公开(公告)号：US20150332842A1

公开(公告)日：2015-11-19

申请号：US14713684

申请日：2015-05-15

Applicant: ROHM CO., LTD.

Inventor： Takuma SHIMOICHI ,  Yasuhiro KONDO ,  Keishi WATANABE ,  Takamichi TORII ,  Katsuya MATSUURA

IPC: H01F27/29 ,  H01F27/28 ,  H01G4/30 ,  H01G4/228 ,  H01C1/01 ,  H01C1/14

CPC classification number: H01C1/01 ,  H01C1/02 ,  H01C1/14 ,  H01C1/142 ,  H01C7/006 ,  H01C13/02 ,  H01C17/267 ,  H01F17/0006 ,  H01F27/2804 ,  H01F27/292 ,  H01F2017/0026 ,  H01G4/228 ,  H01G4/30 ,  H01G4/33 ,  H01L23/5228 ,  H01L23/647 ,  H01L28/20 ,  H05K1/0293 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167

Abstract: A chip part is provided that includes a substrate 2 in which an element region 5 and an electrode region 16 are set, an insulating film (a first insulating film 9 and a second insulating film 3) which is formed on the substrate 2 and which selectively includes an internal concave/convex structure 18 in the electrode region 16 on a surface, a first connection electrode 3 and a second connection electrode 4 which include, at a bottom portion, an anchor portion 24 entering the concave portion 17 of the internal concave/convex structure 18 and which include an external concave/convex structure 6, 7 on a surface on the opposite side and a circuit element which is disposed in the element region 5 and which is electrically connected to the first connection electrode 3 and the second connection electrode 4.

Abstract translation: 提供了芯片部件，其包括其中设置有元件区域5和电极区域16的基板2，形成在基板2上的绝缘膜（第一绝缘膜9和第二绝缘膜3），并且选择性地 包括在表面上的电极区域16中的内部凹凸结构18，第一连接电极3和第二连接电极4，第一连接电极3和第二连接电极4在底部包括进入内凹/ 凸形结构18，其在相反侧的表面上包括外部凹凸结构6,7，以及设置在元件区域5中并与第一连接电极3和第二连接电极电连接的电路元件 4。

公开(公告)号：US20180005732A1

公开(公告)日：2018-01-04

申请号：US15703954

申请日：2017-09-13

Applicant: ROHM CO., LTD.

Inventor： Takuma SHIMOICHI ,  Yasuhiro KONDO ,  Keishi WATANABE ,  Takamichi TORII ,  Katsuya MATSUURA

IPC: H01C1/01 ,  H01G4/228 ,  H01F17/00 ,  H01C1/14 ,  H01F27/28 ,  H01G4/30 ,  H01F27/29

Abstract: A chip part is provided that includes a substrate in which an element region and an electrode region are set, an insulating film (a first insulating film and a second insulating film) which is formed on the substrate and which selectively includes an internal concave/convex structure in the electrode region on a surface, a first connection electrode and a second connection electrode which include, at a bottom portion, an anchor portion entering the concave portion of the internal concave/convex structure and which include an external concave/convex structure on a surface on the opposite side and a circuit element which is disposed in the element region and which is electrically connected to the first connection electrode and the second connection electrode.