公开(公告)号：US09767889B1

公开(公告)日：2017-09-19

申请号：US15433814

申请日：2017-02-15

Applicant: QUALCOMM Incorporated

Inventor： Scott Powers ,  Thomas Bryan ,  Andrew Tohmc ,  Subrahmanya Pradeep Morusupalli ,  Tin Tin Wee ,  Kenneth Dubowski

IPC: G11C11/40 ,  G11C11/4096 ,  G11C11/408 ,  G11C11/4094 ,  H01L25/18 ,  H01L25/065 ,  H01L23/66 ,  H03H7/38

CPC classification number: G11C11/4096 ,  G11C7/1084 ,  G11C11/4093 ,  H01L23/66 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/18 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06586 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H03K19/00346 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A die is provided having an unterminated endpoint that capacitively loads its input impedance with a capacitance from capacitor while acting as a receiving endpoint and that isolates its output impedance from the capacitance while acting as a transmitting endpoint.