ,  H05K13/0465

摘要： An endless belt (1) transports supports (6) on which electronic components have been placed. The supports have a layer of solder which is to be melted to make electrical contact with the components assembled thereon. A hot plate (8) is arranged at the downstream end of the belt (1). In order to ensure uniform heating of the supports through the belt, the hot plate is provided with openings (10) in its plane, belt-contacting surface. The openings are connected to a vacuum pump (16) and the vacuum keeps the belt in intimate contact with the hot plate.The installation is particularly intended for use in assembling hybrid micro-circuits, whether using thin film technology or thick film technology.

摘要翻译： 环形皮带（1）传送其上放置电子部件的支撑件（6）。 支撑体具有要熔化的焊料层，以与组装在其上的部件电接触。 在传送带（1）的下游端设有一个热板（8）。 为了确保支撑件通过带的均匀加热，加热板在其平面，带接触表面上设置有开口（10）。 开口连接到真空泵（16），并且真空保持带与热板紧密接触。 该装置特别用于组装混合微电路，无论是使用薄膜技术还是使用厚膜技术。