公开(公告)号：US20140252645A1

公开(公告)日：2014-09-11

申请号：US13787476

申请日：2013-03-06

Applicant: QUALCOMM INCORPORATED

Inventor： Dong Wook Kim ,  Victor A. Chiriac ,  Kyu-Pyung Hwang ,  Changhan Yun ,  Young K. Song

IPC: H01L23/34

CPC classification number: H01L23/34 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5389 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/00

Abstract: Some implementations provide a semiconductor package structure that includes a package substrate, a first package, an interposer coupled to the first package, and a first set of through via insert (TVI). The first set of TVI is coupled to the interposer and the package substrate. The first set of TVI is configured to provide heat dissipation from the first package. In some implementations, the semiconductor package structure further includes a heat spreader coupled to the interposer. The heat spreader is configured to dissipate heat from the first package. In some implementations, the first set of TVI is further configured to provide an electrical path between the first package and the package substrate. In some implementations, the first package is electrically coupled to the package substrate through the interposer and the first set of TVI. In some implementations, the first set of TVI includes a dielectric layer and a metal layer.

Abstract translation: 一些实施方案提供半导体封装结构，其包括封装衬底，第一封装，耦合到第一封装的插入器和第一组通孔插入件（TVI）。 第一组TVI耦合到插入器和封装衬底。 第一组TVI配置为提供第一包装散热。 在一些实施方案中，半导体封装结构还包括耦合到插入件的散热器。 散热器被配置为从第一包装散发热量。 在一些实施方式中，第一组TVI被进一步配置成在第一封装和封装衬底之间提供电路径。 在一些实施方案中，第一封装通过插入器和第一组TVI电耦合到封装衬底。 在一些实施方案中，第一组TVI包括电介质层和金属层。

公开(公告)号：US20130286595A1

公开(公告)日：2013-10-31

申请号：US13681409

申请日：2012-11-19

Applicant: QUALCOMM INCORPORATED

Inventor： Durodami J. Lisk ,  Victor A. Chiriac ,  Ratibor Rakojcic

IPC: H05K13/00 ,  H05K7/20

CPC classification number: H05K13/00 ,  H01L23/36 ,  H01L23/433 ,  H01L25/0657 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/00014 ,  H05K7/2039 ,  Y10T29/49124 ,  H01L2224/0401

Abstract: A first tier die is provided having a thermal management floorplan with a heat region having an area for thermal coupling to a heat sink, a second tier die is provided, shaped and dimensioned to be stackable into a multi-tier stack with the first tier die and, when stacked in the multi-tier stack, to not substantially overlap the heat region. A heat sink is provided, and a thermal coupling element, the heat sink, a stack having the first tier die and the second tier die, and the heat sink are arranged to form the multi-tier stacked integrated circuit. In the arrangement, the thermal coupling element is located to form a thermal path from the heat region of the first tier die to the heat sink.

Abstract translation: 提供具有热管理平面布局的第一层模具，其具有热区域，该热区域具有用于热耦合到散热器的区域，第二层模具被提供成形并且尺寸设计成能够与第一层模具堆叠成多层堆叠 并且当堆叠在多层堆叠中时，基本不与热区域重叠。 提供散热器，并且布置热耦合元件，散热器，具有第一层管芯和第二层管芯的堆叠以及散热器，以形成多层堆叠集成电路。 在该布置中，热耦合元件被定位成形成从第一层模具的热区域到散热器的热路径。

公开(公告)号：US09148979B2

公开(公告)日：2015-09-29

申请号：US13706492

申请日：2012-12-06

Applicant: QUALCOMM Incorporated

Inventor： Victor A. Chiriac ,  Dexter T. Chun

IPC: H05K7/20 ,  G06F1/20 ,  H05K13/04 ,  H01L23/473

CPC classification number: H05K7/20436 ,  G06F1/203 ,  G06F1/206 ,  G06F2200/203 ,  H05K13/04 ,  Y10T29/49117

Abstract: Some implementations provide a folding electronic device that includes a base portion, a cover portion and a coupler. The base portion includes a region configured to generate heat. The cover portion includes a display screen, a heat dissipating component, and a thermally insulating component. The heat dissipating component is coplanar to the display screen. The thermally insulating component is coplanar to the display screen. The thermally insulating component is located between the display screen and the heat dissipating component. The coupler is for thermally coupling the base portion to the cover portion. The coupler includes a first component and a second component. The first component is coupled to the region configured to generate heat. The second component is coupled to the heat dissipating component of the cover portion. The coupler provides a path for transferring heat.

Abstract translation: 一些实施方案提供一种折叠电子设备，其包括基部，盖部分和耦合器。 基部包括被配置为产生热量的区域。 盖部分包括显示屏，散热部件和隔热部件。 散热部件与显示屏共面。 隔热部件与显示屏共面。 隔热部件位于显示屏和散热部件之间。 联接器用于将基部热耦合到盖部分。 耦合器包括第一部件和第二部件。 第一部件耦合到被配置为产生热量的区域。 第二部件耦合到盖部分的散热部件。 耦合器提供传递热量的路径。

公开(公告)号：US20140098489A1

公开(公告)日：2014-04-10

申请号：US13706492

申请日：2012-12-06

Applicant: QUALCOMM INCORPORATED

Inventor： Victor A. Chiriac ,  Dexter T. Chun

IPC: H05K7/20 ,  H05K13/04 ,  G06F1/20

CPC classification number: H05K7/20436 ,  G06F1/203 ,  G06F1/206 ,  G06F2200/203 ,  H05K13/04 ,  Y10T29/49117

Abstract: Some implementations provide a folding electronic device that includes a base portion, a cover portion and a coupler. The base portion includes a region configured to generate heat. The cover portion includes a display screen, a heat dissipating component, and a thermally insulating component. The heat dissipating component is coplanar to the display screen. The thermally insulating component is coplanar to the display screen. The thermally insulating component is located between the display screen and the heat dissipating component. The coupler is for thermally coupling the base portion to the cover portion. The coupler includes a first component and a second component. The first component is coupled to the region configured to generate heat. The second component is coupled to the heat dissipating component of the cover portion. The coupler provides a path for transferring heat.

Abstract translation: 一些实施方案提供一种折叠电子设备，其包括基部，盖部分和耦合器。 基部包括被配置为产生热量的区域。 盖部分包括显示屏，散热部件和隔热部件。 散热部件与显示屏共面。 隔热部件与显示屏共面。 隔热部件位于显示屏和散热部件之间。 联接器用于将基部热耦合到盖部分。 耦合器包括第一部件和第二部件。 第一部件耦合到被配置为产生热量的区域。 第二部件耦合到盖部分的散热部件。 耦合器提供传递热量的路径。