Method of manufacturing semiconductor device

    公开(公告)号:US11882697B2

    公开(公告)日:2024-01-23

    申请号:US17697380

    申请日:2022-03-17

    Inventor: Shu Shimizu

    CPC classification number: H10B41/42 H01L29/66825 H01L29/7883

    Abstract: A non-volatile semiconductor memory and three or more types of transistors are provided. A thickness of a first gate oxide film of a first transistor is larger than that of a second gate oxide film of a second transistor, and is smaller than that of a third gate oxide film of a third transistor. In a first transistor region, a first silicon oxide film is formed on a surface of a semiconductor substrate, and second and third silicon oxide films are formed on the first silicon oxide film. By removing the second and third silicon oxide films and a part of an upper layer of the first silicon oxide film, the first gate oxide film is formed from the first silicon oxide film.

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