公开(公告)号：US20190259464A1

公开(公告)日：2019-08-22

申请号：US16378304

申请日：2019-04-08

Applicant: RAMBUS INC.

Inventor： Thomas Vogelsang ,  William Ng ,  Fredrick A. Ware

IPC: G11C29/02 ,  G11C5/06 ,  G01R31/28 ,  G11C5/02 ,  G11C29/04 ,  H01L25/065 ,  G11C8/10 ,  H01L21/66

Abstract: Embodiments generally relate to integrated circuit devices having through silicon vias (TSVs). In one embodiment, an integrated circuit (IC) device includes a field of TSVs and an address decoder that selectably couples at least one of the TSVs to at least one of a test input and a test evaluation circuit. In another embodiment, a method includes selecting one or more TSVs from a field of TSVs in at least one IC device, and coupling each selected TSV to at least one of a test input and a test evaluation circuit.