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公开(公告)号:US20230019587A1
公开(公告)日:2023-01-19
申请号:US17862338
申请日:2022-07-11
发明人: Guomin YU , Henri NYKÄNEN , Evie KHO
IPC分类号: H01L31/105 , H01L31/0224 , H01L31/0352 , H01L31/18 , G02B6/42
摘要: A semiconductor photodiode. The semiconductor photodiode including: an input waveguide, arranged to receive an optical signal at a first port and provide the optical signal from the second port; a photodiode waveguide, arranged to receive the optical signal from the second port of the input waveguide, and at least partially convert the optical signal into an electrical signal; and an electro-static defence component, located adjacent to the photodiode waveguide. The electro-static defence component and the photodiode waveguide are electrically connected in parallel.
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公开(公告)号:US20190243070A1
公开(公告)日:2019-08-08
申请号:US16317151
申请日:2017-07-13
发明人: John DRAKE , Damiana LEROSE , Henri NYKÄNEN
IPC分类号: G02B6/30
CPC分类号: G02B6/305 , G02B6/12 , G02B6/12004 , G02B6/1223 , G02B6/131 , G02B6/132 , G02B6/1347 , G02B6/136 , G02B6/42 , G02B2006/12038 , G02B2006/12061 , G02B2006/12097 , G02B2006/121 , G02B2006/12147 , G02B2006/12152 , G02B2006/12176 , G02B2006/12178 , G02B2006/12195 , H01L21/76224 , H01L21/7624 , H01L21/76264 , H01L21/823821 , H01L21/8258 , H01S5/021 , H01S5/0216
摘要: An optical mode converter and method of fabricating the same from wafer including a double silicon-on-insulator layer structure. The method comprising: providing a first mask over a portion of a device layer of the DSOI layer structure; etching an unmasked portion of the device layer down to at least an upper buried oxide layer, to provide a cavity; etching a first isolation trench and a second isolation trench into a mode converter layer, the mode converter layer being: on an opposite side of the upper buried oxide layer to the device layer and between the upper buried oxide layer and a lower buried oxide layer, the lower buried oxide layer being above a substrate; wherein the first isolation trench and the second isolation trench define a tapered waveguide; filling the first isolation trench and the second isolation trench with an insulating material, so as to optically isolate the tapered waveguide from the remaining mode converter layer; and regrowing the etched region of the device layer.
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