Abstract:
A SEMICONDUCTOR WAFER HAS A UNIFORMLY THICK COLLECTOR LAYER THEREIN WITH A UNIFORMLY THICK BASE LAYER ADJACENT THE COLLECTOR LAYER. A PLURALITY OF EMITTER REGIONS ARE DIFFUSED INTO THE BASE LAYER FROM THE SURFACE. DURING EMITTER DIFFUSION, AN ANNULAR REGION OF THE SAME CONDUCTIVITY AS THE EMITTER REGIONS IS ALSO DIFFUSED INTO THE BASE LAYER TO SURROUND A PORTION OF THE BASE LAYER AT THE SURFACE. THE SHEET RESISTIVITY OF THE BASE LAYER BETWEEN THE ANNULAR REGION AND THE COLLECTOR LAYER IS DETERMINED, AND IF BELOW A DESIRED MINMUM, THE EMITTER AND ANNULAR REGIONS ARE FURTHER DIFFUSED.
Abstract:
A body of semiconductor material having first and second opposed faces, and containing a region of N type conductivity and a region of P type conductivity separated by a P-N junction. The N type region contains a central portion extending inward from one face partially through the body toward the second face, and a peripheral portion extending completely through the body with its resistivity increasing toward the second face relative to the remainder of the N type region adjacent the P-N junction. The peripheral portion encloses the P type region and extends the P-N junction to the second face where it has the least chance for voltage breakdown.
Abstract:
A high-voltage transistor is formed in a semiconductor body having two opposed major surfaces. The transistor has emitter, base, and collector regions, with the emitter-base junction extending to a first one of the surfaces, and with the collector region extending to the second surface. A nickel layer is disposed on the second surface, and a layer of a thermally conductive metal of about the same thickness as the semiconductor body, or greater, is integrally joined to the nickel layer.