公开(公告)号：US08895866B2

公开(公告)日：2014-11-25

申请号：US13741913

申请日：2013-01-15

Applicant: Quanta Computer Inc. ,  Tech-Front (Shanghai) Computer Co., Ltd.

Inventor： Steven Wang ,  Jin-Chang Wu ,  Mide Yang

IPC: H05K1/03 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/029 ,  H05K2201/068

Abstract: A printed circuit board structure includes a plurality of circuit layer plates stacked together in which each of the stacked circuit layer plates includes an epoxy resin plate body and a fabric structure completely encapsulated in the epoxy resin plate body, and each circuit layer plate stacked between two circuit layer plates is further provided with filler particles distributed in its epoxy resin plate body, and the two opposite and outermost circuit layer plates thereof have metal soldering pads on the outer surfaces of the epoxy resin plate body thereof, and the two opposite and outermost circuit layer plates do not have the filler particles in its epoxy resin plate body thereof.

Abstract translation: 印刷电路板结构包括堆叠在一起的多个电路层板，其中每个堆叠的电路层板包括环氧树脂板体和完全封装在环氧树脂板体中的织物结构，并且每个电路层板堆叠在两个 电路层板还设置有分布在其环氧树脂板体中的填料颗粒，并且其两个相对和最外面的电路层板在其环氧树脂板体的外表面上具有金属焊盘，并且两个相对和最外面的电路 层板在其环氧树脂板体中不具有填料颗粒。

公开(公告)号：US20140041903A1

公开(公告)日：2014-02-13

申请号：US13741913

申请日：2013-01-15

Applicant: QUANTA COMPUTER INC. ,  TECH-FRONT (SHANGHAI) COMPUTER CO., LTD.

Inventor： Steven Wang ,  Jin-Chang Wu ,  Mide Yang

IPC: H05K1/02

CPC classification number: H05K1/0298 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/029 ,  H05K2201/068

Abstract: A printed circuit board structure includes a plurality of circuit layer plates stacked together in which each of the stacked circuit layer plates includes an epoxy resin plate body and a fabric structure completely encapsulated in the epoxy resin plate body, and each circuit layer plate stacked between two circuit layer plates is further provided with filler particles distributed in its epoxy resin plate body, and the two opposite and outermost circuit layer plates thereof have metal soldering pads on the outer surfaces of the epoxy resin plate body thereof, and the two opposite and outermost circuit layer plates do not have the filler particles in its epoxy resin plate body thereof.

Abstract translation: 印刷电路板结构包括堆叠在一起的多个电路层板，其中每个堆叠的电路层板包括环氧树脂板体和完全封装在环氧树脂板体中的织物结构，并且每个电路层板堆叠在两个 电路层板还设置有分布在其环氧树脂板体中的填料颗粒，并且其两个相对和最外面的电路层板在其环氧树脂板体的外表面上具有金属焊盘，并且两个相对和最外面的电路 层板在其环氧树脂板体中不具有填料颗粒。