公开(公告)号：US20230249438A1

公开(公告)日：2023-08-10

申请号：US17731181

申请日：2022-04-27

申请人： Polytronics Technology Corp.

发明人： KAI-WEI LO ,  KUO-HSUN CHEN ,  HSIANG-YUN YANG ,  CHAO-JEN WANG

IPC分类号： B32B15/01 ,  B32B37/12 ,  C09J9/00 ,  C08K3/40 ,  C09J163/00 ,  B32B15/04 ,  B32B15/20

CPC分类号： B32B15/017 ,  B32B15/20 ,  B32B15/043 ,  B32B37/12 ,  C08K3/40 ,  C09J9/00 ,  C09J163/00 ,  C08K2003/2227 ,  C08K2201/001

摘要： A metal clad substrate is disclosed. The metal clad substrate includes a metal baseplate, a metal layer, and a thermally conductive bonding layer disposed therebetween. The thermally conductive bonding layer includes a lower adhesive layer, a fiber-containing layer, and an upper adhesive layer. An upper side and a lower side of the upper adhesive layer contacts the metal layer and the fiber-containing layer, respectively. An upper side and a lower side of the lower adhesive layer contacts the fiber-containing layer and the metal baseplate, respectively. Each of the metal layer and the metal baseplate has a thickness of 0.3 mm - 15 mm. The fiber-containing layer includes a polymer as well as a heat conductive filler and a short fiber evenly dispersed in the polymer. The short fiber is in shape of a string and has a length of 5 µm-210 µm.

公开(公告)号：US20240131819A1

公开(公告)日：2024-04-25

申请号：US18312135

申请日：2023-05-03

申请人： Polytronics Technology Corp.

发明人： KAI-WEI LO ,  WEN-FENG LEE ,  HSIANG-YUN YANG ,  KUO-HSUN CHEN

IPC分类号： B32B15/08 ,  B32B3/02 ,  B32B15/20 ,  B32B33/00

CPC分类号： B32B15/08 ,  B32B3/02 ,  B32B15/20 ,  B32B33/00 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2305/30 ,  B32B2307/206 ,  B32B2307/302 ,  B32B2307/538 ,  B32B2311/12

摘要： A thermally conductive board includes a first metal layer, a second metal layer, and a thermally conductive layer. The material of the first metal layer includes copper, and the first metal layer has a first top surface and a first bottom surface opposite to the first top surface. A first metal coating layer covers the first bottom surface. The material of the second metal layer includes copper, and the second metal layer has a second top surface and a second bottom surface opposite to the second top surface. A second metal coating layer covers the second top surface and faces the first metal coating layer. The thermally conductive layer is an electrically insulator laminated between the first metal coating layer and the second metal coating layer.

公开(公告)号：US20240227358A9

公开(公告)日：2024-07-11

申请号：US18312135

申请日：2023-05-04

申请人： Polytronics Technology Corp.

发明人： KAI-WEI LO ,  WEN-FENG LEE ,  HSIANG-YUN YANG ,  KUO-HSUN CHEN

IPC分类号： B32B15/08 ,  B32B3/02 ,  B32B15/20 ,  B32B33/00

CPC分类号： B32B15/08 ,  B32B3/02 ,  B32B15/20 ,  B32B33/00 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2305/30 ,  B32B2307/206 ,  B32B2307/302 ,  B32B2307/538 ,  B32B2311/12

摘要： A thermally conductive board includes a first metal layer, a second metal layer, and a thermally conductive layer. The material of the first metal layer includes copper, and the first metal layer has a first top surface and a first bottom surface opposite to the first top surface. A first metal coating layer covers the first bottom surface. The material of the second metal layer includes copper, and the second metal layer has a second top surface and a second bottom surface opposite to the second top surface. A second metal coating layer covers the second top surface and faces the first metal coating layer. The thermally conductive layer is an electrically insulator laminated between the first metal coating layer and the second metal coating layer.