公开(公告)号：US20110026877A1

公开(公告)日：2011-02-03

申请号：US12843823

申请日：2010-07-26

申请人： Prasad YALAMANCHILI ,  Xiangdong QIU ,  Reddy RAJU ,  Jay A. SKIDMORE ,  Michael AU ,  Laura ZAVALA ,  Richard L. DUESTERBERG

发明人： Prasad YALAMANCHILI ,  Xiangdong QIU ,  Reddy RAJU ,  Jay A. SKIDMORE ,  Michael AU ,  Laura ZAVALA ,  Richard L. DUESTERBERG

IPC分类号： G02B6/122 ,  G02B6/13 ,  H01L21/00

CPC分类号： G02B6/423 ,  H01L2224/48465 ,  H01S5/02216 ,  H01S5/02252 ,  H01S5/02276 ,  H01S5/02284 ,  H01S5/02415 ,  H01S5/02476 ,  Y10T29/41

摘要： A fiber coupled semiconductor device having an improved optical stability with respect to temperature variation is disclosed. The stability improvement is achieved by placing the platform holding the semiconductor chip and the optical fiber onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Attaching the optical fiber to a vertical mounting surface of a fiber mount, and additionally attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device.

摘要翻译： 公开了一种相对于温度变化具有改善的光学稳定性的光纤耦合半导体器件。 通过将保持半导体芯片和光纤的平台放置在安装在基座上的间隔件上来实现稳定性提高。 间隔件的面积小于平台的面积，用于使基体的热引起的变形与半导体器件的平台的变形的机械解耦。 将光纤连接到光纤安装座的垂直安装表面，并且另外将光纤安装件附接到半导体芯片的基座上进一步提高了封装装置的热稳定性。

公开(公告)号：US20110026558A1

公开(公告)日：2011-02-03

申请号：US12844698

申请日：2010-07-27

申请人： Reddy RAJU ,  Richard L. Duesterberg ,  Jay A. Skidmore ,  Prasad Yalamanchili ,  Xiangdong Qiu

发明人： Reddy RAJU ,  Richard L. Duesterberg ,  Jay A. Skidmore ,  Prasad Yalamanchili ,  Xiangdong Qiu

IPC分类号： H01S5/026 ,  H01L21/50

CPC分类号： G02B6/423 ,  H01L2224/48465 ,  H01S5/02216 ,  H01S5/02252 ,  H01S5/02276 ,  H01S5/02284 ,  H01S5/02415 ,  H01S5/02476 ,  Y10T29/41

摘要： A fiber coupled semiconductor device and a method of manufacturing of such a device are disclosed. The method provides an improved stability of optical coupling during assembly of the device, whereby a higher optical power levels and higher overall efficiency of the fiber coupled device can be achieved. The improvement is achieved by attaching the optical fiber to a vertical mounting surface of a fiber mount. The platform holding the semiconductor chip and the optical fiber can be mounted onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Optionally, attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device.

摘要翻译： 公开了一种光纤耦合半导体器件及其制造方法。 该方法在组装装置期间提供了光耦合的改进的稳定性，由此可以实现光纤耦合器件的更高的光功率水平和更高的总体效率。 通过将光纤连接到光纤支架的垂直安装表面来实现改进。 保持半导体芯片和光纤的平台可以安装在安装在基座上的间隔件上。 间隔件的面积小于平台的面积，用于使基体的热引起的变形与半导体器件的平台的变形的机械解耦。 可选地，将光纤安装件附接到半导体芯片的基座上进一步提高了封装装置的热稳定性。