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公开(公告)号：US20170086295A1
公开(公告)日：2017-03-23
申请号：US14859320
申请日：2015-09-20
Applicant: QUALCOMM Incorporated
Inventor： Mete ERTURK , Farsheed MAHMOUDI , James Thomas DOYLE , Ravindra Vaman SHENOY , Jitae KIM
Abstract: An integrated circuit device, such as a system-on-a-chip (SOC) device that includes an integrated or embedded voltage regulator, comprises an integrated capacitor and an integrated inductor having a magnetic core that can be fabricated in the same process as the capacitive structure of the integrated capacitor.
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2.发明申请公开(公告)号：US20160163443A1
公开(公告)日：2016-06-09
申请号：US14743623
申请日：2015-06-18
Applicant: QUALCOMM Incorporated
Inventor： Mete ERTURK , Ravindra Vaman SHENOY , Kwan-yu LAI , Jitae KIM , Donald William KIDWELL JR. , Jon Bradley LASITER , James Thomas DOYLE , Omar James BCHIR
CPC classification number: H01F27/2804 , H01F1/14708 , H01F5/00 , H01F17/0033 , H01F27/24 , H01F41/02 , H01F41/046 , H01F41/14 , H01F2017/002 , H01F2017/0066 , H01F2027/2809 , H01L23/49822 , H01L23/642 , H01L23/645 , H01L24/16 , H01L2224/16227 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/19041 , H05K1/111 , H05K1/165 , H05K1/182 , H05K2201/10166 , H01L2924/0002 , H01L2924/00
Abstract: An inductor can include a first substrate, a magnetic piece, and a conductor. The first substrate can be formed within a second substrate. The magnetic piece can be connected to a first side of the first substrate. The conductor can be formed within the second substrate, on the second substrate, or both. The conductor can have an input and an output. The conductor can be configured to surround the first substrate without being in contact with the first substrate and without being in contact with the magnetic piece.
Abstract translation: 电感器可以包括第一衬底，磁片和导体。 第一基板可以形成在第二基板内。 磁片可以连接到第一衬底的第一侧。 导体可以形成在第二基板内，第二基板上，或两者上。 导体可以具有输入和输出。 导体可以被配置为围绕第一基板而不与第一基板接触并且不与磁片接触。
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