公开(公告)号：US20240052476A1

公开(公告)日：2024-02-15

申请号：US18233582

申请日：2023-08-14

Applicant: RTX Corporation

Inventor： Brian T. Hazel ,  Michael J. Maloney ,  James W. Neal ,  David A. Litton

IPC: C23C14/30 ,  C23C14/24 ,  C23C14/22 ,  C23C14/50

CPC classification number: C23C14/30 ,  C23C14/243 ,  C23C14/228 ,  C23C14/246 ,  C23C14/505

Abstract: A deposition apparatus (20) comprising: a chamber (22); a process gas source (62) coupled to the chamber; a vacuum pump (52) coupled to the chamber; at least two electron guns (26); one or more power supplies (30) coupled to the electron guns; a plurality of crucibles (32,33,34) positioned or positionable in an operative position within a field of view of at least one said electron gun; and a part holder (170) having at least one operative position for holding parts spaced above the crucibles by a standoff height H. The standoff height H is adjustable in a range including at least 22 inches.

公开(公告)号：US12227832B2

公开(公告)日：2025-02-18

申请号：US18233582

申请日：2023-08-14

Applicant: RTX Corporation

Inventor： Brian T. Hazel ,  Michael J. Maloney ,  James W. Neal ,  David A. Litton

IPC: C23C14/30 ,  C23C14/22 ,  C23C14/24 ,  C23C14/50

Abstract: A deposition apparatus (20) comprising: a chamber (22); a process gas source (62) coupled to the chamber; a vacuum pump (52) coupled to the chamber; at least two electron guns (26); one or more power supplies (30) coupled to the electron guns; a plurality of crucibles (32,33,34) positioned or positionable in an operative position within a field of view of at least one said electron gun; and a part holder (170) having at least one operative position for holding parts spaced above the crucibles by a standoff height H. The standoff height H is adjustable in a range including at least 22 inches.

公开(公告)号：US20240068102A1

公开(公告)日：2024-02-29

申请号：US18385204

申请日：2023-10-30

Applicant: RTX Corporation

Inventor： James W. Neal ,  David A. Litton ,  Brian T. Hazel ,  Michael J. Maloney ,  Eric M. Jorzik

IPC: C23C16/46 ,  C23C14/08 ,  C23C14/22 ,  C23C14/50 ,  C23C14/56 ,  C23C16/455 ,  C23C16/458

CPC classification number: C23C16/463 ,  C23C14/083 ,  C23C14/22 ,  C23C14/50 ,  C23C14/505 ,  C23C14/56 ,  C23C14/566 ,  C23C16/455 ,  C23C16/458 ,  C23C16/46 ,  C23C14/30

Abstract: A deposition apparatus comprises: an infeed chamber; a preheat chamber; a deposition chamber; and optionally at least one of a cooldown chamber and an outlet chamber. At least a first of the preheat chamber and the cooldown chamber contains a buffer system for buffering workpieces respectively passing to or from the deposition chamber.