Abstract:
A contact of an indium gallium arsenide alloy forms an ohmic contact with a body of n-type or p-type single crystal gallium arsenide of a resistivity of 1 ohm-cm or greater. The method for forming the contact utilizes a low temperature range. This low temperature range lessens the amount of surface disassociation and aids in the prevention of contamination of the body of gallium arsenide.
Abstract:
AN EPITAXIAL LAYER OF SINGLE CRYSTALLINE GALLIUM ARSENIDE OR ALUMINUM GALLIUM ARSENIDE HAVING A LOW CONCENTRATION OF ALUMINUM IS DEPOSITED ON A BODY OF SINGLE CRYSTALLINE SEMICONDUCTOR MATERIAL BY LIQUID PHASE EPITAXY. AN ADDITIONAL LAYER OF SINGLE CRYSTALLINE ALUMINUM GALLIUM ARSENIDE HAVING A RELATIVELY HIGH CONCENTRATION OF ALUMINUM IS DEPOSITED BY LIQUID PHASE EPITAXY ON THE EPITAXIAL LAYER. THE ADDITIONAL LAYER IS THEN COMPLETELY ETCHED AWAY BY AN ETCHANT WHICH DOES NOT ATTACK THE MATERIAL OF THE EPITAXIAL LAYER, SUCH AS BOILING HYDROCHLORIC ACID, TO EXPOSE THE ENTIRE SURFACE OF THE EPITAXIAL LAYER AND PROVIDE THE EPITAXIAL LAYER WITH A SMOOTH, FLAT SURFACE.