Multi-Modal Refresh of Dynamic, Random-Access Memory

    公开(公告)号:US20240354014A1

    公开(公告)日:2024-10-24

    申请号:US18655510

    申请日:2024-05-06

    Applicant: Rambus Inc.

    CPC classification number: G06F3/0634 G06F3/061 G06F3/0673

    Abstract: A memory system includes two or more memory controllers capable of accessing the same dynamic, random-access memory (DRAM), one controller having access to the DRAM or a subset of the DRAM at a time. Different subsets of the DRAM are supported with different refresh-control circuitry, including respective refresh-address counters. Whichever controller has access to a given subset of the DRAM issues refresh requests to the corresponding refresh-address counter. Counters are synchronized before control of a given subset of the DRAM is transferred between controllers to avoid a loss of stored data.

    MEMORY DEVICE HAVING HIDDEN REFRESH
    2.
    发明公开

    公开(公告)号:US20240295961A1

    公开(公告)日:2024-09-05

    申请号:US18598323

    申请日:2024-03-07

    Applicant: Rambus Inc.

    Abstract: An integrated circuit (IC) memory device includes an array of storage cells configured into multiple banks. Interface circuitry receives refresh commands from a host memory controller to refresh the multiple banks for a first refresh mode. On-die refresh control circuitry selectively generates local refresh commands to refresh the multiple banks in cooperation with the host memory controller during a designated hidden refresh interval in a second refresh mode. Mode register circuitry stores a value indicating whether the on-die refresh control circuitry is enabled for use during the second refresh mode. The interface circuitry includes backchannel control circuitry to transmit a corrective action control signal during operation in the second refresh mode.

    DYNAMIC RANDOM ACCESS MEMORY (DRAM) WITH CONFIGURABLE WORDLINE AND BITLINE VOLTAGES

    公开(公告)号:US20240257860A1

    公开(公告)日:2024-08-01

    申请号:US18566558

    申请日:2022-05-31

    Applicant: Rambus Inc.

    CPC classification number: G11C11/4074 G06F12/0223 G11C11/4085 G11C11/4091

    Abstract: A dynamic random access memory (DRAM) device includes memory core circuitry and power supply circuitry. The memory core circuitry includes an array of DRAM storage cells, with ones of the DRAM storage cells coupled to wordline and bitline power supply busses. The power supply circuitry is coupled to the wordline and bitline power supply busses. The power supply circuitry is responsive to a control signal to generate one of a first set of respective wordline and bitline voltages for application to the wordline and bitline power supply busses in a first normal mode of operation, or to generate a second set of respective wordline and bitline voltages for application to the wordline and bitline power supply busses in a second normal mode of operation. A value of the control signal is based on a temperature parameter associated with the DRAM device.

    Memory device having non-uniform refresh

    公开(公告)号:US12020740B2

    公开(公告)日:2024-06-25

    申请号:US16973241

    申请日:2019-05-25

    Applicant: Rambus Inc.

    Inventor: Thomas Vogelsang

    CPC classification number: G11C11/40615 G11C11/40611 G11C11/40626

    Abstract: An integrated circuit memory device includes an array of storage cells configured into multiple banks. Each bank includes multiple segments. Register storage stores per-segment values representing per-segment refresh parameters. Refresh logic refreshes each segment in accordance with the corresponding per-segment value.

    Memory device having hidden refresh

    公开(公告)号:US11934654B2

    公开(公告)日:2024-03-19

    申请号:US17544584

    申请日:2021-12-07

    Applicant: Rambus Inc.

    Abstract: An integrated circuit (IC) memory device includes an array of storage cells configured into multiple banks. Interface circuitry receives refresh commands from a host memory controller to refresh the multiple banks for a first refresh mode. On-die refresh control circuitry selectively generates local refresh commands to refresh the multiple banks in cooperation with the host memory controller during a designated hidden refresh interval in a second refresh mode. Mode register circuitry stores a value indicating whether the on-die refresh control circuitry is enabled for use during the second refresh mode. The interface circuitry includes backchannel control circuitry to transmit a corrective action control signal during operation in the second refresh mode.

    Partial array refresh timing
    7.
    发明授权

    公开(公告)号:US11868619B2

    公开(公告)日:2024-01-09

    申请号:US17785269

    申请日:2020-12-03

    Applicant: Rambus Inc.

    Abstract: A memory controller combines information about which memory component segments are not being refreshed with the information about which rows are going to be refreshed next, to determine, for the current refresh command, the total number of rows that are going to be refreshed. Based on this total number of rows, the memory controller selects how long to wait after the refresh command before issuing a next subsequent command. When the combination of masked segments and the refresh scheme results in less than the ‘nominal’ number of rows typically refreshed in response to a single refresh command, the waiting period before the next command (e.g., non-refresh command) is issued may be reduced from the ‘nominal’ minimum time period, thereby allowing the next command to be issued earlier.

    Stacked memory device with paired channels

    公开(公告)号:US11775213B2

    公开(公告)日:2023-10-03

    申请号:US17323024

    申请日:2021-05-18

    Applicant: Rambus Inc.

    Inventor: Thomas Vogelsang

    CPC classification number: G06F3/0659 G06F3/061 G06F3/0673

    Abstract: A stacked memory device includes memory dies over a base die. The base die includes separate memory channels to the different dies and external channels that allow an external processor access to the memory channels. The base die allows the external processor to access multiple memory channels using more than one external channel. The base die also allows the external processor to communicate through the memory device via the external channels, bypassing the memory channels internal to the device. This bypass functionality allows the external processor to connect to additional stacked memory devices.

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