公开(公告)号：US20130286595A1

公开(公告)日：2013-10-31

申请号：US13681409

申请日：2012-11-19

Applicant: QUALCOMM INCORPORATED

Inventor： Durodami J. Lisk ,  Victor A. Chiriac ,  Ratibor Rakojcic

IPC: H05K13/00 ,  H05K7/20

CPC classification number: H05K13/00 ,  H01L23/36 ,  H01L23/433 ,  H01L25/0657 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/00014 ,  H05K7/2039 ,  Y10T29/49124 ,  H01L2224/0401

Abstract: A first tier die is provided having a thermal management floorplan with a heat region having an area for thermal coupling to a heat sink, a second tier die is provided, shaped and dimensioned to be stackable into a multi-tier stack with the first tier die and, when stacked in the multi-tier stack, to not substantially overlap the heat region. A heat sink is provided, and a thermal coupling element, the heat sink, a stack having the first tier die and the second tier die, and the heat sink are arranged to form the multi-tier stacked integrated circuit. In the arrangement, the thermal coupling element is located to form a thermal path from the heat region of the first tier die to the heat sink.

Abstract translation: 提供具有热管理平面布局的第一层模具，其具有热区域，该热区域具有用于热耦合到散热器的区域，第二层模具被提供成形并且尺寸设计成能够与第一层模具堆叠成多层堆叠 并且当堆叠在多层堆叠中时，基本不与热区域重叠。 提供散热器，并且布置热耦合元件，散热器，具有第一层管芯和第二层管芯的堆叠以及散热器，以形成多层堆叠集成电路。 在该布置中，热耦合元件被定位成形成从第一层模具的热区域到散热器的热路径。