公开(公告)号：US3801477A

公开(公告)日：1974-04-02

申请号：US3801477D

申请日：1972-06-23

Applicant: RCA CORP

Inventor： RONEN R ,  JAMES E

IPC: H01L21/60 ,  H01L23/485 ,  B44D1/18 ,  C23B5/48 ,  H01L1/14

CPC classification number: H01L24/82 ,  H01L24/24 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01063 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/00

Abstract: METHOD OF MAKING AN ELECTRICAL LEAD CONNECTION TO THE TOP SURFACE OF A PASSIVATION COATED SEMICONDUCTOR DEVICE CHIP MOUNTED ON A SUBSTRATE, WHERE THE LEAD IS A CONDUCTING METAL PATH EXTENDING ACROSS THE SUBSTRATE AND OVER AN EDGE OF THE CHIP, COMPRISING DEPOSITING A FIRST THIN, ELECTRICALLY CONDUCTIVE LAYER OF METAL OVER BOTH SUBSTRATE AND COATED CHIP, COVERING THE FIRST LAYER OF METAL WITH A THICK LAYER OF PHOTORESIST, REMOVING PORTIONS OF PHOTORESISTS LAYER CONFORMING TO THE DESIRED SHAPE OF THE LEAD, ELECTRODEPOSITING A THICK LAYER OF METAL WHERE THE PHOTORESIST HAS BEEN REMOVED, COVERING THE THICK LAYER OF METAL WITH A LAYER OF A MATERIAL WHICH IS RESISTANT TO A PARTICULAR SOLVENT FOR THE FIRST METAL LAYER, AND TREATING THE CHIP AND SUBSTRATE WITH THE SOLVENT TO REMOVE THAT PART OF THE FIRST METAL LAYER NOT COVERED BY THE RESISTANT MATERIAL.