Positive-type photosensitive resin composition and cured film prepared therefrom

    公开(公告)号:US11226558B2

    公开(公告)日:2022-01-18

    申请号:US16664994

    申请日:2019-10-28

    Abstract: The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The composition comprises a photopolymerizable compound containing a double bond and a specific photopolymerization initiator, wherein the photopolymerizable compound containing a double bond suppresses the photopolymerization reaction upon exposure to light but causes the photopolymerization reaction at the time of photobleaching after development, thereby controlling the flowability of the composition during thermal curing. Thus, a pattern is readily formed, which makes it possible to maintain excellent sensitivity upon the development and even upon the hard-bake process after the development, and it is possible to provide a cured film that is excellent in film strength and film retention rate.

    COLORED PHOTOSENSITIVE RESIN COMPOSITION AND LIGHT SHIELDING SPACER PREPARED THEREFROM

    公开(公告)号:US20180356722A1

    公开(公告)日:2018-12-13

    申请号:US15993645

    申请日:2018-05-31

    Abstract: The present invention relates to a colored photosensitive resin composition and to a light shielding spacer produced therefrom. The colored photosensitive resin composition comprises epoxy groups and double bonds in a specific molar ratio and an oxime ester fluorene-based photopolymerization initiator in a smaller amount than a conventional oxime ester-based photopolymerization initiator, so that it has excellent photo-curing characteristics. As a result, it is possible to improve the high sensitivity characteristics such as resolution and step difference even with a small amount of light. Specifically, since the curing characteristics of the film surface is improved, it is to possible to reduce the generation of outgassing, which is a contamination source that may be generated when the film is dried. In addition, the colored photosensitive resin composition is capable of forming a cured film that minimizes the generation of uneven wrinkles on its surface. Accordingly, the colored photosensitive resin composition can be advantageously used as a material for forming a light shielding spacer such as a black column spacer to be employed in various electronic parts inclusive of a liquid crystal display (LCD) panel and an organic light emitting diode (OLED) display panel.

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