公开(公告)号：US20240209168A1

公开(公告)日：2024-06-27

申请号：US18554334

申请日：2021-04-19

Applicant: RESONAC CORPORATION

Inventor： Kazumasa TAKEUCHI ,  Teruo ITOH ,  Arisa TAIRA ,  Kosuke URASHIMA ,  Hideo MAEDA

IPC: C08J5/24 ,  C08K3/28 ,  C08K3/38 ,  C08L63/00

CPC classification number: C08J5/249 ,  C08K3/28 ,  C08K3/38 ,  C08L63/00 ,  C08K2201/01

Abstract: A monomer composition is a monomer composition for impregnating voids in a porous compact. The compact contains a metal powder and a thermosetting resin composition. The monomer composition contains at least one compound selected from the group consisting of an acrylate having a dicyclopentane structure, an acrylate having a dicyclopentene structure, a methacrylate having a dicyclopentane structure, and a methacrylate having a dicyclopentene structure.

公开(公告)号：US20240177897A1

公开(公告)日：2024-05-30

申请号：US18551508

申请日：2022-04-15

Applicant: Resonac Corporation

Inventor： Kazumasa TAKEUCHI ,  Arisa TAIRA ,  Teruo ITOH ,  Hideo MAEDA ,  Chio ISHIHARA

IPC: H01F1/057 ,  H01F1/059 ,  H01F1/26 ,  H01F3/08

CPC classification number: H01F1/0578 ,  H01F1/059 ,  H01F1/26 ,  H01F3/08

Abstract: A magnetic powder includes: a plurality of magnetic particles including at least either one of a permanent magnet and a soft magnetic material; a first silicon compound covering at least a portion of the surfaces of the magnetic particles; and a second silicon compound covering at least a portion of the surfaces of the magnetic particles. The first silicon compound includes an alkyl group and silicon bonded to the alkyl group. The second silicon compound includes an alkyl chain, silicon bonded to one end of the alkyl chain, and a glycidyl group located at the other end of the alkyl chain. A number m of carbon atoms of the alkyl chain included in the second silicon compound is larger than a number n of carbon atoms of the alkyl group included in the first silicon compound.