中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

6 records (took 0.017 seconds)

    Optical Device and Method for Manufacturing Same
    3.
    发明申请
    Optical Device and Method for Manufacturing Same 有权
    光学装置及其制造方法

    公开(公告)号：US20150129905A1

    公开(公告)日：2015-05-14

    申请号：US14603931

    申请日：2015-01-23

    Applicant: Point Engineering Co., Ltd.

    Inventor： Ki Myung Nam ,  Tae-Hwan Song ,  Young-Chul Jun

    IPC: H01L25/075 ,  H01L33/62

    CPC classification number: H01L25/0753 ,  H01L24/73 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2933/0075 ,  H05K1/05 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: The present invention relates to an optical device and a method for manufacturing the same. The technical object of the invention is to realize a surface emitting body which allows heat generated from a light-emitting chip to be easily dissipated, eliminates the need for an additional wiring layer, and allows a singular light emitting chips or a plurality of light emitting chips to be arranged in series, in parallel, or in series-parallel. The present invention discloses an optical device comprising: a substrate; a plurality of light emitting chips disposed on the substrate; a plurality of conductive wires which electrically connect the substrate with the light emitting chips such that the plurality of light emitting chips are connected to each other in series, in parallel or in series-parallel; and a protective layer which covers the plurality of light emitting chips and the plurality of conductive wires on the substrate.

    Abstract translation: 本发明涉及一种光学装置及其制造方法。 本发明的技术目的是实现一种表面发射体，其使得能够容易地消散从发光芯片产生的热量，消除了对附加布线层的需要，并且允许单个发光芯片或多个发光 芯片串联布置，并联或并联布置。 本发明公开了一种光学装置，包括：基板; 设置在所述基板上的多个发光芯片; 多个导线，其将所述基板与所述发光芯片电连接，使得所述多个发光芯片串联并联或并联连接; 以及覆盖基板上的多个发光芯片和多个导线的保护层。

    Optical device and method for manufacturing same
    5.
    发明授权
    Optical device and method for manufacturing same 有权
    光学装置及其制造方法

    公开(公告)号：US09214453B2

    公开(公告)日：2015-12-15

    申请号：US14603931

    申请日：2015-01-23

    Applicant: Point Engineering Co., Ltd.

    Inventor： Ki Myung Nam ,  Tae-Hwan Song ,  Young-Chul Jun

    IPC: H01L25/075 ,  H01L33/62 ,  H05K1/05

    CPC classification number: H01L25/0753 ,  H01L24/73 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2933/0075 ,  H05K1/05 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: The present invention relates to an optical device and a method for manufacturing the same. The technical object of the invention is to realize a surface emitting body which allows heat generated from a light-emitting chip to be easily dissipated, eliminates the need for an additional wiring layer, and allows a singular light emitting chips or a plurality of light emitting chips to be arranged in series, in parallel, or in series-parallel. The present invention discloses an optical device comprising: a substrate; a plurality of light emitting chips disposed on the substrate; a plurality of conductive wires which electrically connect the substrate with the light emitting chips such that the plurality of light emitting chips are connected to each other in series, in parallel or in series-parallel; and a protective layer which covers the plurality of light emitting chips and the plurality of conductive wires on the substrate.

    Abstract translation: 本发明涉及一种光学装置及其制造方法。 本发明的技术目的是实现一种表面发射体，其使得能够容易地消散从发光芯片产生的热量，消除了对附加布线层的需要，并且允许单个发光芯片或多个发光 芯片串联布置，并联或并联布置。 本发明公开了一种光学装置，包括：基板; 设置在所述基板上的多个发光芯片; 多个导线，其将所述基板与所述发光芯片电连接，使得所述多个发光芯片串联并联或并联连接; 以及覆盖基板上的多个发光芯片和多个导线的保护层。

    Optical Device and Method for Manufacturing Same
    6.
    发明申请
    Optical Device and Method for Manufacturing Same 有权
    光学装置及其制造方法

    公开(公告)号：US20140027796A1

    公开(公告)日：2014-01-30

    申请号：US14040166

    申请日：2013-09-27

    Applicant: Point Engineering Co., Ltd.

    Inventor： Ki Myung Nam ,  Tae-Hwan Song ,  Young-Chul Jun

    IPC: H01L33/62 ,  H05K1/05

    CPC classification number: H01L25/0753 ,  H01L24/73 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2933/0075 ,  H05K1/05 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: The present invention relates to an optical device and a method for manufacturing the same. The technical object of the invention is to realize a surface emitting body which allows heat generated from a light-emitting chip to be easily dissipated, eliminates the need for an additional wiring layer, and allows a singular light emitting chips or a plurality of light emitting chips to be arranged in series, in parallel, or in series-parallel. The present invention discloses an optical device comprising: a substrate; a plurality of light emitting chips disposed on the substrate; a plurality of conductive wires which electrically connect the substrate with the light emitting chips such that the plurality of light emitting chips are connected to each other in series, in parallel or in series-parallel; and a protective layer which covers the plurality of light emitting chips and the plurality of conductive wires on the substrate.

    Abstract translation: 本发明涉及一种光学装置及其制造方法。 本发明的技术目的是实现一种表面发射体，其使得能够容易地消散从发光芯片产生的热量，消除了对附加布线层的需要，并且允许单个发光芯片或多个发光 芯片串联布置，并联或并联布置。 本发明公开了一种光学装置，包括：基板; 设置在所述基板上的多个发光芯片; 多个导线，其将所述基板与所述发光芯片电连接，使得所述多个发光芯片串联并联或并联连接; 以及覆盖基板上的多个发光芯片和多个导线的保护层。

Patent Agency Ranking