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1.发明申请INTEGRATED CIRCUIT MODULE HAVING A FIRST DIE WITH A POWER AMPLIFIER STACKED WITH A SECOND DIE AND METHOD OF MAKING THE SAME 有权具有第二模块的功率放大器的第一模块的集成电路模块及其制造方法公开(公告)号：US20150200189A1
公开(公告)日：2015-07-16
申请号：US14595451
申请日：2015-01-13
Applicant: RF Micro Devices, Inc.
Inventor： Douglas Andrew Teeter , Ming Ji , Bhavin Shah , Mohsen Haji-Rahim , William Kent Braxton
CPC classification number: H01L25/18 , H01L23/4012 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/043 , H01L25/0652 , H01L25/0657 , H01L25/0756 , H01L25/50 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48106 , H01L2224/48145 , H01L2224/48227 , H01L2224/48465 , H01L2224/49096 , H01L2224/49111 , H01L2224/4917 , H01L2224/49171 , H01L2924/00014 , H01L2924/10253 , H01L2924/10329 , H01L2924/141 , H01L2924/143 , H01L2924/19105 , H01L2924/19107 , H01L2924/20102 , H01L2924/20103 , H01L2924/2064 , H03F3/195 , H03F2200/531 , H01L2924/20753 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
Abstract: Disclosed is an integrated circuit module that includes a first die having a plurality of hot regions and at least one cool region when operating under normal conditions. The first die with a top surface includes at least one power amplifier that resides in the plurality of hot regions. The integrated circuit module also includes a second die. The second die has a bottom surface, which is adhered to the top surface of the first die, wherein any portion of the bottom surface of the second die that is adhered to the top surface of the first die resides exclusively on the at least one cool region. In at least one embodiment, the first die is an RF power amplifier die and the second die is a controller die having control circuitry configured to control the at least one power amplifier that is an RF power amplifier type.
Abstract translation: 公开了一种集成电路模块，其包括具有多个热区域的第一管芯和在正常条件下操作时的至少一个冷却区域。 具有顶表面的第一管芯包括驻留在多个热区域中的至少一个功率放大器。 集成电路模块还包括第二管芯。 第二模具具有底表面，其粘附到第一模具的顶表面，其中粘附到第一模具的顶表面的第二模具的底表面的任何部分仅在至少一个冷却 地区。 在至少一个实施例中，第一裸片是RF功率放大器芯片，而第二裸片是具有控制电路的控制器芯片，控制电路配置成控制作为RF功率放大器类型的至少一个功率放大器。
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Patent Agency Ranking
公开(公告)号：US20150036306A1
公开(公告)日：2015-02-05
申请号：US14517002
申请日：2014-10-17
Applicant: RF Micro Devices, Inc.
Inventor： Thong Dang , Mohsen Haji-Rahim , Mark Charles Held
CPC classification number: H05K1/111 , H01L23/3135 , H01L23/3171 , H01L23/552 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/82 , H01L24/92 , H01L24/97 , H01L2224/24051 , H01L2224/24226 , H01L2224/245 , H01L2224/291 , H01L2224/2919 , H01L2224/32225 , H01L2224/73267 , H01L2224/8201 , H01L2224/82031 , H01L2224/82101 , H01L2224/82136 , H01L2224/92244 , H01L2224/97 , H01L2924/1421 , H01L2924/1434 , H01L2924/1443 , H01L2924/1461 , H01L2924/15159 , H01L2924/15787 , H01L2924/19105 , H05K1/185 , H05K3/284 , H05K9/0022 , H05K2201/0715 , H05K2201/10439 , Y10T29/49016 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , H01L2224/82 , H01L2924/014 , H01L2924/00
Abstract: A shielded electronic module is formed on a substrate. The substrate has a component area and one or more electronic components attached to the component area. One set of conductive pads may be attached to the component area and another set of conductive pads may be provided on the electronic component. The conductive pads on the component area are electrically coupled to the conductive pads of the electronic component by a conductive layer. A first insulating layer is provided over the component area and underneath the conductive layer that may insulate the electronic component and the substrate from the conductive layer. A second insulating layer is provided over the first insulating layer that covers at least the conductive layer. In this manner, the conductive layer is isolated from an electromagnetic shield formed over the component area.
Abstract translation: 屏蔽电子模块形成在基板上。 基板具有附接到部件区域的部件区域和一个或多个电子部件。 一组导电焊盘可以附接到部件区域，另外一组导电焊盘可以设置在电子部件上。 组件区域上的导电焊盘通过导电层电耦合到电子部件的导电焊盘。 第一绝缘层设置在导电层之上的部件区域和下方，可以使电子部件和衬底与导电层绝缘。 第二绝缘层设置在覆盖至少导电层的第一绝缘层上。 以这种方式，导电层与组件区域上形成的电磁屏蔽隔离。
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3.发明授权Integrated circuit module having a first die with a power amplifier stacked with a second die and method of making the same 有权具有第一管芯的集成电路模块，具有与第二管芯堆叠的功率放大器及其制造方法公开(公告)号：US09583471B2
公开(公告)日：2017-02-28
申请号：US14595451
申请日：2015-01-13
Applicant: RF Micro Devices, Inc.
Inventor： Douglas Andrew Teeter , Ming Ji , Bhavin Shah , Mohsen Haji-Rahim , William Kent Braxton
IPC: H01L25/04 , H01L25/065 , H01L25/18 , H03F3/195 , H01L25/00 , H01L23/00 , H01L23/40 , H01L25/075 , H01L23/66
CPC classification number: H01L25/18 , H01L23/4012 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/043 , H01L25/0652 , H01L25/0657 , H01L25/0756 , H01L25/50 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48106 , H01L2224/48145 , H01L2224/48227 , H01L2224/48465 , H01L2224/49096 , H01L2224/49111 , H01L2224/4917 , H01L2224/49171 , H01L2924/00014 , H01L2924/10253 , H01L2924/10329 , H01L2924/141 , H01L2924/143 , H01L2924/19105 , H01L2924/19107 , H01L2924/20102 , H01L2924/20103 , H01L2924/2064 , H03F3/195 , H03F2200/531 , H01L2924/20753 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
Abstract: Disclosed is an integrated circuit module that includes a first die having a plurality of hot regions and at least one cool region when operating under normal conditions. The first die with a top surface includes at least one power amplifier that resides in the plurality of hot regions. The integrated circuit module also includes a second die. The second die has a bottom surface, which is adhered to the top surface of the first die, wherein any portion of the bottom surface of the second die that is adhered to the top surface of the first die resides exclusively on the at least one cool region. In at least one embodiment, the first die is an RF power amplifier die and the second die is a controller die having control circuitry configured to control the at least one power amplifier that is an RF power amplifier type.
Abstract translation: 公开了一种集成电路模块，其包括具有多个热区域的第一管芯和在正常条件下操作时的至少一个冷却区域。 具有顶表面的第一管芯包括驻留在多个热区域中的至少一个功率放大器。 集成电路模块还包括第二管芯。 第二模具具有底表面，其粘附到第一模具的顶表面，其中粘附到第一模具的顶表面的第二模具的底表面的任何部分仅在至少一个冷却 地区。 在至少一个实施例中，第一裸片是RF功率放大器芯片，而第二裸片是具有控制电路的控制器芯片，控制电路配置成控制作为RF功率放大器类型的至少一个功率放大器。
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公开(公告)号：US20140355222A1
公开(公告)日：2014-12-04
申请号：US13906892
申请日：2013-05-31
Applicant: RF Micro Devices, Inc.
Inventor： Thong Dang , Mohsen Haji-Rahim , Joseph Byron Bullis
CPC classification number: H05K3/4007 , H01L23/3135 , H01L24/97 , H01L2224/04042 , H01L2224/16235 , H01L2224/32225 , H01L2224/48095 , H01L2224/48229 , H01L2224/48235 , H01L2224/48465 , H01L2224/92247 , H01L2224/97 , H01L2924/1421 , H01L2924/1434 , H01L2924/15159 , H01L2924/15192 , H01L2924/15313 , H01L2924/1532 , H01L2924/1533 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H05K1/0218 , H05K1/144 , H05K3/284 , H05K2201/0367 , H05K2201/042 , H05K2201/10371 , Y10T29/4902 , Y10T29/49146 , H01L2224/83 , H01L2224/85 , H01L2224/81 , H01L2924/00012 , H01L2924/00
Abstract: The present disclosure is related to electronic modules for electronic components and methods for manufacturing the same. In one embodiment, an electronic module is formed using a first substrate having a first component area and a second substrate having a second component area. One or more electronic components may be attached to both the first component area and the second component area. The second substrate is mounted over the first substrate such that the second component area faces the first component area. An overmold covers the first component area and the second component area so as to cover the electronic components on both the first component area and the second component area. In this manner, the number of electronic components within the electronic module that can be mounted on an area of a printed circuit board (PCB) is increased.
Abstract translation: 本公开涉及电子部件的电子模块及其制造方法。 在一个实施例中，使用具有第一部件区域的第一基板和具有第二部件区域的第二基板形成电子模块。 一个或多个电子部件可以附接到第一部件区域和第二部件区域。 第二基板安装在第一基板上，使得第二部件区域面向第一部件区域。 包覆成型覆盖第一部件区域和第二部件区域，以覆盖第一部件区域和第二部件区域上的电子部件。 以这种方式，能够安装在印刷电路板（PCB）的区域上的电子模块内的电子部件的数量增加。
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公开(公告)号：US09807890B2
公开(公告)日：2017-10-31
申请号：US13906892
申请日：2013-05-31
Applicant: RF Micro Devices, Inc.
Inventor： Thong Dang , Mohsen Haji-Rahim , Joseph Byron Bullis
CPC classification number: H05K3/4007 , H01L23/3135 , H01L24/97 , H01L2224/04042 , H01L2224/16235 , H01L2224/32225 , H01L2224/48095 , H01L2224/48229 , H01L2224/48235 , H01L2224/48465 , H01L2224/92247 , H01L2224/97 , H01L2924/1421 , H01L2924/1434 , H01L2924/15159 , H01L2924/15192 , H01L2924/15313 , H01L2924/1532 , H01L2924/1533 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H05K1/0218 , H05K1/144 , H05K3/284 , H05K2201/0367 , H05K2201/042 , H05K2201/10371 , Y10T29/4902 , Y10T29/49146 , H01L2224/83 , H01L2224/85 , H01L2224/81 , H01L2924/00012 , H01L2924/00
Abstract: The present disclosure is related to electronic modules for electronic components and methods for manufacturing the same. In one embodiment, an electronic module is formed using a first substrate having a first component area and a second substrate having a second component area. One or more electronic components may be attached to both the first component area and the second component area. The second substrate is mounted over the first substrate such that the second component area faces the first component area. An overmold covers the first component area and the second component area so as to cover the electronic components on both the first component area and the second component area. In this manner, the number of electronic components within the electronic module that can be mounted on an area of a printed circuit board (PCB) is increased.
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公开(公告)号：US09936578B2
公开(公告)日：2018-04-03
申请号：US14517002
申请日：2014-10-17
Applicant: RF Micro Devices, Inc.
Inventor： Thong Dang , Mohsen Haji-Rahim , Mark Charles Held
CPC classification number: H05K1/111 , H01L23/3135 , H01L23/3171 , H01L23/552 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/82 , H01L24/92 , H01L24/97 , H01L2224/24051 , H01L2224/24226 , H01L2224/245 , H01L2224/291 , H01L2224/2919 , H01L2224/32225 , H01L2224/73267 , H01L2224/8201 , H01L2224/82031 , H01L2224/82101 , H01L2224/82136 , H01L2224/92244 , H01L2224/97 , H01L2924/1421 , H01L2924/1434 , H01L2924/1443 , H01L2924/1461 , H01L2924/15159 , H01L2924/15787 , H01L2924/19105 , H05K1/185 , H05K3/284 , H05K9/0022 , H05K2201/0715 , H05K2201/10439 , Y10T29/49016 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , H01L2224/82 , H01L2924/014 , H01L2924/00
Abstract: A shielded electronic module is formed on a substrate. The substrate has a component area and one or more electronic components attached to the component area. One set of conductive pads may be attached to the component area and another set of conductive pads may be provided on the electronic component. The conductive pads on the component area are electrically coupled to the conductive pads of the electronic component by a conductive layer. A first insulating layer is provided over the component area and underneath the conductive layer that may insulate the electronic component and the substrate from the conductive layer. A second insulating layer is provided over the first insulating layer that covers at least the conductive layer. In this manner, the conductive layer is isolated from an electromagnetic shield formed over the component area.
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