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    Light emitting semiconductor device
    1.
    发明授权
    Light emitting semiconductor device 有权
    发光半导体器件

    公开(公告)号：US09036678B2

    公开(公告)日：2015-05-19

    申请号：US12844698

    申请日：2010-07-27

    申请人： Reddy Raju ,  Richard L. Duesterberg ,  Jay A. Skidmore ,  Prasad Yalamanchili ,  Xiangdong Qiu

    发明人： Reddy Raju ,  Richard L. Duesterberg ,  Jay A. Skidmore ,  Prasad Yalamanchili ,  Xiangdong Qiu

    IPC分类号： H01S3/08 ,  G02B6/42 ,  H01S5/022 ,  H01S5/024

    CPC分类号： G02B6/423 ,  H01L2224/48465 ,  H01S5/02216 ,  H01S5/02252 ,  H01S5/02276 ,  H01S5/02284 ,  H01S5/02415 ,  H01S5/02476 ,  Y10T29/41

    摘要： A fiber coupled semiconductor device and a method of manufacturing of such a device are disclosed. The method provides an improved stability of optical coupling during assembly of the device, whereby a higher optical power levels and higher overall efficiency of the fiber coupled device can be achieved. The improvement is achieved by attaching the optical fiber to a vertical mounting surface of a fiber mount. The platform holding the semiconductor chip and the optical fiber can be mounted onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Optionally, attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device.

    摘要翻译： 公开了一种光纤耦合半导体器件及其制造方法。 该方法在组装装置期间提供了光耦合的改进的稳定性，由此可以实现光纤耦合器件的更高的光功率水平和更高的总体效率。 通过将光纤连接到光纤支架的垂直安装表面来实现改进。 保持半导体芯片和光纤的平台可以安装在安装在基座上的间隔件上。 间隔件的面积小于平台的面积，用于使基体的热引起的变形与半导体器件的平台的变形的机械解耦。 可选地，将光纤安装件附接到半导体芯片的基座上进一步提高了封装装置的热稳定性。

    Optical module with fiber feedthrough
    2.
    发明授权
    Optical module with fiber feedthrough 有权
    带光纤馈通光模块

    公开(公告)号：US08215850B2

    公开(公告)日：2012-07-10

    申请号：US12648580

    申请日：2009-12-29

    申请人： Prasad Yalamanchili ,  Xiangdong Qiu ,  Reddy Raju ,  Jihua Du

    发明人： Prasad Yalamanchili ,  Xiangdong Qiu ,  Reddy Raju ,  Jihua Du

    IPC分类号： G02B6/36 ,  G02B6/42

    CPC分类号： G02B6/4248

    摘要： A molded ceramic or glass ferrule has at least one longitudinal passage, which enables an optical fiber feed through, sealed into a metal housing with glass solder. The metal material in the housing has a slightly higher coefficient of thermal expansion (CTE) than the ferrule material and the sealing glass so that hermetic seal is maintained by a compression stress applied to the ferrule and sealing glass by the housing at operating conditions. When the housing has to be fabricated from a low CTE material, e.g. metal or ceramic, a metal sleeve and stress relief bracket is used to apply the compression stress.

    摘要翻译： 模制的陶瓷或玻璃套圈具有至少一个纵向通道，其使得光纤馈送通过玻璃焊料密封到金属外壳中。 壳体中的金属材料比套圈材料和密封玻璃具有略高的热膨胀系数（CTE），使得在工作条件下，通过壳体施加到套圈和密封玻璃的压缩应力来保持气密密封。 当壳体必须由低CTE材料制成时，例如， 金属或陶瓷，金属套筒和应力消除支架用于施加压缩应力。

    OPTICAL MODULE WITH FIBER FEEDTHROUGH
    7.
    发明申请
    OPTICAL MODULE WITH FIBER FEEDTHROUGH 有权
    具有光纤的光学模块

    公开(公告)号：US20110158594A1

    公开(公告)日：2011-06-30

    申请号：US12648580

    申请日：2009-12-29

    申请人： Prasad YALAMANCHILI ,  Xiangdong Qiu ,  Reddy Raju ,  Jihua Du

    发明人： Prasad YALAMANCHILI ,  Xiangdong Qiu ,  Reddy Raju ,  Jihua Du

    IPC分类号： G02B6/36 ,  B32B37/12 ,  B32B37/02

    CPC分类号： G02B6/4248

    摘要： A molded ceramic or glass ferrule has at least one longitudinal passage, which enables an optical fiber feed through, sealed into a metal housing with glass solder. The metal material in the housing has a slightly higher coefficient of thermal expansion (CTE) than the ferrule material and the sealing glass so that hermetic seal is maintained by a compression stress applied to the ferrule and sealing glass by the housing at operating conditions. When the housing has to be fabricated from a low CTE material, e.g. metal or ceramic, a metal sleeve and stress relief bracket is used to apply the compression stress.

    摘要翻译： 模制的陶瓷或玻璃套圈具有至少一个纵向通道，其使得光纤馈送通过玻璃焊料密封到金属外壳中。 壳体中的金属材料比套圈材料和密封玻璃具有略高的热膨胀系数（CTE），使得在工作条件下，通过壳体施加到套圈和密封玻璃的压缩应力来保持气密密封。 当壳体必须由低CTE材料制成时，例如， 金属或陶瓷，金属套筒和应力消除支架用于施加压缩应力。

    LIGHT EMITTING SEMICONDUCTOR DEVICE
    8.
    发明申请
    LIGHT EMITTING SEMICONDUCTOR DEVICE 有权
    发光半导体器件

    公开(公告)号：US20110026558A1

    公开(公告)日：2011-02-03

    申请号：US12844698

    申请日：2010-07-27

    申请人： Reddy RAJU ,  Richard L. Duesterberg ,  Jay A. Skidmore ,  Prasad Yalamanchili ,  Xiangdong Qiu

    发明人： Reddy RAJU ,  Richard L. Duesterberg ,  Jay A. Skidmore ,  Prasad Yalamanchili ,  Xiangdong Qiu

    IPC分类号： H01S5/026 ,  H01L21/50

    CPC分类号： G02B6/423 ,  H01L2224/48465 ,  H01S5/02216 ,  H01S5/02252 ,  H01S5/02276 ,  H01S5/02284 ,  H01S5/02415 ,  H01S5/02476 ,  Y10T29/41

    摘要： A fiber coupled semiconductor device and a method of manufacturing of such a device are disclosed. The method provides an improved stability of optical coupling during assembly of the device, whereby a higher optical power levels and higher overall efficiency of the fiber coupled device can be achieved. The improvement is achieved by attaching the optical fiber to a vertical mounting surface of a fiber mount. The platform holding the semiconductor chip and the optical fiber can be mounted onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Optionally, attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device.

    摘要翻译： 公开了一种光纤耦合半导体器件及其制造方法。 该方法在组装装置期间提供了光耦合的改进的稳定性，由此可以实现光纤耦合器件的更高的光功率水平和更高的总体效率。 通过将光纤连接到光纤支架的垂直安装表面来实现改进。 保持半导体芯片和光纤的平台可以安装在安装在基座上的间隔件上。 间隔件的面积小于平台的面积，用于使基体的热引起的变形与半导体器件的平台的变形的机械解耦。 可选地，将光纤安装件附接到半导体芯片的基座上进一步提高了封装装置的热稳定性。