Heat Stabilized Moulding Composition
    1.
    发明申请
    Heat Stabilized Moulding Composition 有权
    热稳定成型组合物

    公开(公告)号:US20080146717A1

    公开(公告)日:2008-06-19

    申请号:US11795140

    申请日:2006-01-12

    IPC分类号: C08K3/22

    摘要: The invention relates to a thermostabilized thermoplastic moulding composition comprising (a) a thermoplastic polyamide composition, consisting of a blend of at least two polyamides comprising (a.1) at least 50% mass, relative to the total mass of the thermoplastic polyamide composition, of a first polyamide (PA-1), being a semi-crystalline polyamide having a melting point Tm-1, or being an amorphous polyamide having a glass transition point Tg-1, wherein Tm-1 and Tg-1 together are denoted as T-1 and T-1 is at least 200° C. and (a.2) a second polyamide (PA-2), with a C/N ratio of at most 7, being a semi-crystalline polyamide having a melting point Tm-2 or an amorphous polyamide having a glass transition point Tg-2, wherein Tm-2 and Tg-2 together are denoted as T-2 and T-2 is at least 20° C. lower than T-1, (b) a stabilizing system comprising a thermostabilizer selected from the group consisting of phenolic thermostabilizers, organic phosphites, aromatic amines, metal salts of elements from Group IB, MB, III and IV of the Periodic Table and metal halides of alkali and alkali earth metals, and combinations thereof, and (c) a metal oxide, or salt thereof, of a transition metal element from Group VB, VIB, VIIB and VIIIB of the Periodic Table, or a mixture thereof.

    摘要翻译: 本发明涉及一种热稳定热塑性模塑组合物,其包含(a)热塑性聚酰胺组合物,其由至少两种聚酰胺的混合物组成,所述聚酰胺包含相对于热塑性聚酰胺组合物的总质量至少为50质量%的(a.1) 的第一聚酰胺(PA-1),其为具有熔点Tm-1的半结晶聚酰胺,或者是具有玻璃化转变温度Tg-1的无定形聚酰胺,其中Tm-1和Tg-1一起表示为 T 1和T 1为至少200℃,和(a.2)C / N比至多为7的第二聚酰胺(PA-2)是具有熔点的半结晶聚酰胺 Tm-2或玻璃化转变点Tg-2的无定形聚酰胺,其中Tm-2和Tg-2一起表示为T 2,T 2比T 1至少低20℃,(b )稳定体系,其包含选自酚类热稳定剂,有机亚磷酸酯,芳族胺,金属的热稳定剂 元素周期表IB,MB,III和IV元素的盐和碱金属和碱土金属的金属卤化物及其组合,和(c)来自VB族的过渡金属元素的金属氧化物或其盐 ,VIB,VIIB和VIIIB,或其混合物。

    Heat Stabilized Moulding Composition
    2.
    发明申请
    Heat Stabilized Moulding Composition 有权
    热稳定成型组合物

    公开(公告)号:US20080146718A1

    公开(公告)日:2008-06-19

    申请号:US11794334

    申请日:2006-01-09

    IPC分类号: C08K3/08 C08G77/00

    摘要: The invention relates to non-fibrous-reinforced thermoplastic moulding compositions comprising a metal powder as a heat stabilizer wherein the metal powder has a weight average particle size (dm) of at most 1 mm and the metal in the metal powder is selected from the group consisting of elementary metals from Group VB, VIIB, VIIB and VIIIB of the Periodic Table, and mixtures thereof, and next to the said metal powders a thermoplastic polyamide with an Mw of at most 50.000 g/mol, or a blend of at least two thermoplastic polymers with Tmelt or Tg differing by at least 20° C., or a second thermostabilizer. The invention also relates to the use of these compositions and high temperature applications

    摘要翻译: 本发明涉及包含金属粉末作为热稳定剂的非纤维增强热塑性模塑组合物,其中金属粉末的重均粒径(dm)至多为1mm,金属粉末中的金属选自 由元素周期表VB,VIIB,VIIB和VIIIB族元素组成的元素及其混合物,并且在所述金属粉末旁边,Mw至多为50.000g / mol的热塑性聚酰胺或至少两种 Tmelt或Tg至少为20℃的热塑性聚合物,或第二热稳定剂。 本发明还涉及这些组合物和高温应用的用途

    HEAT-PROCESSABLE THERMALLY CONDUCTIVE POLYMER COMPOSITION
    3.
    发明申请
    HEAT-PROCESSABLE THERMALLY CONDUCTIVE POLYMER COMPOSITION 审中-公开
    热处理导热聚合物组合物

    公开(公告)号:US20100283001A1

    公开(公告)日:2010-11-11

    申请号:US12680985

    申请日:2008-09-30

    IPC分类号: C09K5/00 B29C47/00

    CPC分类号: C08K3/04 C08J3/20 C08K7/00

    摘要: The present invention relates to a heat-processable thermally conductive polymer composition comprising (a) 30 to 95% by weight of a thermoplastic polymer (b) 5 to 40% by weight of a graphite powder; and (c) 0 to 65% by weight of optional further component(s), wherein the particles of the graphite powder are in the form of platelets having a thickness of less than 500 nm, and a process for the preparation heat-processable thermally conductive polymer composition.

    摘要翻译: 本发明涉及一种可热加工的导热聚合物组合物,其包含(a)30至95重量%的热塑性聚合物(b)5至40重量%的石墨粉末; 和(c)0至65重量%的任选的另外的组分,其中所述石墨粉末的颗粒是厚度小于500nm的片晶的形式,以及制备可热加热的方法 导电聚合物组合物。

    Polyester moulding composition for use in electronic devices
    4.
    发明申请
    Polyester moulding composition for use in electronic devices 审中-公开
    用于电子设备的聚酯模塑组合物

    公开(公告)号:US20090105381A1

    公开(公告)日:2009-04-23

    申请号:US11919645

    申请日:2006-04-21

    IPC分类号: C08K5/523

    摘要: The invention relates to A polyester moulding composition consisting of (A) 100 parts by weight (pbw) of a polymer composition consisting of (A-i) at least 50 pbw of a thermoplastic polyester, and, optionally, (A-ii) at least one other polymer, (B) between 2 and 40 pbw of a flame retardant system consisting of (B-i) a nitrogen based organic flame retardant compound free of phosphorus or a phosphorus free salt thereof, and, optionally, (B-ii) less than 1 pbw of a phosphorus containing flame retardant compound, (C) between 0.01 and 1 pbw of a mould release agent, and optionally (D) 0-10 pbw of a fibrous reinforcing agent, and (E) 0-100 pbw of other additives. The invention also relates to the use of the composition for making molded parts, in particular part for use in electrical or electronic applications, and to these molded parts.

    摘要翻译: 本发明涉及一种聚酯成型组合物,其由(A)100重量份(pbw)由(A 1)至少50pbw的热塑性聚酯组成的聚合物组合物和(A-ii)至少一种 另一种聚合物,(B)2至40pbw的由(Bi)不含磷的氮基有机阻燃化合物或其无磷盐组成的阻燃体系,和任选地(B-ii)小于1 含磷阻燃化合物的pbw,(C)0.01至1pbw的脱模剂和任选的(D)0-10pbw的纤维增强剂,和(E)0-100pbw的其它添加剂。 本发明还涉及组合物用于制造模制部件,特别是用于电气或电子应用的部件以及这些模制部件的用途。

    TOUGHENED HALOGEN FREE FLAME RETARDANT POLYESTER COMPOSITION
    6.
    发明申请
    TOUGHENED HALOGEN FREE FLAME RETARDANT POLYESTER COMPOSITION 审中-公开
    增稠的无卤阻燃聚酯组合物

    公开(公告)号:US20100056677A1

    公开(公告)日:2010-03-04

    申请号:US12374135

    申请日:2007-06-18

    IPC分类号: C09K21/14

    摘要: The invention relates to halogen free flame retardant thermoplastic polymer composition comprising a halogen free flame retardant system, a thermoplastic polyester and an amount of 1-20 wt. % of soft blocks chemically bonded to the thermoplastic polyester. The invention also relates to the use of the halogen free flame retardant thermoplastic polymer composition for making fibres, films and injection or extrusion moulded parts.

    摘要翻译: 本发明涉及无卤阻燃热塑性聚合物组合物,其包含无卤阻燃体系,热塑性聚酯和1-20wt。 化学键合到热塑性聚酯的软嵌段的百分比。 本发明还涉及无卤阻燃热塑性聚合物组合物在制造纤维,薄膜和注塑或挤压成型件中的用途。

    HALOGEN FREE FLAME RETARDANT POLYESTER COMPOSITION
    7.
    发明申请
    HALOGEN FREE FLAME RETARDANT POLYESTER COMPOSITION 失效
    无卤阻燃聚酯组合物

    公开(公告)号:US20090264562A1

    公开(公告)日:2009-10-22

    申请号:US12295797

    申请日:2007-04-02

    IPC分类号: C08K5/3477

    摘要: The invention relates to a halogen free flame retardant polyester composition suitable for use as a moulding composition for making lampholders, comprising (A) a polymeric material consisting for at least 50 wt. %, relative to the total weight of the polymeric material, of a thermoplastic polyester; (B) a flame retardant system in an amount of 11-35 wt. %, relative to the total weight of (A), (B) and (C), and consists of: melamine cyanurate, and optionally one or more of the following flame retardant components: another phosphorus-free nitrogen based organic flame retardant compound, a phosphorus containing flame retardant excluding elementary phosphorus, in an amount of less than 1 wt. %, relative to the total weight of (A), (B) and (C); an inorganic flame retardant synergist, and an organic flame retardant synergist (C) a fibrous reinforcing agent in an amount of 5-35 wt. %, relative to the total weight of (A), (B) and (C); and (D) a mould release agent in an amount of at least 0.01 wt. %, relative to the total weight of (A), (B) and (C).

    摘要翻译: 本发明涉及适合用作制造灯座的模制组合物的无卤素阻燃聚酯组合物,其包含(A)至少50重量% 相对于聚合物材料的总重量的热塑性聚酯的%; (B)11-35重量%的阻燃剂体系。 相对于(A),(B)和(C)的总重量,由三聚氰胺氰脲酸酯和任选的一种或多种以下阻燃组分组成:另一种无磷氮基有机阻燃化合物, 不含基本磷的含磷阻燃剂,其量小于1重量%。 %,相对于(A),(B)和(C)的总重量; 无机阻燃剂增效剂和有机阻燃增效剂(C)5-35重量%的纤维增强剂。 %,相对于(A),(B)和(C)的总重量; 和(D)至少0.01重量%的脱模剂 %,相对于(A),(B)和(C)的总重量。