公开(公告)号：US20140355222A1

公开(公告)日：2014-12-04

申请号：US13906892

申请日：2013-05-31

Applicant: RF Micro Devices, Inc.

Inventor： Thong Dang ,  Mohsen Haji-Rahim ,  Joseph Byron Bullis

IPC: H05K1/14 ,  H05K3/28 ,  H05K1/02 ,  H05K3/30

CPC classification number: H05K3/4007 ,  H01L23/3135 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48229 ,  H01L2224/48235 ,  H01L2224/48465 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/1421 ,  H01L2924/1434 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/1532 ,  H01L2924/1533 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/144 ,  H05K3/284 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2201/10371 ,  Y10T29/4902 ,  Y10T29/49146 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present disclosure is related to electronic modules for electronic components and methods for manufacturing the same. In one embodiment, an electronic module is formed using a first substrate having a first component area and a second substrate having a second component area. One or more electronic components may be attached to both the first component area and the second component area. The second substrate is mounted over the first substrate such that the second component area faces the first component area. An overmold covers the first component area and the second component area so as to cover the electronic components on both the first component area and the second component area. In this manner, the number of electronic components within the electronic module that can be mounted on an area of a printed circuit board (PCB) is increased.

Abstract translation: 本公开涉及电子部件的电子模块及其制造方法。 在一个实施例中，使用具有第一部件区域的第一基板和具有第二部件区域的第二基板形成电子模块。 一个或多个电子部件可以附接到第一部件区域和第二部件区域。 第二基板安装在第一基板上，使得第二部件区域面向第一部件区域。 包覆成型覆盖第一部件区域和第二部件区域，以覆盖第一部件区域和第二部件区域上的电子部件。 以这种方式，能够安装在印刷电路板（PCB）的区域上的电子模块内的电子部件的数量增加。

公开(公告)号：US09807890B2

公开(公告)日：2017-10-31

申请号：US13906892

申请日：2013-05-31

Applicant: RF Micro Devices, Inc.

Inventor： Thong Dang ,  Mohsen Haji-Rahim ,  Joseph Byron Bullis

IPC: H05K3/40 ,  H05K1/14 ,  H01L23/31 ,  H01L23/00 ,  H05K3/28 ,  H05K1/02

CPC classification number: H05K3/4007 ,  H01L23/3135 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48229 ,  H01L2224/48235 ,  H01L2224/48465 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/1421 ,  H01L2924/1434 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/1532 ,  H01L2924/1533 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/144 ,  H05K3/284 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2201/10371 ,  Y10T29/4902 ,  Y10T29/49146 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present disclosure is related to electronic modules for electronic components and methods for manufacturing the same. In one embodiment, an electronic module is formed using a first substrate having a first component area and a second substrate having a second component area. One or more electronic components may be attached to both the first component area and the second component area. The second substrate is mounted over the first substrate such that the second component area faces the first component area. An overmold covers the first component area and the second component area so as to cover the electronic components on both the first component area and the second component area. In this manner, the number of electronic components within the electronic module that can be mounted on an area of a printed circuit board (PCB) is increased.