公开(公告)号：US10153556B2

公开(公告)日：2018-12-11

申请号：US15398959

申请日：2017-01-05

Applicant: QUALCOMM Incorporated

Inventor： Elimelech Ganchrow ,  Ofer Markish ,  Iddo Diukman ,  Alon Yehezkely

IPC: H01Q9/28 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q19/30 ,  H01Q1/48 ,  H01Q1/50 ,  H01Q15/02

Abstract: A printed millimeter wave dipole antenna and techniques for designing such an antenna are disclosed. In one embodiment, the dipole antenna comprises: a signal wing and at least one ground wing for propagating signals in a millimeter wave band; and an unbalanced feeding structure directly coupled to the signal wing. The unbalanced feeding structure is boarded by a plurality of escorting vias to ensure equipotential grounds.

公开(公告)号：US09570809B2

公开(公告)日：2017-02-14

申请号：US14296875

申请日：2014-06-05

Applicant: QUALCOMM INCORPORATED

Inventor： Elimelech Ganchrow ,  Ofer Markish ,  Iddo Diukman ,  Alon Yehezkely

IPC: H01Q1/38 ,  H01Q9/28 ,  H01Q1/24 ,  H01Q19/30

CPC classification number: H01Q9/285 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/50 ,  H01Q15/02 ,  H01Q19/30

Abstract: A printed millimeter wave dipole antenna and techniques for designing such an antenna are disclosed. In one embodiment, the dipole antenna comprises: a signal wing and at least one ground wing for propagating signals in a millimeter wave band; and an unbalanced feeding structure directly coupled to the signal wing. The unbalanced feeding structure is boarded by a plurality of escorting vias to ensure equipotential grounds.

Abstract translation: 公开了一种印刷毫米波偶极天线和用于设计这种天线的技术。 在一个实施例中，偶极天线包括：信号翼和至少一个用于在毫米波段中传播信号的地面翼; 以及直接耦合到信号翼的不平衡馈送结构。 不平衡喂养结构由多个护送通道登上，以确保等电位。

公开(公告)号：US09680232B2

公开(公告)日：2017-06-13

申请号：US14286464

申请日：2014-05-23

Applicant: QUALCOMM Incorporated

Inventor： Ofer Markish ,  Alon Yehezkely

IPC: H01Q1/48 ,  H01Q21/00 ,  H01Q21/06 ,  H01Q21/20 ,  H01Q23/00

CPC classification number: H01Q21/0025 ,  H01L2224/16225 ,  H01Q1/48 ,  H01Q21/0093 ,  H01Q21/067 ,  H01Q21/205 ,  H01Q23/00

Abstract: A millimeter-wave radio frequency (RF) module is provided. The RF module includes a multilayer substrate having at least a front layer, a back layer, a plurality of middle layers, a first ground layer, and a second ground layer, wherein the first ground layer includes a graded-ground plane having a pair of non-overlapping ground lines connected at a single connection point through a graded connection, and wherein the second ground layer includes a double graded-ground plane having a pair of overlapping ground lines connected at a single connection point through a graded connection, wherein the first ground layer and the second ground layer provide a reference ground to a transmission line included in the multilayer substrate.