Apparatus and method for reducing slippage between structures in an interferometric modulator
    1.
    发明授权
    Apparatus and method for reducing slippage between structures in an interferometric modulator 失效
    用于减少干涉式调制器中结构之间滑动的装置和方法

    公开(公告)号:US07630119B2

    公开(公告)日:2009-12-08

    申请号:US11203613

    申请日:2005-08-12

    IPC分类号: G02B26/00

    CPC分类号: G02B26/001

    摘要: A support structure within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure and a substrate layer. In another embodiment, increased adhesion is achieved between a support structure and a moveable layer. Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.

    摘要翻译: 干涉式调制器装置内的支撑结构可接触装置内的各种其它结构。 支撑结构和其他结构之间的增加的结合强度可以以各种方式实现,例如通过在支撑结构和其它结构之间的界面处提供粗糙化的表面和/或粘合材料。 在一个实施方案中,在支撑结构和基底层之间实现增加的粘附。 在另一个实施例中,在支撑结构和可移动层之间实现增加的粘附。 增加的粘合力可以减少支撑结构和它们在干涉式调制器内附着的其它结构之间的不希望的滑动。

    APPARATUS AND METHOD FOR REDUCING SLIPPAGE BETWEEN STRUCTURES IN AN INTERFEROMETRIC MODULATOR
    2.
    发明申请
    APPARATUS AND METHOD FOR REDUCING SLIPPAGE BETWEEN STRUCTURES IN AN INTERFEROMETRIC MODULATOR 有权
    用于降低干涉仪调制器结构之间的滑移的装置和方法

    公开(公告)号:US20100085626A1

    公开(公告)日:2010-04-08

    申请号:US12631576

    申请日:2009-12-04

    IPC分类号: G02B26/00

    CPC分类号: G02B26/001

    摘要: A support structure within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure and a substrate layer. In another embodiment, increased adhesion is achieved between a support structure and a moveable layer. Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.

    摘要翻译: 干涉式调制器装置内的支撑结构可接触装置内的各种其它结构。 支撑结构和其他结构之间的增加的结合强度可以以各种方式实现,例如通过在支撑结构和其它结构之间的界面处提供粗糙化的表面和/或粘合材料。 在一个实施方案中,在支撑结构和基底层之间实现增加的粘附。 在另一个实施例中,在支撑结构和可移动层之间实现增加的粘附。 增加的粘合力可以减少支撑结构和它们在干涉式调制器内附着的其它结构之间的不希望的滑动。

    Device having patterned spacers for backplates and method of making the same
    4.
    发明授权
    Device having patterned spacers for backplates and method of making the same 失效
    具有用于背板的图案化间隔件的装置及其制造方法

    公开(公告)号:US07701631B2

    公开(公告)日:2010-04-20

    申请号:US11074253

    申请日:2005-03-07

    IPC分类号: G02B26/00

    摘要: Described herein are systems, devices, and methods relating to packaging electronic devices, for example, microelectromechanical systems (MEMS) devices, including optical modulators such as interferometric optical modulators. The packaging system disclosed herein comprises a patterned spacer that, in some embodiments, is fabricated using thin-film methods. In some embodiments, the spacer together with a substrate and backplate package an electronic device.

    摘要翻译: 这里描述了与包装电子设备有关的系统,设备和方法,例如包括光学调制器(例如干涉式光学调制器)的微机电系统(MEMS)设备。 本文公开的包装系统包括在一些实施例中使用薄膜方法制造的图案化间隔物。 在一些实施例中,间隔件与基板和背板一起包装电子装置。

    Method and system for packaging a MEMS device
    6.
    发明授权
    Method and system for packaging a MEMS device 有权
    用于封装MEMS器件的方法和系统

    公开(公告)号:US07184202B2

    公开(公告)日:2007-02-27

    申请号:US11045800

    申请日:2005-01-28

    IPC分类号: G02F1/00

    摘要: A MEMS-based display device is described, wherein an array of interferometric modulators are configured to reflect light through a transparent substrate. The transparent substrate is sealed to a backplate and the backplate can contain electronic circuitry for controlling the array of interferometric modulators. The backplate can provide physical support for device components, such as electronic components which can be used to control the state of the display. The backplate can also be utilized as a primary structural support for the device.

    摘要翻译: 描述了基于MEMS的显示装置,其中干涉式调制器的阵列被配置为将光反射通过透明基板。 透明基板被密封到背板,并且背板可以包含用于控制干涉式调制器阵列的电子电路。 背板可以为诸如可用于控制显示器状态的电子部件等设备组件提供物理支持。 背板也可以用作设备的主要结构支撑。

    Method and device for protecting interferometric modulators from electrostatic discharge
    7.
    发明授权
    Method and device for protecting interferometric modulators from electrostatic discharge 有权
    用于保护干涉式调制器免受静电放电的方法和装置

    公开(公告)号:US07951634B2

    公开(公告)日:2011-05-31

    申请号:US12173739

    申请日:2008-07-15

    申请人: Philip D. Floyd

    发明人: Philip D. Floyd

    IPC分类号: H01L21/00

    摘要: A MEMS device such as an interferometric modulator includes an integrated ESD protection element capable of shunting to ground an excess current carried by an electrical conductor in the MEMS device. The protection element may be a diode and may be formed by depositing a plurality of doped semiconductor layers over the substrate on which the MEMS device is formed.

    摘要翻译: 诸如干涉式调制器之类的MEMS器件包括集成的ESD保护元件,其能够将由MEMS器件中的电导体携带的过剩电流分流到地。 保护元件可以是二极管,并且可以通过在其上形成MEMS器件的衬底上沉积多个掺杂半导体层来形成。

    SELECTABLE CAPACITANCE CIRCUIT
    8.
    发明申请
    SELECTABLE CAPACITANCE CIRCUIT 失效
    可选电容电路

    公开(公告)号:US20110085278A1

    公开(公告)日:2011-04-14

    申请号:US12972219

    申请日:2010-12-17

    申请人: Philip D. Floyd

    发明人: Philip D. Floyd

    IPC分类号: H01G7/00

    摘要: A voltage-controlled capacitor and methods for forming the same are described. A mechanical conductor membrane of the voltage-controlled capacitor is movable to and from a first position and a second position. An amount of capacitance can vary with the movement of the mechanical conductor membrane. A microelectromechanical systems (MEMS) voltage-controlled capacitor can be used in a variety of applications, such as, but not limited to, RF switches and RF attenuators.

    摘要翻译: 描述了压控电容器及其形成方法。 压控电容器的机械导体膜可移动到第一位置和第二位置。 电容量可随着机械导体膜的移动而变化。 微机电系统(MEMS)压控电容器可用于各种应用中,例如但不限于RF开关和RF衰减器。

    Method and device for electrically programmable display
    9.
    发明授权
    Method and device for electrically programmable display 有权
    电可编程显示的方法和装置

    公开(公告)号:US07843410B2

    公开(公告)日:2010-11-30

    申请号:US11134007

    申请日:2005-05-20

    申请人: Philip D. Floyd

    发明人: Philip D. Floyd

    IPC分类号: G09G3/34

    摘要: One embodiment includes a display of interferometric modulators having a configurable resolution characteristic. Selected rows and/or columns are interconnected via a switch. The switch can include a fuse, antifuse, transistor, and the like. Depending on a desired resolution for a display, the switches can be placed in an “open” or “closed” state. Advantageously, using the switches, a display can readily be configured for differing modes of resolution. Furthermore, using the switches, a display can be configured to electrically connect certain rows or columns in the display such that the connected rows or columns can be driven simultaneously by a common voltage source.

    摘要翻译: 一个实施例包括具有可配置分辨率特性的干涉式调制器的显示器。 选定的行和/或列通过交换机互连。 开关可以包括保险丝,反熔丝,晶体管等。 根据所需的显示分辨率,开关可以处于“打开”或“关闭”状态。 有利地,使用这些开关,可以容易地将显示器配置为不同的分辨率模式。 此外,使用这些开关,可以将显示器配置为电连接显示器中的某些行或列,使得所连接的行或列可以由公共电压源同时驱动。

    METHOD AND SYSTEM FOR SEALING A SUBSTRATE
    10.
    发明申请
    METHOD AND SYSTEM FOR SEALING A SUBSTRATE 有权
    用于密封基材的方法和系统

    公开(公告)号:US20100072595A1

    公开(公告)日:2010-03-25

    申请号:US12628024

    申请日:2009-11-30

    申请人: Philip D. Floyd

    发明人: Philip D. Floyd

    IPC分类号: H01L23/02 H01L21/56

    摘要: A method of sealing a microelectromechanical system (MEMS) device from ambient conditions is described, wherein the MEMS device is formed on a substrate and a substantially hermetic seal is formed as part of the MEMS device manufacturing process. The method comprises forming a metal seal on the substrate proximate to a perimeter of the MEMS device using a method such as photolithography. The metal seal is formed on the substrate while the MEMS device retains a sacrificial layer between conductive members of MEMS elements, and the sacrificial layer is removed after formation of the seal and prior to attachment of a backplane.

    摘要翻译: 描述了一种从环境条件密封微机电系统(MEMS)器件的方法,其中MEMS器件形成在衬底上,并且基本上气密的密封件被形成为MEMS器件制造工艺的一部分。 该方法包括使用诸如光刻法的方法在MEMS器件的周边附近在基板上形成金属密封。 金属密封件形成在衬底上,而MEMS器件在MEMS元件的导电构件之间保留牺牲层,并且在形成密封件之后并且在附接背板之前移除牺牲层。