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公开(公告)号：US07184202B2
公开(公告)日：2007-02-27
申请号：US11045800
申请日：2005-01-28
IPC分类号： G02F1/00
CPC分类号： B81C1/0023 , G02B26/001 , Y10T29/49002
摘要： A MEMS-based display device is described, wherein an array of interferometric modulators are configured to reflect light through a transparent substrate. The transparent substrate is sealed to a backplate and the backplate can contain electronic circuitry for controlling the array of interferometric modulators. The backplate can provide physical support for device components, such as electronic components which can be used to control the state of the display. The backplate can also be utilized as a primary structural support for the device.
摘要翻译： 描述了基于MEMS的显示装置，其中干涉式调制器的阵列被配置为将光反射通过透明基板。 透明基板被密封到背板，并且背板可以包含用于控制干涉式调制器阵列的电子电路。 背板可以为诸如可用于控制显示器状态的电子部件等设备组件提供物理支持。 背板也可以用作设备的主要结构支撑。
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2.发明授权Apparatus and method for reducing slippage between structures in an interferometric modulator 失效用于减少干涉式调制器中结构之间滑动的装置和方法公开(公告)号：US07630119B2
公开(公告)日：2009-12-08
申请号：US11203613
申请日：2005-08-12
IPC分类号： G02B26/00
CPC分类号： G02B26/001
摘要： A support structure within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure and a substrate layer. In another embodiment, increased adhesion is achieved between a support structure and a moveable layer. Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.
摘要翻译： 干涉式调制器装置内的支撑结构可接触装置内的各种其它结构。 支撑结构和其他结构之间的增加的结合强度可以以各种方式实现，例如通过在支撑结构和其它结构之间的界面处提供粗糙化的表面和/或粘合材料。 在一个实施方案中，在支撑结构和基底层之间实现增加的粘附。 在另一个实施例中，在支撑结构和可移动层之间实现增加的粘附。 增加的粘合力可以减少支撑结构和它们在干涉式调制器内附着的其它结构之间的不希望的滑动。
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公开(公告)号：US20120127556A1
公开(公告)日：2012-05-24
申请号：US13353132
申请日：2012-01-18
CPC分类号： B81B7/0067 , B81B2201/045 , B81C2203/0109 , B81C2203/0145 , B81C2203/019 , G02B26/001
摘要： A package structure and method of packaging for an interferometric modulator. A transparent substrate having an interferometric modulator formed thereon is provided. A backplane is joined to the transparent substrate with a seal where the interferometric modulator is exposed to the surrounding environment through an opening in either the backplane or the seal. The opening is sealed after the transparent substrate and backplane are joined and after any desired desiccant, release material, and/or self-aligning monolayer is introduced into the package structure.
摘要翻译： 用于干涉式调制器的封装结构和封装方法。 提供了其上形成有干涉式调制器的透明基板。 背板通过密封件连接到透明基板上，其中干涉式调制器通过背板或密封件中的开口暴露于周围环境。 在透明基板和背板接合之后，并且在任何期望的干燥剂，剥离材料和/或自对准单层被引入到包装结构中之后，将开口密封。
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公开(公告)号：US08124434B2
公开(公告)日：2012-02-28
申请号：US11150496
申请日：2005-06-10
IPC分类号： H01L21/00
CPC分类号： B81B7/0067 , B81B2201/045 , B81C2203/0109 , B81C2203/0145 , B81C2203/019 , G02B26/001
摘要： A package structure and method of packaging for an interferometric modulator. A transparent substrate having an interferometric modulator formed thereon is provided. A backplane is joined to the transparent substrate with a seal where the interferometric modulator is exposed to the surrounding environment through an opening in either the backplane or the seal. The opening is sealed after the transparent substrate and backplane are joined and after any desired desiccant, release material, and/or self-aligning monolayer is introduced into the package structure.
摘要翻译： 用于干涉式调制器的封装结构和封装方法。 提供了其上形成有干涉式调制器的透明基板。 背板通过密封件连接到透明基板上，其中干涉式调制器通过背板或密封件中的开口暴露于周围环境。 在透明基板和背板接合之后，并且在任何期望的干燥剂，剥离材料和/或自对准单层被引入到包装结构中之后，将开口密封。
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5.发明申请APPARATUS AND METHOD FOR REDUCING SLIPPAGE BETWEEN STRUCTURES IN AN INTERFEROMETRIC MODULATOR 有权用于降低干涉仪调制器结构之间的滑移的装置和方法公开(公告)号：US20100085626A1
公开(公告)日：2010-04-08
申请号：US12631576
申请日：2009-12-04
IPC分类号： G02B26/00
CPC分类号： G02B26/001
摘要： A support structure within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure and a substrate layer. In another embodiment, increased adhesion is achieved between a support structure and a moveable layer. Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.
摘要翻译： 干涉式调制器装置内的支撑结构可接触装置内的各种其它结构。 支撑结构和其他结构之间的增加的结合强度可以以各种方式实现，例如通过在支撑结构和其它结构之间的界面处提供粗糙化的表面和/或粘合材料。 在一个实施方案中，在支撑结构和基底层之间实现增加的粘附。 在另一个实施例中，在支撑结构和可移动层之间实现增加的粘附。 增加的粘合力可以减少支撑结构和它们在干涉式调制器内附着的其它结构之间的不希望的滑动。
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公开(公告)号：US07420728B2
公开(公告)日：2008-09-02
申请号：US11090552
申请日：2005-03-25
CPC分类号： B81C1/00174 , B81B2201/047 , B81B2203/0181 , B81C1/00182 , B81C2201/0109 , G02B26/001
摘要： Methods for making MEMS devices such as interferometric modulators involve selectively removing a sacrificial portion of a material to form an internal cavity, leaving behind a remaining portion of the material to form a post structure. The material may be blanket deposited and selectively altered to define sacrificial portions that are selectively removable relative to the remaining portions. Alternatively, a material layer can be laterally recessed away from openings in a covering layer. These methods may be used to make unreleased and released interferometric modulators.
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7.发明授权Device having patterned spacers for backplates and method of making the same 失效具有用于背板的图案化间隔件的装置及其制造方法公开(公告)号：US07701631B2
公开(公告)日：2010-04-20
申请号：US11074253
申请日：2005-03-07
申请人： Philip D. Floyd , Brian W. Arbuckle
发明人： Philip D. Floyd , Brian W. Arbuckle
IPC分类号： G02B26/00
CPC分类号： B81C1/00269 , B81B2201/042 , B81C2203/019 , B81C2203/032 , G02B26/001
摘要： Described herein are systems, devices, and methods relating to packaging electronic devices, for example, microelectromechanical systems (MEMS) devices, including optical modulators such as interferometric optical modulators. The packaging system disclosed herein comprises a patterned spacer that, in some embodiments, is fabricated using thin-film methods. In some embodiments, the spacer together with a substrate and backplate package an electronic device.
摘要翻译： 这里描述了与包装电子设备有关的系统，设备和方法，例如包括光学调制器（例如干涉式光学调制器）的微机电系统（MEMS）设备。 本文公开的包装系统包括在一些实施例中使用薄膜方法制造的图案化间隔物。 在一些实施例中，间隔件与基板和背板一起包装电子装置。
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8.发明申请公开(公告)号：US20100080890A1
公开(公告)日：2010-04-01
申请号：US12631194
申请日：2009-12-04
CPC分类号： G02B26/001
摘要： A support structure within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure and a substrate layer. In another embodiment, increased adhesion is achieved between a support structure and a moveable layer. Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.
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9.发明授权Method and device for protecting interferometric modulators from electrostatic discharge 有权用于保护干涉式调制器免受静电放电的方法和装置公开(公告)号：US07951634B2
公开(公告)日：2011-05-31
申请号：US12173739
申请日：2008-07-15
申请人： Philip D. Floyd
发明人： Philip D. Floyd
IPC分类号： H01L21/00
CPC分类号： H01L27/0248 , B81B7/0012 , B81B2201/047 , G02B26/001
摘要： A MEMS device such as an interferometric modulator includes an integrated ESD protection element capable of shunting to ground an excess current carried by an electrical conductor in the MEMS device. The protection element may be a diode and may be formed by depositing a plurality of doped semiconductor layers over the substrate on which the MEMS device is formed.
摘要翻译： 诸如干涉式调制器之类的MEMS器件包括集成的ESD保护元件，其能够将由MEMS器件中的电导体携带的过剩电流分流到地。 保护元件可以是二极管，并且可以通过在其上形成MEMS器件的衬底上沉积多个掺杂半导体层来形成。
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公开(公告)号：US20110085278A1
公开(公告)日：2011-04-14
申请号：US12972219
申请日：2010-12-17
申请人： Philip D. Floyd
发明人： Philip D. Floyd
IPC分类号： H01G7/00
CPC分类号： G02B26/001 , G09G3/346 , G09G3/3466 , G09G3/3473 , G09G2300/06 , H01G5/18 , H01G5/40
摘要： A voltage-controlled capacitor and methods for forming the same are described. A mechanical conductor membrane of the voltage-controlled capacitor is movable to and from a first position and a second position. An amount of capacitance can vary with the movement of the mechanical conductor membrane. A microelectromechanical systems (MEMS) voltage-controlled capacitor can be used in a variety of applications, such as, but not limited to, RF switches and RF attenuators.
摘要翻译： 描述了压控电容器及其形成方法。 压控电容器的机械导体膜可移动到第一位置和第二位置。 电容量可随着机械导体膜的移动而变化。 微机电系统（MEMS）压控电容器可用于各种应用中，例如但不限于RF开关和RF衰减器。
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