Method of collector formation in BiCMOS technology
    1.
    发明授权
    Method of collector formation in BiCMOS technology 有权
    BiCMOS技术中收集器形成的方法

    公开(公告)号:US07491985B2

    公开(公告)日:2009-02-17

    申请号:US11288843

    申请日:2005-11-29

    摘要: A heterobipolar transistor (HBT) for high-speed BiCMOS applications is provided in which the collector resistance, Rc, is lowered by providing a buried refractory metal silicide layer underneath the shallow trench isolation region on the subcollector of the device. Specifically, the HBT of the present invention includes a substrate including at least a subcollector; a buried refractory metal silicide layer located on the subcollector; and a shallow trench isolation region located on a surface of the buried refractory metal silicide layer. The present invention also provides a method of fabricating such a HBT. The method includes forming a buried refractory metal silicide underneath the shallow trench isolation region on the subcollector of the device.

    摘要翻译: 提供了用于高速BiCMOS应用的异步双极晶体管(HBT),其中通过在器件的子集电极上的浅沟槽隔离区域的下面提供掩埋难熔金属硅化物层来降低集电极电阻Rc。 具体地,本发明的HBT包括至少包括子集电极的基板; 位于子集电极上的埋置难熔金属硅化物层; 以及位于掩埋难熔金属硅化物层的表面上的浅沟槽隔离区域。 本发明还提供一种制造这种HBT的方法。 该方法包括在器件的子集电极上的浅沟槽隔离区域的下面形成埋置难熔金属硅化物。

    Method of base formation in a BiCMOS process
    3.
    发明授权
    Method of base formation in a BiCMOS process 有权
    BiCMOS工艺中碱形成的方法

    公开(公告)号:US07625792B2

    公开(公告)日:2009-12-01

    申请号:US10599938

    申请日:2005-04-06

    IPC分类号: H01L21/8238

    摘要: Disclosed is a bipolar complementary metal oxide semiconductor (BiCMOS) or NPN/PNP device that has a collector, an intrinsic base above the collector, shallow trench isolation regions adjacent the collector, a raised extrinsic base above the intrinsic base, a T-shaped emitter above the extrinsic base, spacers adjacent the emitter, and a silicide layer that is separated from the emitter by the spacers.

    摘要翻译: 公开了一种双极互补金属氧化物半导体(BiCMOS)或NPN / PNP器件,其具有集电极,集电极之上的本征基极,与集电极相邻的浅沟槽隔离区,在本征基极之上的凸起的外部基极,T形发射极 在外部基极之上,邻近发射极的间隔物和通过间隔物与发射极分离的硅化物层。

    BICMOS DEVICES WITH A SELF-ALIGNED EMITTER AND METHODS OF FABRICATING SUCH BICMOS DEVICES
    5.
    发明申请
    BICMOS DEVICES WITH A SELF-ALIGNED EMITTER AND METHODS OF FABRICATING SUCH BICMOS DEVICES 有权
    具有自对准发射器的BICMOS器件和制造这种BICMOS器件的方法

    公开(公告)号:US20090020851A1

    公开(公告)日:2009-01-22

    申请号:US11614757

    申请日:2006-12-21

    IPC分类号: H01L21/331 H01L29/73

    摘要: A method of fabricating an heterojunction bipolar transistor (HBT) structure in a bipolar complementary metal-oxide-semiconductor (BiCMOS) process selectively thickens an oxide layer overlying a base region in areas that are not covered by a temporary emitter and spacers such that the temporary emitter can be removed and the base-emitter junction can be exposed without also completely removing the oxide overlying the areas of the base region that are not covered by the temporary emitter or spacers. As a result, a photomask is not required to remove the temporary emitter and to expose the base-emitter junction.

    摘要翻译: 在双极互补金属氧化物半导体(BiCMOS)工艺中制造异质结双极晶体管(HBT)结构的方法在未被临时发射极和间隔物覆盖的区域中的基极区域上选择性地增厚氧化物层,使得临时 可以去除发射极,并且可以暴露基极 - 发射极结,而不会完全去除覆盖在未被临时发射极或间隔物覆盖的基极区域的区域上的氧化物。 结果,不需要光掩模去除临时发射体并露出基极 - 发射极结。

    BiCMOS devices with a self-aligned emitter and methods of fabricating such BiCMOS devices
    7.
    发明授权
    BiCMOS devices with a self-aligned emitter and methods of fabricating such BiCMOS devices 有权
    具有自对准发射极的BiCMOS器件和制造这种BiCMOS器件的方法

    公开(公告)号:US07709338B2

    公开(公告)日:2010-05-04

    申请号:US11614757

    申请日:2006-12-21

    IPC分类号: H01L21/331

    摘要: A method of fabricating an heterojunction bipolar transistor (HBT) structure in a bipolar complementary metal-oxide-semiconductor (BiCMOS) process selectively thickens an oxide layer overlying a base region in areas that are not covered by a temporary emitter and spacers such that the temporary emitter can be removed and the base-emitter junction can be exposed without also completely removing the oxide overlying the areas of the base region that are not covered by the temporary emitter or spacers. As a result, a photomask is not required to remove the temporary emitter and to expose the base-emitter junction.

    摘要翻译: 在双极互补金属氧化物半导体(BiCMOS)工艺中制造异质结双极晶体管(HBT)结构的方法在未被临时发射极和间隔物覆盖的区域中的基极区域上选择性地增厚氧化物层,使得临时 可以去除发射极,并且可以暴露基极 - 发射极结,而不会完全去除覆盖在未被临时发射极或间隔物覆盖的基极区域的区域上的氧化物。 结果,不需要光掩模去除临时发射体并露出基极 - 发射极结。