公开(公告)号：US20230253400A1

公开(公告)日：2023-08-10

申请号：US17650233

申请日：2022-02-07

Applicant: QUALCOMM Incorporated

Inventor： Bruce LEE ,  Chandra Satya Priyanka TIRUPATHI ,  Liang DAI ,  Dinesh Jagannath ALLADI

IPC: H01L27/07 ,  H01L27/08

CPC classification number: H01L27/0733 ,  H01L27/0805

Abstract: A device includes a first plurality of MEOL interconnects coupled to a second node that extends in a first direction. The first plurality of MEOL interconnects includes first and second subsets of MEOL second-terminal interconnects. The device includes a second plurality of MEOL interconnects coupled to a first node that extends in the first direction. The second plurality of MEOL interconnects includes first and second subsets of MEOL first-terminal interconnects. The first subsets of MEOL first-terminal and second-terminal interconnects are interleaved and are a first subset of interleaved MEOL interconnects. The second subsets of MEOL first-terminal and second-terminal interconnects are interleaved and are a second subset of interleaved MEOL interconnects. The device includes at least one of a first plurality of gate interconnects or a first plurality of OD regions extending in a second direction orthogonal to the first direction between the first and second subsets of interleaved MEOL interconnects.