公开(公告)号：US11226558B2

公开(公告)日：2022-01-18

申请号：US16664994

申请日：2019-10-28

Applicant: ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.

Inventor： Kahee Shin ,  Eun-Young Lee ,  Jong-Ho Na ,  Geun Huh

IPC: G03F7/023 ,  G03F7/033 ,  G03F7/039 ,  C08F220/14 ,  G03F7/031

Abstract: The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The composition comprises a photopolymerizable compound containing a double bond and a specific photopolymerization initiator, wherein the photopolymerizable compound containing a double bond suppresses the photopolymerization reaction upon exposure to light but causes the photopolymerization reaction at the time of photobleaching after development, thereby controlling the flowability of the composition during thermal curing. Thus, a pattern is readily formed, which makes it possible to maintain excellent sensitivity upon the development and even upon the hard-bake process after the development, and it is possible to provide a cured film that is excellent in film strength and film retention rate.