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公开(公告)号：US09692448B1
公开(公告)日：2017-06-27
申请号：US15273621
申请日：2016-09-22
Applicant: QUALCOMM Incorporated
Inventor： Xiaohua Kong , Mohamed Allam , Esin Terzioglu , Jose Gilberto Corleto Mena
CPC classification number: H03M9/00 , G05F3/16 , H01L25/18 , H04L7/0008
Abstract: An SoC integrated circuit package is provided in which the analog components of a SerDes for an SoC die in the SoC integrated circuit package are segregated into a SerDes interface die in the SoC integrated circuit package.
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公开(公告)号：US10309838B2
公开(公告)日：2019-06-04
申请号：US15260194
申请日：2016-09-08
Applicant: QUALCOMM Incorporated
Inventor： Ali Akbar Merrikh , Martin Saint-Laurent , Mohammad Ghasemazar , Rajit Chandra , Mohamed Allam
Abstract: A temperature sensor position offset error correction power implementation include monitors (e.g., digital power monitor/meter) to measure activity on a die, and uses the activity measurements to compute real-time temperature offsets by converting activity to power, which can be used in a simplified compact thermal model. A system on chip including the die receives a temperature measurement of a region of the system on chip from a sensor. Power consumed by the region is estimated based on the measured activity, and temperature measurement of the system on chip is adjusted based on the estimated power.
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