公开(公告)号：US20110026877A1

公开(公告)日：2011-02-03

申请号：US12843823

申请日：2010-07-26

申请人： Prasad YALAMANCHILI ,  Xiangdong QIU ,  Reddy RAJU ,  Jay A. SKIDMORE ,  Michael AU ,  Laura ZAVALA ,  Richard L. DUESTERBERG

发明人： Prasad YALAMANCHILI ,  Xiangdong QIU ,  Reddy RAJU ,  Jay A. SKIDMORE ,  Michael AU ,  Laura ZAVALA ,  Richard L. DUESTERBERG

IPC分类号： G02B6/122 ,  G02B6/13 ,  H01L21/00

CPC分类号： G02B6/423 ,  H01L2224/48465 ,  H01S5/02216 ,  H01S5/02252 ,  H01S5/02276 ,  H01S5/02284 ,  H01S5/02415 ,  H01S5/02476 ,  Y10T29/41

摘要： A fiber coupled semiconductor device having an improved optical stability with respect to temperature variation is disclosed. The stability improvement is achieved by placing the platform holding the semiconductor chip and the optical fiber onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Attaching the optical fiber to a vertical mounting surface of a fiber mount, and additionally attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device.

摘要翻译： 公开了一种相对于温度变化具有改善的光学稳定性的光纤耦合半导体器件。 通过将保持半导体芯片和光纤的平台放置在安装在基座上的间隔件上来实现稳定性提高。 间隔件的面积小于平台的面积，用于使基体的热引起的变形与半导体器件的平台的变形的机械解耦。 将光纤连接到光纤安装座的垂直安装表面，并且另外将光纤安装件附接到半导体芯片的基座上进一步提高了封装装置的热稳定性。