公开(公告)号：US09156677B2

公开(公告)日：2015-10-13

申请号：US13764324

申请日：2013-02-11

Applicant: RF Micro Devices, Inc.

Inventor： Ruediger Bauder ,  Nadim Khlat ,  Julio Costa ,  Jonathan Hammond

IPC: H03F1/50 ,  B81B7/00 ,  H04W52/02

CPC classification number: B81B7/0022 ,  B81B2201/014 ,  B81C1/00976 ,  H01H59/0009 ,  H04W52/02

Abstract: Pilot switch circuitry grounds a hot node (an injection node) of a microelectromechanical system (MEMS) switch to reduce or eliminate arcing between a cantilever contact and a terminal contact when the MEMS switch is opened or closed. The pilot switch circuitry grounds the hot node prior to, during, and after the cantilever contact and terminal contact of the MEMS come into contact with one another (when the MEMS switch is closed). Additionally, the pilot switch circuitry grounds the hot node prior to, during, and after the cantilever contact and terminal contact of the MEMS disengage from one another (when the MEMS switch is opened).

Abstract translation: 导向开关电路将微机电系统（MEMS）开关的热节点（注入节点）接地，以在MEMS开关打开或关闭时减少或消除悬臂触点和端子触点之间的电弧。 在MEMS悬臂接触之前，期间和之后，导频开关电路将热节点接地，并且MEMS的端子接触彼此接触（当MEMS开关闭合时）。 此外，导频开关电路在MEMS的彼此脱离接合之前，之中和之后，以及MEMS的彼此脱离接合（当MEMS开关断开时）接地。

公开(公告)号：US20130207714A1

公开(公告)日：2013-08-15

申请号：US13764324

申请日：2013-02-11

Applicant: RF MICRO DEVICES, INC.

Inventor： Ruediger Bauder ,  Nadim Khlat ,  Julio Costa ,  Jonathan Hammond

IPC: B81B7/00

CPC classification number: B81B7/0022 ,  B81B2201/014 ,  B81C1/00976 ,  H01H59/0009 ,  H04W52/02

Abstract: Pilot switch circuitry grounds a hot node (an injection node) of a microelectromechanical system (MEMS) switch to reduce or eliminate arcing between a cantilever contact and a terminal contact when the MEMS switch is opened or closed. The pilot switch circuitry grounds the hot node prior to, during, and after the cantilever contact and terminal contact of the MEMS come into contact with one another (when the MEMS switch is closed). Additionally, the pilot switch circuitry grounds the hot node prior to, during, and after the cantilever contact and terminal contact of the MEMS disengage from one another (when the MEMS switch is opened).

Abstract translation: 导向开关电路将微机电系统（MEMS）开关的热节点（注入节点）接地，以在MEMS开关打开或关闭时减少或消除悬臂触点和端子触点之间的电弧。 在MEMS悬臂接触之前，期间和之后，导频开关电路将热节点接地，并且MEMS的端子接触彼此接触（当MEMS开关闭合时）。 此外，导频开关电路在MEMS的彼此脱离接合之前，之中和之后，以及MEMS的彼此脱离接合（当MEMS开关断开时）接地。

公开(公告)号：US10759660B2

公开(公告)日：2020-09-01

申请号：US14711352

申请日：2015-05-13

Applicant: RF Micro Devices, Inc.

Inventor： Jonathan Hammond ,  Jan Edward Vandemeer ,  Julio Costa

IPC: B81C1/00

Abstract: A method for processing product wafers using carrier substrates is disclosed. The method includes a step of bonding a first carrier wafer to a first product wafer using a first temporary adhesion layer between a first carrier wafer surface and a first product wafer first surface. Another step includes bonding a second carrier wafer to a second product wafer using a second temporary adhesion layer between a second carrier wafer surface and a second product wafer surface. Another step includes bonding the first product wafer to the second product wafer using a permanent bond between a first product wafer second surface and a second product wafer first surface. In exemplary embodiments, at least one processing step is performed on the first product wafer after the first temporary carrier wafer is bonded to the first product wafer before the second product wafer is permanently bonded to the first product wafer.

公开(公告)号：US20150329355A1

公开(公告)日：2015-11-19

申请号：US14711352

申请日：2015-05-13

Applicant: RF Micro Devices, Inc.

Inventor： Jonathan Hammond ,  Jan Edward Vandemeer ,  Julio Costa

IPC: B81C1/00

CPC classification number: B81C1/00269 ,  B81C1/0015 ,  B81C2201/0194 ,  B81C2203/0118 ,  B81C2203/0127

Abstract: A method for processing product wafers using carrier substrates is disclosed. The method includes a step of bonding a first carrier wafer to a first product wafer using a first temporary adhesion layer between a first carrier wafer surface and a first product wafer first surface. Another step includes bonding a second carrier wafer to a second product wafer using a second temporary adhesion layer between a second carrier wafer surface and a second product wafer surface. Another step includes bonding the first product wafer to the second product wafer using a permanent bond between a first product wafer second surface and a second product wafer first surface. In exemplary embodiments, at least one processing step is performed on the first product wafer after the first temporary carrier wafer is bonded to the first product wafer before the second product wafer is permanently bonded to the first product wafer.

Abstract translation: 公开了一种使用载体衬底处理产品晶片的方法。 该方法包括使用第一载体晶片表面和第一产品晶片第一表面之间的第一临时粘合层将第一载体晶片接合到第一产品晶片的步骤。 另一步骤包括使用第二载体晶片表面和第二产品晶片表面之间的第二临时粘合层将第二载体晶片接合到第二产品晶片。 另一步骤包括使用第一产品晶片第二表面和第二产品晶片第一表面之间的永久接合将第一产品晶片连接到第二产品晶片。 在示例性实施例中，在第二产品晶片永久地结合到第一产品晶片之前，在第一临时载体晶片被结合到第一产品晶片之后，在第一产品晶片上执行至​​少一个处理步骤。