Flexible PCIe Routing
    2.
    发明申请
    Flexible PCIe Routing 有权
    灵活的PCIe路由

    公开(公告)号:US20160070661A1

    公开(公告)日:2016-03-10

    申请号:US14690770

    申请日:2015-04-20

    CPC classification number: G06F13/12 G06F13/4282

    Abstract: In some implementations, a riser card can be configured to connect to multiple PCIe connectors on a motherboard of a computing device. The riser card can be configured to route signals from an accessory installed in the riser to the CPU of the computing device through multiple PCIe connectors. The riser card can be configured to connect to a PCIe connector on the motherboard using cabling.

    Abstract translation: 在一些实现中,提升卡可被配置为连接到计算设备的主板上的多个PCIe连接器。 转接卡可以配置为通过多个PCIe连接器将安装在提升板中的附件信号路由到计算设备的CPU。 转接卡可以配置为使用布线连接到主板上的PCIe连接器。

    MOTHERBOARD WITH DAUGHTER INPUT/OUTPUT BOARD

    公开(公告)号:US20200068712A1

    公开(公告)日:2020-02-27

    申请号:US16108931

    申请日:2018-08-22

    Abstract: The present application discloses a server system. The system includes a chassis, a motherboard installed within the chassis, and a daughterboard installed within the chassis. The motherboard includes one or more central processing unit sockets and one or more memory chip sockets. The daughterboard is communicatively connected to the motherboard. The daughterboard includes one or more input/output (I/O) connectors configured for direct external connections to outside of the chassis. The motherboard has no (I/O) connector configured for direct external connection to outside of the chassis.

    SERVER SYSTEM
    4.
    发明申请
    SERVER SYSTEM 审中-公开

    公开(公告)号:US20170202111A1

    公开(公告)日:2017-07-13

    申请号:US14992143

    申请日:2016-01-11

    Abstract: A server system includes an enclosure, a first section, a motherboard section, a fan section, and a midplane board. The first section is disposed at a first end of the enclosure and includes at least one heat generating component. The motherboard section is disposed at a second end of the enclosure and includes at least one motherboard. The fan section is disposed between the front section and the motherboard section and includes at least one fan for directing air in from the first end and out of the second end. The midplane board is vertically interposed between the fan section and the motherboard section, and is configured to electrically and communicatively couple the at least one motherboard to one or more components in the first section, and includes one or more airflow cutouts. The one or more airflow cutouts of the midplane board make up at least thirty percent of a cross-sectional surface area of the midplane board.

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