公开(公告)号：US20180283959A1

公开(公告)日：2018-10-04

申请号：US15474914

申请日：2017-03-30

Applicant: QUALCOMM Incorporated

Inventor： Rama Rao GORUGANTHU ,  Ali Akbar MERRIKH

IPC: G01J5/10 ,  G01J5/08 ,  G01J5/02 ,  G01J5/06

CPC classification number: G01J5/10 ,  G01J5/025 ,  G01J5/061 ,  G01J5/0806 ,  G01J5/0809 ,  G01J2005/106

Abstract: An apparatus is disclosed that comprises an integrated circuit and a thermal detector array configured to detect thermal radiation from the integrated circuit. A method is disclosed that comprises providing an integrated circuit and disposing a thermal detector array so as to detect thermal radiation from the integrated circuit. Another apparatus is disclosed that comprises means for processing and means for detecting thermal radiation from the means for processing.

公开(公告)号：US20180045580A1

公开(公告)日：2018-02-15

申请号：US15675604

申请日：2017-08-11

Applicant: QUALCOMM Incorporated

Inventor： Ali Akbar MERRIKH ,  Farsheed MAHMOUDI ,  Mehdi SAEIDI ,  Evan Bentley FLEMING

IPC: G01K7/02

CPC classification number: G01K7/021 ,  G01K1/026 ,  G01K7/02 ,  G01K7/028 ,  G01K7/04 ,  G01K2003/145 ,  G01K2213/00 ,  G01K2217/00 ,  G06F17/12 ,  G06F17/16

Abstract: A semiconductor device may include a semiconductor die having an active region. The semiconductor device may also include a thermocouple mesh proximate to the active region. The thermocouple mesh may include a first set of wires of a first material extending in a first direction, and a second set of wires of a second material. The second material may be different from the first material. In addition, the second set of wires may extend in a second direction different than the first direction of the first wires.

公开(公告)号：US20180220553A1

公开(公告)日：2018-08-02

申请号：US15423474

申请日：2017-02-02

Applicant: QUALCOMM Incorporated

Inventor： Mehdi SAEIDI ,  Ali Akbar MERRIKH ,  Melika ROSHANDELL

IPC: H05K7/20 ,  H01L23/427

CPC classification number: H05K7/20309 ,  G06F1/203 ,  G06F2200/201 ,  H01L23/427 ,  H05K1/0209 ,  H05K7/20327 ,  H05K7/20409 ,  H05K2201/0323

Abstract: An apparatus and method of the disclosure provides a cooling mechanism for a handheld electronic device. The cooling mechanism includes a heat sink and an evaporative cooling mechanism. The evaporative cooling mechanism includes liquid retaining structures. The liquid retaining structures are located in proximity to the at least one IC of the handheld electronic device. Each liquid retaining structure is coated with a temperature sensitive polymer that act as hydrophilic when the temperature of the surface of the handheld electronic device is below a threshold temperature. To maintain the temperature of the surface of the handheld electronic device below the threshold temperature, the temperature sensitive polymer act as hydrophobic and evaporates the liquid stored in the liquid retaining structures to the atmosphere surrounding the handheld electronic device when the temperature of the surface of the electronic device is above the threshold temperature.

公开(公告)号：US20180066998A1

公开(公告)日：2018-03-08

申请号：US15260194

申请日：2016-09-08

Applicant: QUALCOMM Incorporated

Inventor： Ali Akbar MERRIKH ,  Martin SAINT-LAURENT ,  Mohammad GHASEMAZAR ,  Rajit CHANDRA ,  Mohamed ALLAM

IPC: G01K1/20 ,  G01K15/00 ,  G01K1/14 ,  G01K7/01

CPC classification number: G01K1/20 ,  G01K1/14 ,  G01K7/01 ,  G01K7/427 ,  G01K15/005 ,  G06F1/206 ,  Y02D10/16

Abstract: A temperature sensor position offset error correction power implementation include monitors (e.g., digital power monitor/meter) to measure activity on a die, and uses the activity measurements to compute real-time temperature offsets by converting activity to power, which can be used in a simplified compact thermal model. A system on chip including the die receives a temperature measurement of a region of the system on chip from a sensor. Power consumed by the region is estimated based on the measured activity, and temperature measurement of the system on chip is adjusted based on the estimated power.