公开(公告)号：US09939328B2

公开(公告)日：2018-04-10

申请号：US14656706

申请日：2015-03-12

Applicant: QUALCOMM Incorporated

Inventor： Charles Keith Bachand ,  Scott James Lemke ,  Ambarish Mukund Sule ,  Mohammad Ghasemazar ,  Osvaldo Franco

IPC: G01K1/02 ,  G01K3/00

CPC classification number: G01K1/026 ,  G01K3/00

Abstract: Some examples of the disclosure are directed to systems, apparatus, and methods for temperature detection using multiple temperature controllers each having distributed temperature sensors that allow reading multiple sensor outputs in parallel for a wide range of covered area. The temperature controller may also have logic to calculate a local temperature controller maximum temperature, a maximum temperature of all sensors, provide software access to each sensor, easy software enablement through a software interface that allows access earlier than when chip operating system (OS) is booted, and the ability to enable and mask individual sensors or sensor groups through software.

公开(公告)号：US10401236B2

公开(公告)日：2019-09-03

申请号：US15163215

申请日：2016-05-24

Applicant: QUALCOMM Incorporated

Inventor： Mohammad Ghasemazar ,  Mohammad Meysam Zargham

IPC: G01K15/00 ,  G01D3/024 ,  G01D3/10

Abstract: Apparatuses are presented. The apparatus includes a sensor configured with an adjustable accuracy setting to measure a physical parameter and a controller configured to adjust the accuracy setting based on a threshold, and to adjust the threshold based on the physical parameter measured by the sensor. Another apparatus includes a sensor configured with a plurality of sensor accuracy settings to measure a physical parameter of a circuit in a plurality of operating regions. The plurality of operating regions is based on ranges of the physical parameter measured by the sensor. Each of the plurality of sensor accuracy settings corresponds to one of the plurality of operating regions. A controller is configured to adjust one of the ranges of the physical parameter for one of the plurality of operating regions, in response to a change of an operating condition of the circuit.

公开(公告)号：US10309838B2

公开(公告)日：2019-06-04

申请号：US15260194

申请日：2016-09-08

Applicant: QUALCOMM Incorporated

Inventor： Ali Akbar Merrikh ,  Martin Saint-Laurent ,  Mohammad Ghasemazar ,  Rajit Chandra ,  Mohamed Allam

IPC: G01K1/20 ,  G01K1/14 ,  G01K7/01 ,  G01K7/42 ,  G06F1/20 ,  G01K15/00

Abstract: A temperature sensor position offset error correction power implementation include monitors (e.g., digital power monitor/meter) to measure activity on a die, and uses the activity measurements to compute real-time temperature offsets by converting activity to power, which can be used in a simplified compact thermal model. A system on chip including the die receives a temperature measurement of a region of the system on chip from a sensor. Power consumed by the region is estimated based on the measured activity, and temperature measurement of the system on chip is adjusted based on the estimated power.