Range imaging devices and methods
    1.
    发明授权
    Range imaging devices and methods 有权
    范围成像设备和方法

    公开(公告)号:US09046359B2

    公开(公告)日:2015-06-02

    申请号:US13478902

    申请日:2012-05-23

    摘要: An array of laser diode emitters is used as an illumination source for a range imaging system. The laser diode emitters are disposed on a common substrate. When one of the emitters fails, the remaining emitters emit enough light to meet the output optical power specification. The emitters can be disposed with a tight spacing. The tight spacing facilitates packaging of the entire array into a compact single package on a common heat sink.

    摘要翻译: 激光二极管发射体阵列被用作范围成像系统的照明源。 激光二极管发射器设置在公共衬底上。 当其中一个发射器发生故障时,剩余的发射器发出足够的光以满足输出光功率规格。 发射器可以间隔很紧的位置。 紧密的间距有助于将整个阵列封装在公共散热器上的紧凑型单个封装中。

    Light emitting semiconductor device
    2.
    发明授权
    Light emitting semiconductor device 有权
    发光半导体器件

    公开(公告)号:US09036678B2

    公开(公告)日:2015-05-19

    申请号:US12844698

    申请日:2010-07-27

    摘要: A fiber coupled semiconductor device and a method of manufacturing of such a device are disclosed. The method provides an improved stability of optical coupling during assembly of the device, whereby a higher optical power levels and higher overall efficiency of the fiber coupled device can be achieved. The improvement is achieved by attaching the optical fiber to a vertical mounting surface of a fiber mount. The platform holding the semiconductor chip and the optical fiber can be mounted onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Optionally, attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device.

    摘要翻译: 公开了一种光纤耦合半导体器件及其制造方法。 该方法在组装装置期间提供了光耦合的改进的稳定性,由此可以实现光纤耦合器件的更高的光功率水平和更高的总体效率。 通过将光纤连接到光纤支架的垂直安装表面来实现改进。 保持半导体芯片和光纤的平台可以安装在安装在基座上的间隔件上。 间隔件的面积小于平台的面积,用于使基体的热引起的变形与半导体器件的平台的变形的机械解耦。 可选地,将光纤安装件附接到半导体芯片的基座上进一步提高了封装装置的热稳定性。

    HIGH-BRIGHTNESS SPATIAL-MULTIPLEXED MULTI-EMITTER PUMP WITH TILTED COLLIMATED BEAM
    3.
    发明申请
    HIGH-BRIGHTNESS SPATIAL-MULTIPLEXED MULTI-EMITTER PUMP WITH TILTED COLLIMATED BEAM 有权
    高亮度空间多功能多功能发射器泵与倾斜聚光束

    公开(公告)号:US20130148684A1

    公开(公告)日:2013-06-13

    申请号:US13313490

    申请日:2011-12-07

    IPC分类号: H01S5/022

    摘要: Multi-mode diode emitters are stacked in a staircase formation to provide a spatially-mulitplexed output. Improved coupling efficiency is achieved by providing tilted collimated output beams that determine an effective step height of the stepped structure. Since the effective step height is dependent on the tilt angle, a variable number of emitters can be used inside packages having a same physical step height, while still attaining high coupling efficiency.

    摘要翻译: 多模式二极管发射器堆叠在阶梯结构中以提供空间复合输出。 通过提供确定阶梯式结构的有效步长的倾斜的准直输出光束来实现改进的耦合效率。 由于有效步高取决于倾斜角度,所以在具有相同物理台阶高度的包装内可以使用可变数量的发射器,同时仍然获得高耦合效率。

    Polarization Maintaining Fiber Pigtail Assembly
    4.
    发明申请
    Polarization Maintaining Fiber Pigtail Assembly 有权
    保持光纤尾纤组装的极化

    公开(公告)号:US20080212916A1

    公开(公告)日:2008-09-04

    申请号:US11964530

    申请日:2007-12-26

    IPC分类号: G02B6/00

    摘要: The invention provides a fiber pigtail assembly wherein a polarization maintaining fiber is soldered directly to a mounting pad without a sleeve or a ferrule therebetween. A portion of the polarization maintaining fiber near a fiber end is embedded in a vertical slow axis orientation within an asymmetrical solder ball having a flat portion for adhering to the mounting pad. The vertical slow axis orientation of the polarization maintaining fiber within the solder ball enhances power stability and polarization extinction ratio properties of optical modules utilizing the invention.

    摘要翻译: 本发明提供了一种光纤尾纤组件,其中将保偏光纤直接焊接到安装焊盘,而不需要套筒或套圈。 在光纤端部附近的偏振保持光纤的一部分嵌入在具有平坦部分的不对称焊球内的垂直慢轴定向中,用于粘附到安装焊盘。 焊球内的偏振保持光纤的垂直慢轴定向提高了利用本发明的光学模块的功率稳定性和偏振消光比特性。

    Wavelength stabilized laser
    5.
    发明授权
    Wavelength stabilized laser 有权
    波长稳定的激光

    公开(公告)号:US07212554B2

    公开(公告)日:2007-05-01

    申请号:US10953798

    申请日:2004-09-29

    IPC分类号: H01S3/13

    摘要: A high power light source having an array, bundle or separate plurality of laser diodes coupled to a same number of multimode waveguides to collect beams of light emitted from the of laser diodes is provided. An optical combiner receives the beams of light and combines the beams of light into a single forward propagating beam of light so that substantially all optical radiation within each beam of light overlaps the optical radiation each other beam to form the single beam. A reflective element is located to receive the single forward propagating beam of light and transmits greater than 60% of the single forward propagating beam of light therethrough. The reflective element reflects between 3–40% of the single forward propagating beam back to the laser diodes as feedback to stabilize said laser diodes.

    摘要翻译: 提供了具有耦合到相同数量的多模波导的阵列,束或分离的多个激光二极管以收集从激光二极管发射的光束的高功率光源。 光学合成器接收光束并将光束组合成单个正向传播的光束,使得每个光束内的基本上所有的光学辐射彼此重叠,以形成单个光束。 反射元件被定位成接收单个正向传播的光束,并且透过大于60%的单个向前传播的光束。 反射元件将单向前传播光束的3-40%反射回激光二极管作为反馈以稳定所述激光二极管。

    Ruggedized microchannel-cooled laser diode array with self-aligned microlens
    7.
    发明授权
    Ruggedized microchannel-cooled laser diode array with self-aligned microlens 失效
    具有自对准微透镜的坚固的微通道冷却激光二极管阵列

    公开(公告)号:US06647035B1

    公开(公告)日:2003-11-11

    申请号:US09690932

    申请日:2000-10-17

    IPC分类号: H01S304

    摘要: A microchannel-cooled, optically corrected, laser diode array is fabricated by mounting laser diode bars onto Si surfaces. This approach allows for the highest thermal impedance, in a ruggedized, low-cost assembly that includes passive microlens attachment without the need for lens frames. The microlensed laser diode array is usable in all solid-state laser systems that require efficient, directional, narrow bandwidth, high optical power density pump sources.

    摘要翻译: 通过将激光二极管棒安装到Si表面上来制造微通道冷却的光学校正的激光二极管阵列。 这种方法允许在加固的低成本组件中实现最高的热阻抗,其包括无源微透镜附件而不需要透镜框架。 微型激光二极管阵列可用于需要高效,方向,窄带宽,高光功率密度泵浦源的所有固态激光系统。

    Beam combining light source
    9.
    发明授权
    Beam combining light source 有权
    光束组合光源

    公开(公告)号:US08427749B2

    公开(公告)日:2013-04-23

    申请号:US12827946

    申请日:2010-06-30

    IPC分类号: G02B27/14

    摘要: The invention relates to sources of optical radiation wherein polarized radiation from first and second rows of light emitters is first collimated and combined into two combined beam using first and second rows of collimating and beam re-directing elements, respectively, and then polarization multiplexed to form a polarization-multiplexed output beam. In order to reduce the footprint, emitters of the first and second emitter rows are disposed in an interleaved, staggered arrangement, and the second row of collimating and beam re-directing elements is disposed in a space between the first emitter row and the first row of collimating and beam re-directing elements.

    摘要翻译: 本发明涉及光辐射源,其中来自第一和第二排发光体的偏振辐射首先被准直并且分别使用第一和第二行准直和光束重定向元件组合成两个组合光束,然后被极化复用形成 偏振复用输出光束。 为了减小占空比,第一和第二发射器行的发射器以交错的交错排列布置,并且第二排准直和光束重新引导元件设置在第一发射极行和第一行之间的空间中 的准直和光束重新定向元件。

    HIGH POWER SURFACE MOUNT TECHNOLOGY PACKAGE FOR SIDE EMITTING LASER DIODE
    10.
    发明申请
    HIGH POWER SURFACE MOUNT TECHNOLOGY PACKAGE FOR SIDE EMITTING LASER DIODE 有权
    高功率表面安装技术包装用于侧发射激光二极管

    公开(公告)号:US20130022069A1

    公开(公告)日:2013-01-24

    申请号:US13554319

    申请日:2012-07-20

    IPC分类号: H01S3/09

    摘要: The present invention relates to the packaging of high power laser(s) in a surface mount technology (SMT) configuration at low-cost using wafer-scale processing. A reflective sidewall is used to redirect the output emission from edge-emitting lasers through an optical element (e.g., a diffuser, lens, etc.). A common electrical pad centered inside the package provides p-side connection to multiple laser diodes (i.e. for power scalability). Thick plating (e.g. 75 um to 125 um) with a heat and electrically conductive material, e.g. copper, on a raised bonding area of a substrate provides good heat dissipation and spreading to the substrate layer during operation. The composite CTE of the substrate layer, e.g. AlN, and the heat/electrical conductive plating, e.g. Cu, substantially matches well with the laser substrates, e.g. GaAs-based, without the requirement for an additional submount.

    摘要翻译: 本发明涉及使用晶片级处理以低成本的表面贴装技术(SMT)配置中的大功率激光器的封装。 反射侧壁用于重定向来自边缘发射激光器的输出发射通过光学元件(例如漫射器,透镜等)。 在封装内集中的通用电焊盘提供与多个激光二极管的p侧连接(即用于功率可伸缩性)。 厚电镀(例如75μm至125μm)与热和导电材料,例如。 在衬底的凸起接合区域上的铜在操作期间提供良好的散热和扩散到衬底层。 衬底层的复合CTE,例如, AlN,以及导热电镀,例如, Cu,基本上与激光基板匹配,例如。 基于GaAs,不需要额外的基座。