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    CHIP INDUCTOR AND METHOD FOR MANUFACTURING THE SAME
    2.
    发明申请
    CHIP INDUCTOR AND METHOD FOR MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20180286561A1

    公开(公告)日：2018-10-04

    申请号：US15940002

    申请日：2018-03-29

    Applicant: ROHM CO., LTD.

    Inventor： Takuma SHIMOICHI

    IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F41/12 ,  H01F41/04

    Abstract: A chip inductor includes a sealing body having a mounting surface and a coil conductor sealed in an interior of the sealing body, wherein the coil conductor includes a first coil end exposed from the mounting surface of the sealing body, a second coil end exposed from the mounting surface of the sealing body, and a spiral portion of spiral form connected to the first coil end and the second coil end and routed along a normal direction of the mounting surface of the sealing body from the first coil end and the second coil end.

    CHIP INDUCTOR AND METHOD FOR MANUFACTURING THE SAME
    3.
    发明申请
    CHIP INDUCTOR AND METHOD FOR MANUFACTURING THE SAME 有权

    公开(公告)号：US20210350970A1

    公开(公告)日：2021-11-11

    申请号：US17381633

    申请日：2021-07-21

    Applicant: ROHM CO., LTD.

    Inventor： Takuma SHIMOICHI

    IPC: H01F27/28 ,  H01F27/29 ,  H01F41/04 ,  H01F41/12 ,  H01F27/32 ,  H01F41/10 ,  H01F17/00

    Abstract: A chip inductor includes a sealing body having a mounting surface and a coil conductor sealed in an interior of the sealing body, wherein the coil conductor includes a first coil end exposed from the mounting surface of the sealing body, a second coil end exposed from the mounting surface of the sealing body, and a spiral portion of spiral form connected to the first coil end and the second coil end and routed along a normal direction of the mounting surface of the sealing body from the first coil end and the second coil end.

    CHIP PARTS
    4.
    发明申请
    CHIP PARTS 有权
    芯片部件

    公开(公告)号：US20150332842A1

    公开(公告)日：2015-11-19

    申请号：US14713684

    申请日：2015-05-15

    Applicant: ROHM CO., LTD.

    Inventor： Takuma SHIMOICHI ,  Yasuhiro KONDO ,  Keishi WATANABE ,  Takamichi TORII ,  Katsuya MATSUURA

    IPC: H01F27/29 ,  H01F27/28 ,  H01G4/30 ,  H01G4/228 ,  H01C1/01 ,  H01C1/14

    CPC classification number: H01C1/01 ,  H01C1/02 ,  H01C1/14 ,  H01C1/142 ,  H01C7/006 ,  H01C13/02 ,  H01C17/267 ,  H01F17/0006 ,  H01F27/2804 ,  H01F27/292 ,  H01F2017/0026 ,  H01G4/228 ,  H01G4/30 ,  H01G4/33 ,  H01L23/5228 ,  H01L23/647 ,  H01L28/20 ,  H05K1/0293 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167

    Abstract: A chip part is provided that includes a substrate 2 in which an element region 5 and an electrode region 16 are set, an insulating film (a first insulating film 9 and a second insulating film 3) which is formed on the substrate 2 and which selectively includes an internal concave/convex structure 18 in the electrode region 16 on a surface, a first connection electrode 3 and a second connection electrode 4 which include, at a bottom portion, an anchor portion 24 entering the concave portion 17 of the internal concave/convex structure 18 and which include an external concave/convex structure 6, 7 on a surface on the opposite side and a circuit element which is disposed in the element region 5 and which is electrically connected to the first connection electrode 3 and the second connection electrode 4.

    Abstract translation: 提供了芯片部件，其包括其中设置有元件区域5和电极区域16的基板2，形成在基板2上的绝缘膜（第一绝缘膜9和第二绝缘膜3），并且选择性地 包括在表面上的电极区域16中的内部凹凸结构18，第一连接电极3和第二连接电极4，第一连接电极3和第二连接电极4在底部包括进入内凹/ 凸形结构18，其在相反侧的表面上包括外部凹凸结构6,7，以及设置在元件区域5中并与第一连接电极3和第二连接电极电连接的电路元件 4。

    CHIP PARTS
    6.
    发明申请
    CHIP PARTS 审中-公开

    公开(公告)号：US20180005732A1

    公开(公告)日：2018-01-04

    申请号：US15703954

    申请日：2017-09-13

    Applicant: ROHM CO., LTD.

    Inventor： Takuma SHIMOICHI ,  Yasuhiro KONDO ,  Keishi WATANABE ,  Takamichi TORII ,  Katsuya MATSUURA

    IPC: H01C1/01 ,  H01G4/228 ,  H01F17/00 ,  H01C1/14 ,  H01F27/28 ,  H01G4/30 ,  H01F27/29

    Abstract: A chip part is provided that includes a substrate in which an element region and an electrode region are set, an insulating film (a first insulating film and a second insulating film) which is formed on the substrate and which selectively includes an internal concave/convex structure in the electrode region on a surface, a first connection electrode and a second connection electrode which include, at a bottom portion, an anchor portion entering the concave portion of the internal concave/convex structure and which include an external concave/convex structure on a surface on the opposite side and a circuit element which is disposed in the element region and which is electrically connected to the first connection electrode and the second connection electrode.

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