公开(公告)号：US20090053976A1

公开(公告)日：2009-02-26

申请号：US11884829

申请日：2006-02-21

申请人： Pradip K. Roy ,  Manish Deopura ,  Sudhanshu Misra

发明人： Pradip K. Roy ,  Manish Deopura ,  Sudhanshu Misra

IPC分类号： B24D18/00 ,  B24D3/00 ,  B24D11/00 ,  B24B7/22

CPC分类号： B24B37/24 ,  B33Y80/00

摘要： The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection.

摘要翻译： 本申请涉及用于基板的化学机械平面化（CMP）的抛光垫及其制造和使用方法。 本发明中描述的焊盘定制为抛光规格，其中规格包括（但不限于）被抛光材料，芯片设计和结构，芯片密度和图案密度，设备平台和使用的浆料类型。 这些垫可以设计成具有长或短范围顺序的专门的聚合物纳米结构，其允许分子水平调节实现优异的热机械特性。 更具体地，可以设计和制造焊盘，使得焊盘内的化学和物理性质均匀和不均匀的空间分布。 此外，这些垫可以被设计成通过表面工程，通过添加固体润滑剂来调节摩擦系数，并且产生具有形成与抛光表面平行的界面的多层聚合材料的低剪切整体垫。 焊盘还可以具有受控的孔隙率，嵌入式研磨剂，抛光表面上的新型凹槽，用于原位生产的浆料输送，以及用于端点检测的透明区域。

公开(公告)号：US08864859B2

公开(公告)日：2014-10-21

申请号：US11998319

申请日：2007-11-28

申请人： Pradip K. Roy ,  Manish Deopura ,  Sudhanshu Misra

发明人： Pradip K. Roy ,  Manish Deopura ,  Sudhanshu Misra

IPC分类号： B24D3/00 ,  B24D11/00 ,  B24D18/00 ,  C09K3/14 ,  B24B1/00 ,  B24B37/26 ,  B24D7/14

CPC分类号： B24B37/26 ,  B24D7/14 ,  B24D11/04

摘要： The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection.

摘要翻译： 本申请涉及用于基板的化学机械平面化（CMP）的抛光垫及其制造和使用方法。 本发明中描述的焊盘定制为抛光规格，其中规格包括（但不限于）被抛光材料，芯片设计和结构，芯片密度和图案密度，设备平台和使用的浆料类型。 这些垫可以设计成具有长或短范围顺序的专门的聚合物纳米结构，其允许分子水平调节实现优异的热机械特性。 更具体地，可以设计和制造焊盘，使得焊盘内的化学和物理性质均匀和不均匀的空间分布。 此外，这些垫可以被设计成通过表面工程，通过添加固体润滑剂来调节摩擦系数，并且产生具有形成与抛光表面平行的界面的多层聚合材料的低剪切整体垫。 焊盘还可以具有受控的孔隙率，嵌入式研磨剂，抛光表面上的新型凹槽，用于原位生产的浆料输送，以及用于端点检测的透明区域。

公开(公告)号：US20150065020A1

公开(公告)日：2015-03-05

申请号：US14489177

申请日：2014-09-17

申请人： Pradip K. Roy ,  Manish Deopura ,  Sudhanshu Misra

发明人： Pradip K. Roy ,  Manish Deopura ,  Sudhanshu Misra

IPC分类号： B24B37/26 ,  B24D11/04

CPC分类号： B24B37/26 ,  B24D7/14 ,  B24D11/04

摘要： The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior themo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection.

摘要翻译： 本申请涉及用于基板的化学机械平面化（CMP）的抛光垫及其制造和使用方法。 本发明中描述的焊盘定制为抛光规格，其中规格包括（但不限于）被抛光材料，芯片设计和结构，芯片密度和图案密度，设备平台和使用的浆料类型。 这些焊盘可以设计成具有长或短范围顺序的专门的聚合物纳米结构，其允许分子水平调谐实现优异的机械特性。 更具体地，可以设计和制造焊盘，使得焊盘内的化学和物理性质均匀和不均匀的空间分布。 此外，这些垫可以被设计成通过表面工程，通过添加固体润滑剂来调节摩擦系数，并且产生具有形成与抛光表面平行的界面的多层聚合材料的低剪切整体垫。 焊盘还可以具有受控的孔隙率，嵌入式研磨剂，抛光表面上的新型凹槽，用于原位生产的浆料输送，以及用于端点检测的透明区域。

公开(公告)号：US07704125B2

公开(公告)日：2010-04-27

申请号：US11251547

申请日：2005-10-14

申请人： Pradip K. Roy ,  Manish Deopura ,  Sudhanshu Misra

发明人： Pradip K. Roy ,  Manish Deopura ,  Sudhanshu Misra

IPC分类号： B24B1/00

CPC分类号： B24D7/14 ,  B24B37/042 ,  B24B37/20 ,  B24B37/26 ,  B24B49/02 ,  B24B53/017 ,  B33Y10/00

摘要： The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection.

摘要翻译： 本申请涉及用于基板的化学机械平面化（CMP）的抛光垫及其制造和使用方法。 本发明中描述的焊盘定制为抛光规格，其中规格包括（但不限于）被抛光材料，芯片设计和结构，芯片密度和图案密度，设备平台和使用的浆料类型。 这些垫可以设计成具有长或短范围顺序的专门的聚合物纳米结构，其允许分子水平调节实现优异的热机械特性。 更具体地，可以设计和制造焊盘，使得焊盘内的化学和物理性质均匀和不均匀的空间分布。 此外，这些垫可以被设计成通过表面工程，通过添加固体润滑剂来调节摩擦系数，并且产生具有形成与抛光表面平行的界面的多层聚合材料的低剪切整体垫。 焊盘还可以具有受控的孔隙率，嵌入式研磨剂，抛光表面上的新型凹槽，用于原位生产的浆料输送，以及用于端点检测的透明区域。

公开(公告)号：US08715035B2

公开(公告)日：2014-05-06

申请号：US11884829

申请日：2006-02-21

申请人： Pradip K. Roy ,  Manish Deopura ,  Sudhanshu Misra

发明人： Pradip K. Roy ,  Manish Deopura ,  Sudhanshu Misra

IPC分类号： B24B49/00

CPC分类号： B24B37/24 ,  B33Y80/00

摘要： The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection.

公开(公告)号：US20080207100A1

公开(公告)日：2008-08-28

申请号：US11998319

申请日：2007-11-28

申请人： Pradip K. Roy ,  Manish Deopura ,  Sudhanshu Misra

发明人： Pradip K. Roy ,  Manish Deopura ,  Sudhanshu Misra

IPC分类号： B24D11/00

CPC分类号： B24B37/26 ,  B24D7/14 ,  B24D11/04

摘要： The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection.

摘要翻译： 本申请涉及用于基板的化学机械平面化（CMP）的抛光垫及其制造和使用方法。 本发明中描述的焊盘定制为抛光规格，其中规格包括（但不限于）被抛光材料，芯片设计和结构，芯片密度和图案密度，设备平台和使用的浆料类型。 这些垫可以设计成具有长或短范围顺序的专门的聚合物纳米结构，其允许分子水平调节实现优异的热机械特性。 更具体地，可以设计和制造焊盘，使得焊盘内的化学和物理性质均匀和不均匀的空间分布。 此外，这些垫可以被设计成通过表面工程，通过添加固体润滑剂来调节摩擦系数，并且产生具有形成与抛光表面平行的界面的多层聚合材料的低剪切整体垫。 焊盘还可以具有受控的孔隙率，嵌入式研磨剂，抛光表面上的新型凹槽，用于原位生产的浆料输送，以及用于端点检测的透明区域。

公开(公告)号：US08932116B2

公开(公告)日：2015-01-13

申请号：US13612135

申请日：2012-09-12

申请人： Manish Deopura ,  Hem M. Vaidya ,  Pradip K. Roy

发明人： Manish Deopura ,  Hem M. Vaidya ,  Pradip K. Roy

IPC分类号： B24B37/26 ,  B24D15/04 ,  B24D18/00 ,  B29C33/42 ,  B29C33/56 ,  B29C33/38 ,  B29C33/40 ,  B29K83/00

CPC分类号： B24B37/26 ,  B24D15/04 ,  B24D18/0009 ,  B29C33/3842 ,  B29C33/405 ,  B29C33/424 ,  B29C33/565 ,  B29K2083/00 ,  B33Y80/00

摘要： Methods for producing in-situ grooves in CMP pads are provided. In general, the methods for producing in-situ grooves comprise the steps of patterning a silicone lining, placing the silicone lining in, or on, a mold, adding CMP pad material to the silicone lining, and allowing the CMP pad to solidify. CMP pads comprising novel groove designs are also described. For example, described here are CMP pads comprising concentric circular grooves and axially curved grooves, reverse logarithmic grooves, overlapping circular grooves, lassajous groves, double spiral grooves, and multiply overlapping axially curved grooves. The CMP pads may be made from polyurethane, and the grooves produced therein may be made by a method from the group consisting of silicone lining, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.

摘要翻译： 提供了用于在CMP垫中产生原位凹槽的方法。 通常，用于制造原位槽的方法包括将硅衬里图案化，将硅衬里放置在模具中或模具上，将CMP衬垫材料添加到硅衬里，并允许CMP垫固化的步骤。 还描述了包括新颖凹槽设计的CMP垫。 例如，这里描述的是包括同心圆形槽和轴向弯曲槽，反向对数槽，重叠圆形槽，拉索格，双螺旋槽和多重重叠的轴向曲线槽的CMP垫。 CMP垫可以由聚氨酯制成，并且其中产生的凹槽可以由以下方法制成：由硅胶衬里，激光书写，水射流切割，3-D印刷，热成型，真空成型，微接触印刷， 热冲压及其混合物。

公开(公告)号：US07377840B2

公开(公告)日：2008-05-27

申请号：US10897192

申请日：2004-07-21

申请人： Manish Deopura ,  Hem M. Vaidya ,  Pradip K. Roy

发明人： Manish Deopura ,  Hem M. Vaidya ,  Pradip K. Roy

IPC分类号： B24D11/00

CPC分类号： B24B37/26 ,  B24D15/04 ,  B24D18/0009 ,  B29C33/3842 ,  B29C33/405 ,  B29C33/424 ,  B29C33/565 ,  B29K2083/00 ,  B33Y80/00

摘要： Methods for producing in-situ grooves in CMP pads are provided. In general, the methods for producing in-situ grooves comprise the steps of patterning a silicone lining, placing the silicone lining in, or on, a mold, adding CMP pad material to the silicone lining, and allowing the CMP pad to solidify. CMP pads comprising novel groove designs are also described. For example, described here are CMP pads comprising concentric circular grooves and axially curved grooves, reverse logarithmic grooves, overlapping circular grooves, lassajous groves, double spiral grooves, and multiply overlapping axially curved grooves. The CMP pads may be made from polyurethane, and the grooves produced therein may be made by a method from the group consisting of silicone lining, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.

公开(公告)号：US20080211141A1

公开(公告)日：2008-09-04

申请号：US11998212

申请日：2007-11-28

申请人： Manish Deopura ,  Hem M. Vaidya ,  Pradip K. Roy

发明人： Manish Deopura ,  Hem M. Vaidya ,  Pradip K. Roy

IPC分类号： B29C39/02 ,  C08J5/00 ,  B29C39/26 ,  B29C41/46

CPC分类号： B24B37/26 ,  B24D15/04 ,  B24D18/0009 ,  B29C33/3842 ,  B29C33/405 ,  B29C33/424 ,  B29C33/565 ,  B29K2083/00 ,  B33Y80/00

摘要： Methods for producing in-situ grooves in CMP pads are provided. In general, the methods for producing in-situ grooves comprise the steps of patterning a silicone lining, placing the silicone lining in, or on, a mold, adding CMP pad material to the silicone lining, and allowing the CMP pad to solidify. CMP pads comprising novel groove designs are also described. For example, described here are CMP pads comprising concentric circular grooves and axially curved grooves, reverse logarithmic grooves, overlapping circular grooves, lassajous groves, double spiral grooves, and multiply overlapping axially curved grooves. The CMP pads may be made from polyurethane, and the grooves produced therein may be made by a method from the group consisting of silicone lining, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.

摘要翻译： 提供了用于在CMP垫中产生原位凹槽的方法。 通常，用于制造原位槽的方法包括将硅衬里图案化，将硅衬里放置在模具中或模具上，将CMP衬垫材料添加到硅衬里，并允许CMP垫固化的步骤。 还描述了包括新颖凹槽设计的CMP垫。 例如，这里描述的是包括同心圆形槽和轴向弯曲槽，反向对数槽，重叠圆形槽，拉索格，双螺旋槽和多重重叠的轴向曲线槽的CMP垫。 CMP垫可以由聚氨酯制成，并且其中产生的凹槽可以由以下方法制成：由硅胶衬里，激光书写，水射流切割，3-D印刷，热成型，真空成型，微接触印刷， 热冲压及其混合物。

公开(公告)号：US20150093977A1

公开(公告)日：2015-04-02

申请号：US14562589

申请日：2014-12-05

申请人： Manish Deopura ,  Hem M. Vaidya ,  Pradip K. Roy

发明人： Manish Deopura ,  Hem M. Vaidya ,  Pradip K. Roy

IPC分类号： B24B37/26

CPC分类号： B24B37/26 ,  B24D15/04 ,  B24D18/0009 ,  B29C33/3842 ,  B29C33/405 ,  B29C33/424 ,  B29C33/565 ,  B29K2083/00 ,  B33Y80/00

摘要： Methods for producing in-situ grooves in CMP pads are provided. In general, the methods for producing in-situ grooves comprise the steps of patterning a silicone lining, placing the silicone lining in, or on, a mold, adding CMP pad material to the silicone lining, and allowing the CMP pad to solidify. CMP pads comprising novel groove designs are also described. For example, described here are CMP pads comprising concentric circular grooves and axially curved grooves, reverse logarithmic grooves, overlapping circular grooves, lassajous groves, double spiral grooves, and multiply overlapping axially curved grooves. The CMP pads may be made from polyurethane, and the grooves produced therein may be made by a method from the group consisting of silicone lining, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.

摘要翻译： 提供了用于在CMP垫中产生原位凹槽的方法。 通常，用于制造原位槽的方法包括将硅衬里图案化，将硅衬里放置在模具中或模具上，将CMP衬垫材料添加到硅衬里，并允许CMP垫固化的步骤。 还描述了包括新颖凹槽设计的CMP垫。 例如，这里描述的是包括同心圆形槽和轴向弯曲槽，反向对数槽，重叠圆形槽，拉索格，双螺旋槽和多重重叠的轴向曲线槽的CMP垫。 CMP垫可以由聚氨酯制成，并且其中产生的凹槽可以由以下方法制成：由硅胶衬里，激光书写，水射流切割，3-D印刷，热成型，真空成型，微接触印刷， 热冲压及其混合物。