公开(公告)号：US20150033082A1

公开(公告)日：2015-01-29

申请号：US13963292

申请日：2013-08-09

Applicant: QUALCOMM Incorporated

Inventor： Ryan Shirlen ,  Victor Wong

IPC: G06F11/07 ,  G06F13/40

CPC classification number: G06F11/0724 ,  G01R31/31705 ,  G06F11/2242 ,  G06F11/263 ,  G06F11/3656 ,  G06F13/4027 ,  G06F15/7807 ,  H04L5/22

Abstract: Embodiments include apparatuses, systems, and methods for reduced pin cross triggering to enhance a debug experience. A time-division packetizing (TDP) technique may be employed to facilitate communication of triggers between integrated circuits (ICs) connected in series forming a TDP communication ring. The ICs on the TDP communication ring may each include a cross trigger interconnect structure for interpreting between trigger signals and hardware core instructions. The serial TDP communication across the ICs on the TDP communication ring allows the ICs to be connected in a manner that each cross trigger interconnect structure on each IC may function as if it were part of a single cross trigger interconnect structure across all of the ICs on the TDP communication ring. The individual ICs may operate asynchronously and a trigger clock may be passed along with other trigger data to implement the debugging techniques uniformly on each IC.

Abstract translation: 实施例包括用于减少引脚交叉触发以增强调试体验的装置，系统和方法。 可以采用时分封装（TDP）技术来促进串联形成TDP通信环的集成电路（IC）之间的触发通信。 TDP通信环上的IC可以各自包括用于在触发信号和硬件核心指令之间解释的交叉触发互连结构。 TDP通信环路上的IC间的串行TDP通信允许以这样的方式连接IC，即每个IC上的每个交叉触发互连结构可以像在跨所有IC上的单个交叉触发互连结构的一部分一样起作用 TDP通信环。 单个IC可以异步操作，并且触发时钟可以与其他触发数据一起传递，以在每个IC上均匀地实现调试技术。

公开(公告)号：US09208008B2

公开(公告)日：2015-12-08

申请号：US13963292

申请日：2013-08-09

Applicant: QUALCOMM Incorporated

Inventor： Ryan Shirlen ,  Victor Wong

IPC: G06F11/22 ,  G06F11/07 ,  G06F13/40 ,  G01R31/317 ,  G06F11/36 ,  G06F11/263 ,  H04L5/22 ,  G06F15/78

CPC classification number: G06F11/0724 ,  G01R31/31705 ,  G06F11/2242 ,  G06F11/263 ,  G06F11/3656 ,  G06F13/4027 ,  G06F15/7807 ,  H04L5/22

Abstract: Embodiments include apparatuses, systems, and methods for reduced pin cross triggering to enhance a debug experience. A time-division packetizing (TDP) technique may be employed to facilitate communication of triggers between integrated circuits (ICs) connected in series forming a TDP communication ring. The ICs on the TDP communication ring may each include a cross trigger interconnect structure for interpreting between trigger signals and hardware core instructions. The serial TDP communication across the ICs on the TDP communication ring allows the ICs to be connected in a manner that each cross trigger interconnect structure on each IC may function as if it were part of a single cross trigger interconnect structure across all of the ICs on the TDP communication ring. The individual ICs may operate asynchronously and a trigger clock may be passed along with other trigger data to implement the debugging techniques uniformly on each IC.

Abstract translation: 实施例包括用于减少引脚交叉触发以增强调试体验的装置，系统和方法。 可以采用时分封装（TDP）技术来促进串联形成TDP通信环的集成电路（IC）之间的触发通信。 TDP通信环上的IC可以各自包括用于在触发信号和硬件核心指令之间解释的交叉触发互连结构。 TDP通信环路上的IC间的串行TDP通信允许以这样的方式连接IC，即每个IC上的每个交叉触发互连结构可以像在跨所有IC上的单个交叉触发互连结构的一部分一样起作用 TDP通信环。 单个IC可以异步操作，并且触发时钟可以与其他触发数据一起传递，以在每个IC上均匀地实现调试技术。