Method for epitaxially growing layers of a semiconductor material from the liquid phase
    2.
    发明授权
    Method for epitaxially growing layers of a semiconductor material from the liquid phase 失效
    来自液相的半导体材料的外延生长层的方法

    公开(公告)号:US3767481A

    公开(公告)日:1973-10-23

    申请号:US3767481D

    申请日:1972-04-07

    Applicant: RCA CORP

    CPC classification number: C30B19/063

    Abstract: A furnace boat having a plurality of spaced deposition solution containing wells in its upper surface with each well having a recess in its bottom surface. A slide extends through the boat so as to extend across each of the wells and over the recesses in the wells. The slide has a recess in its upper surface and an opening therethrough adjacent to but spaced from the recess. A plurality of epitaxial layers can be deposited on a substrate in succession by placing a separate source body of a semiconductor material in each well recess and a substrate in the slide recess. The deposition solutions are brought into contact with the respective source bodies through the opening in the slide to exactly saturate the deposition solutions with the semiconductor material and the substrate is then brought into contact with the exactly saturated solutions in succession to deposit the epitaxial layers.

    Abstract translation: 一种炉船,其具有多个间隔开的沉积溶液,其在其上表面中包含孔,每个井在其底表面中具有凹部。 滑块延伸穿过船,以便延伸穿过井中的每个井和井中的凹槽。 滑动件在其上表面具有凹部,并且与凹部相邻但与凹部间隔开的开口。 多个外延层可以通过将每个阱凹槽中的半导体材料的独立源体和滑动凹槽中的衬底放置在衬底上来连续沉积。 沉积溶液通过滑块中的开口与相应的源体接触,以使半导体材料精确地饱和沉积溶液,然后使衬底与准确饱和的溶液接触以沉积外延层。

    Method of depositing an epitaxial semiconductor layer from the liquidphase
    4.
    发明授权
    Method of depositing an epitaxial semiconductor layer from the liquidphase 失效
    从液相沉积外延半导体层的方法

    公开(公告)号:US3741825A

    公开(公告)日:1973-06-26

    申请号:US3741825D

    申请日:1971-07-08

    Applicant: RCA CORP

    CPC classification number: C30B19/063 H01L21/00

    Abstract: ONE OR MORE EPITAXIAL LAYERS OF A SEMICONDUCTOR MATERIAL ARE DISPOSED ON A SUBSTRATE BY PROVIDING FOR EACH EPITAXIAL LAYER TO BE DEPOSITED A SEPARATE SOLUTION OF A SEMICONDUCTOR MATERIAL DISSOLVED IN A MOLTEN METAL SOLVENT WITH EACH SOLUTION BEING UNSATURATED WITH THE SEMICONDUCTOR MATERIAL, A BODY OF THE SEMICONDUCTOR MATERIAL IS BROUGHT INTO CONTACT WITH THE SOLUTION AND SOME OF THE BODY IS DISSOLVED IN THE SOLUTION SO AS TO EXACTLY SATURATE THE SOLUTION. THE BODY IS THEN REMOVED FROM THE EXA BROUGHT INTO CONTACT WITH THE SOLUTION AND THE SUBSTRATE COOLED TO DEPOSIT THE EPITAXIAL LAYER ON THE SUBSTRATE, TO DEPOSIT A PLURALITY OF EPITAXIAL LAYERS ON THE SUBSTRATE, THE SUBSTRATE IS SUCCESSIVELY BROUGHT INTO CONTACT WITH EACH SOLUTION WITH THE BODY OF SEMICONDUCTOR MATERIAL PRECEDING THE SUBSTRATE INTO EACH SOLUTION SO THAT EACH SOLUTION IS EXACTLY SATURATED WITH THE SEMICONDUCTOR MATERIAL WHEN THE SUBSTRATE IS BROUGHT INTO THE SOLUTION.

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