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1.发明申请PRINTED CIRCUIT BOARD AND METHOD OF MOUNTING INTEGRATED CIRCUIT PACKAGING COMPONENT ON THE SAME 审中-公开印刷电路板和安装集成电路封装组件的方法公开(公告)号：US20140284080A1
公开(公告)日：2014-09-25
申请号：US14086856
申请日：2013-11-21
Inventor： Jing ZHANG , Jin-Chang WU , Xiao-Feng XIE
CPC classification number: H05K3/3436 , H05K3/1233 , H05K3/14 , H05K3/3484 , H05K2201/10734 , H05K2203/0465 , Y02P70/613
Abstract: A printed circuit board and a method of mounting an integrated circuit packaging component on the same are provided. The printed circuit board includes a substrate and a plurality of conductive contacts arranged on a surface of the substrate. Each of the conductive contacts has a soldering material layer formed on a top surface thereof, and a concave portion formed on the soldering material layer. Each of the concave portions is aligned with a vertex of the ball-conducting joint for allowing a vertex of the ball conducting joint to extend into the concave portion.
Abstract translation: 提供印刷电路板和将集成电路封装部件安装在其上的方法。 印刷电路板包括基板和布置在基板的表面上的多个导电触点。 每个导电触点具有形成在其顶表面上的焊接材料层和形成在焊接材料层上的凹部。 每个凹部与球形导电接头的顶点对准，用于允许球导电接头的顶点延伸到凹部中。
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公开(公告)号：US08895866B2
公开(公告)日：2014-11-25
申请号：US13741913
申请日：2013-01-15
Inventor： Steven Wang , Jin-Chang Wu , Mide Yang
CPC classification number: H05K1/0298 , H05K3/4688 , H05K2201/0209 , H05K2201/0269 , H05K2201/029 , H05K2201/068
Abstract: A printed circuit board structure includes a plurality of circuit layer plates stacked together in which each of the stacked circuit layer plates includes an epoxy resin plate body and a fabric structure completely encapsulated in the epoxy resin plate body, and each circuit layer plate stacked between two circuit layer plates is further provided with filler particles distributed in its epoxy resin plate body, and the two opposite and outermost circuit layer plates thereof have metal soldering pads on the outer surfaces of the epoxy resin plate body thereof, and the two opposite and outermost circuit layer plates do not have the filler particles in its epoxy resin plate body thereof.
Abstract translation: 印刷电路板结构包括堆叠在一起的多个电路层板，其中每个堆叠的电路层板包括环氧树脂板体和完全封装在环氧树脂板体中的织物结构，并且每个电路层板堆叠在两个 电路层板还设置有分布在其环氧树脂板体中的填料颗粒，并且其两个相对和最外面的电路层板在其环氧树脂板体的外表面上具有金属焊盘，并且两个相对和最外面的电路 层板在其环氧树脂板体中不具有填料颗粒。
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公开(公告)号：US20140041903A1
公开(公告)日：2014-02-13
申请号：US13741913
申请日：2013-01-15
Inventor： Steven Wang , Jin-Chang Wu , Mide Yang
IPC: H05K1/02
CPC classification number: H05K1/0298 , H05K3/4688 , H05K2201/0209 , H05K2201/0269 , H05K2201/029 , H05K2201/068
Abstract: A printed circuit board structure includes a plurality of circuit layer plates stacked together in which each of the stacked circuit layer plates includes an epoxy resin plate body and a fabric structure completely encapsulated in the epoxy resin plate body, and each circuit layer plate stacked between two circuit layer plates is further provided with filler particles distributed in its epoxy resin plate body, and the two opposite and outermost circuit layer plates thereof have metal soldering pads on the outer surfaces of the epoxy resin plate body thereof, and the two opposite and outermost circuit layer plates do not have the filler particles in its epoxy resin plate body thereof.
Abstract translation: 印刷电路板结构包括堆叠在一起的多个电路层板，其中每个堆叠的电路层板包括环氧树脂板体和完全封装在环氧树脂板体中的织物结构，并且每个电路层板堆叠在两个 电路层板还设置有分布在其环氧树脂板体中的填料颗粒，并且其两个相对和最外面的电路层板在其环氧树脂板体的外表面上具有金属焊盘，并且两个相对和最外面的电路 层板在其环氧树脂板体中不具有填料颗粒。
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4.发明申请公开(公告)号：US20140200289A1
公开(公告)日：2014-07-17
申请号：US13909716
申请日：2013-06-04
Inventor： Xin WANG , Jin-Chang Wu , Wen-bing Wang
IPC: C08K5/19
CPC classification number: C08K5/19
Abstract: An organic montmorillonite enhanced epoxy resin and a preparation method thereof are provided. The preparation method of the organic montmorillonite enhanced epoxy resin includes adding an organic montmorillonite exfolicated by an organic solvent and a coupling agent to increase the thermal stability and reliability of the epoxy resin.
Abstract translation: 提供了一种有机蒙脱土增强环氧树脂及其制备方法。 有机蒙脱石增强环氧树脂的制备方法包括加入有机溶剂和偶联剂脱落的有机蒙脱土，以提高环氧树脂的热稳定性和可靠性。
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