公开(公告)号：US20170086295A1

公开(公告)日：2017-03-23

申请号：US14859320

申请日：2015-09-20

Applicant: QUALCOMM Incorporated

Inventor： Mete ERTURK ,  Farsheed MAHMOUDI ,  James Thomas DOYLE ,  Ravindra Vaman SHENOY ,  Jitae KIM

IPC: H05K1/16 ,  H05K1/11 ,  H05K3/40 ,  H05K3/30

Abstract: An integrated circuit device, such as a system-on-a-chip (SOC) device that includes an integrated or embedded voltage regulator, comprises an integrated capacitor and an integrated inductor having a magnetic core that can be fabricated in the same process as the capacitive structure of the integrated capacitor.

公开(公告)号：US20180045580A1

公开(公告)日：2018-02-15

申请号：US15675604

申请日：2017-08-11

Applicant: QUALCOMM Incorporated

Inventor： Ali Akbar MERRIKH ,  Farsheed MAHMOUDI ,  Mehdi SAEIDI ,  Evan Bentley FLEMING

IPC: G01K7/02

CPC classification number: G01K7/021 ,  G01K1/026 ,  G01K7/02 ,  G01K7/028 ,  G01K7/04 ,  G01K2003/145 ,  G01K2213/00 ,  G01K2217/00 ,  G06F17/12 ,  G06F17/16

Abstract: A semiconductor device may include a semiconductor die having an active region. The semiconductor device may also include a thermocouple mesh proximate to the active region. The thermocouple mesh may include a first set of wires of a first material extending in a first direction, and a second set of wires of a second material. The second material may be different from the first material. In addition, the second set of wires may extend in a second direction different than the first direction of the first wires.