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    FILTERED FEEDTHROUGH ASSEMBLY AND METHOD OF MANUFACTURE
    1.
    发明申请
    FILTERED FEEDTHROUGH ASSEMBLY AND METHOD OF MANUFACTURE 有权
    过滤生产的组装和制造方法

    公开(公告)号：US20080033496A1

    公开(公告)日：2008-02-07

    申请号：US11872452

    申请日：2007-10-15

    申请人： Rajesh Iyer ,  Susan Tettemer ,  John Tardiff ,  Shawn Knowles

    发明人： Rajesh Iyer ,  Susan Tettemer ,  John Tardiff ,  Shawn Knowles

    IPC分类号： A61N1/362 ,  H01G4/35

    CPC分类号： H01G4/242 ,  H01G2/106 ,  H01G4/35 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49078 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T29/49171 ,  Y10T29/49176

    摘要： A method for attaching a capacitor to the feedthrough assembly of a medical device is provided. The capacitor includes a lower surface, and the feedthrough assembly includes a ferrule having a cavity therethrough for receiving at least one terminal pin. The feedthrough assembly is configured to be coupled to the medical device, and the cavity is configured to receive therein an insulating structure having an upper surface. The method comprises threading a first washer over the terminal pin, and placing a body of epoxy in contact with the first washer. The capacitor is positioned over the terminal pin such that the first washer and the body of epoxy are between the lower surface of the capacitor and the upper surface of the insulating structure. The body of epoxy is cured to couple the capacitor to the insulating structure. During curing, the body of epoxy is substantially confined between the upper surface and the lower surface by the ferrule, the insulating structure, the capacitor, and the first washer.

    摘要翻译： 提供了一种用于将电容器附接到医疗装置的馈通组件的方法。 电容器包括下表面，并且馈通组件包括具有穿过其中的空腔的套圈，用于容纳至少一个端子销。 馈通组件被配置为联接到医疗装置，并且空腔构造成在其中容纳具有上表面的绝缘结构。 该方法包括将第一垫圈穿过端子销，并将环氧体与第一垫圈接触。 电容器位于端子销上方，使得第一垫圈和环氧树脂体位于电容器的下表面和绝缘结构的上表面之间。 环氧树脂体被固化以将电容器耦合到绝缘结构。 在固化期间，环氧树脂体通过套圈，绝缘结构，电容器和第一垫圈基本上限制在上表面和下表面之间。

    A METHOD OF ATTACHING A CAPACITOR TO A FEEDTHROUGH ASSEMBLY OF A MEDICAL DEVICE
    2.
    发明申请
    A METHOD OF ATTACHING A CAPACITOR TO A FEEDTHROUGH ASSEMBLY OF A MEDICAL DEVICE 有权
    将电容器连接到医疗装置的有形组装的方法

    公开(公告)号：US20070234540A1

    公开(公告)日：2007-10-11

    申请号：US11278291

    申请日：2006-03-31

    申请人： Rajesh Iyer ,  Susan Tettemer ,  John Tardiff ,  Shawn Knowles

    发明人： Rajesh Iyer ,  Susan Tettemer ,  John Tardiff ,  Shawn Knowles

    IPC分类号： H01G7/00

    CPC分类号： H01G4/242 ,  H01G2/106 ,  H01G4/35 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49078 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T29/49171 ,  Y10T29/49176

    摘要： A method for attaching a capacitor to the feedthrough assembly of a medical device having a terminal pin comprises threading a first washer over the terminal pin, and placing a body of epoxy in contact with the first washer. The capacitor is positioned over the terminal pin such that the first washer and the body of epoxy are between the lower surface of the capacitor and a support surface. The body of epoxy is cured to couple the capacitor to the insulating structure. During curing, the body of epoxy is substantially confined between the upper surface and the lower surface by the ferrule, the insulating structure, the capacitor, and the first washer.

    摘要翻译： 用于将电容器附接到具有端子销的医疗装置的馈通组件的方法包括：在端子销上穿过第一垫圈，并且将环氧体与第一垫圈接触。 电容器位于端子销上方，使得第一垫圈和环氧树脂体位于电容器的下表面和支撑表面之间。 环氧树脂体被固化以将电容器耦合到绝缘结构。 在固化期间，环氧树脂体通过套圈，绝缘结构，电容器和第一垫圈基本上限制在上表面和下表面之间。

    Implantable medical device feedthrough assembly including flange plate
    3.
    发明申请
    Implantable medical device feedthrough assembly including flange plate 有权
    植入式医疗器械馈通组件包括法兰盘

    公开(公告)号：US20070179553A1

    公开(公告)日：2007-08-02

    申请号：US11343056

    申请日：2006-01-30

    申请人： Rajesh Iyer ,  Shawn Knowles

    发明人： Rajesh Iyer ,  Shawn Knowles

    IPC分类号： A61N1/00

    CPC分类号： A61N1/3754

    摘要： A medical device feedthrough assembly includes a flange plate formed with a plurality of receptacles. A feedthrough subassembly is mounted within each of the receptacles, and a ferrule of each subassembly is coupled to the flange plate.

    摘要翻译： 医疗装置馈通组件包括形成有多个容器的凸缘板。 馈通子组件安装在每个插座内，并且每个子组件的套圈联接到凸缘板。

    Filtered feedthrough assembly
    4.
    发明申请
    Filtered feedthrough assembly 审中-公开
    过滤馈通组件

    公开(公告)号：US20070203529A1

    公开(公告)日：2007-08-30

    申请号：US11363642

    申请日：2006-02-28

    申请人： Rajesh Iyer ,  Shawn Knowles

    发明人： Rajesh Iyer ,  Shawn Knowles

    IPC分类号： A61N1/375

    CPC分类号： H01R13/7195 ,  A61N1/3718 ,  A61N1/3754 ,  H01R13/6658 ,  H01R2201/12

    摘要： A filter apparatus for use with an implantable medical device includes a printed circuit board having a first trace connected to ground and adjacent feedthrough conductors extending through the printed circuit board. A chip capacitor is electrically connected between the adjacent feedthrough conductors, and is further electrically connected to the first trace on the printed circuit board.

    摘要翻译： 用于可植入医疗装置的过滤器装置包括具有连接到地面的第一迹线和延伸穿过印刷电路板的相邻馈通导体的印刷电路板。 片状电容器电连接在相邻的馈通导体之间，并进一步电连接到印刷电路板上的第一迹线。

    Filtered electrical interconnect assembly
    5.
    发明申请
    Filtered electrical interconnect assembly 有权
    过滤电气互连组件

    公开(公告)号：US20070179551A1

    公开(公告)日：2007-08-02

    申请号：US11343174

    申请日：2006-01-30

    申请人： Rajesh Iyer ,  Shawn Knowles

    发明人： Rajesh Iyer ,  Shawn Knowles

    IPC分类号： A61N1/00

    CPC分类号： A61N1/3754

    摘要： An electronic module assembly for an implantable medical device includes a non-conductive block having an opening for accepting a feedthrough conductor. The block has opposite first and second ends and opposite first and second sides. A bond pad is located on the first end of the block for electrical connection to a feedthrough conductor, and the bond pad extends to the first side of the block to provide an electrical connection region there.

    摘要翻译： 用于可植入医疗装置的电子模块组件包括具有用于接受馈通导体的开口的非导电块。 该块具有相对的第一和第二端以及相对的第一和第二侧。 接合焊盘位于块的第一端上，用于电连接到馈通导体，并且接合焊盘延伸到块的第一侧以在其中提供电连接区域。

    Multi-polar feedthrough array for analog communication with implantable medical device circuitry
    7.
    发明申请
    Multi-polar feedthrough array for analog communication with implantable medical device circuitry 有权
    用于与可植入医疗设备电路的模拟通信的多极馈通阵列

    公开(公告)号：US20060009813A1

    公开(公告)日：2006-01-12

    申请号：US10889771

    申请日：2004-07-12

    申请人： William Taylor ,  Shawn Knowles ,  John Olson

    发明人： William Taylor ,  Shawn Knowles ,  John Olson

    IPC分类号： A61N1/375

    CPC分类号： A61N1/05 ,  A61N1/3718 ,  A61N1/3754 ,  H01G4/35 ,  H01R13/7197 ,  H01R2201/12

    摘要： According to one aspect of the invention, an improved multi-polar feedthrough array employs a particular metallic ferrule material for improved dimensional stability during initial fabrication and sustained hermetic operation. According to the invention, the IMD enclosure consists of grade 2 titanium and the ferrule material comprises grade 4 titanium or grade 5 titanium. In one form of the invention, the multi-polar feedthrough assembly comprises a filtered feedthrough array (e.g., employing capacitive filters coupled to the electrically conductive pins or serpentine conductors of the array). According to another aspect of the invention, the improved multi-polar feedthrough array incorporates additional pins, thus further increasing the footprint of the array, and the additional pins provide analog electrical communication between operative circuitry inside an IMD and analog components external to the IMD.

    摘要翻译： 根据本发明的一个方面，改进的多极馈通阵列采用特定的金属套圈材料，用于在初始制造和持续密封操作期间改善尺寸稳定性。 根据本发明，IMD外壳由2级钛组成，套管材料包括4级钛或5级钛。 在本发明的一种形式中，多极馈通组件包括滤波的馈通阵列（例如，使用耦合到阵列的导电引脚或蛇形导体的电容滤波器）。 根据本发明的另一方面，改进的多极馈通阵列包括额外的引脚，从而进一步增加阵列的覆盖区，并且附加引脚在IMD内部的操作电路和IMD外部的模拟组件之间提供模拟电气通信。

    Glass-to-metal feedthrough seals having improved durability particularly under AC or DC bias
    9.
    发明申请
    Glass-to-metal feedthrough seals having improved durability particularly under AC or DC bias 审中-公开
    玻璃 - 金属馈通密封件具有改善的耐久性，特别是在AC或DC偏压下

    公开(公告)号：US20060247714A1

    公开(公告)日：2006-11-02

    申请号：US11116968

    申请日：2005-04-28

    申请人： William Taylor ,  Zhi Fang ,  William Wolf ,  Shawn Knowles

    发明人： William Taylor ,  Zhi Fang ,  William Wolf ,  Shawn Knowles

    IPC分类号： A61N1/375

    CPC分类号： A61N1/3754

    摘要： A hermetic implantable medical device (IMD) is provided with a single or multi-pin arrangement including selected glass to metal seals for a feedthrough including a ceramic disk member coupled to the sealing glass surface in potential contact with body fluids. By judicious selection of component materials (ferrule, seal insulator and pin) provides for either compression or match seals for electrical feedthroughs (having a single or multi-pin array) provide corrosion resistance and biocompatibility required in IMDs. The resultant feedthrough configuration accommodates one pin within a single ferrule or at least two pins in a single ferrule having a pin surrounded by insulator material (e.g., alumina ceramic, zirconia ceramic, zirconia silicate ceramic, mullite, each having higher melting points than the sealing glass distributed around the pin within the ferrule, or feldspar porcelain materials or alumino-silicate glasses having a lower melting point than the sealing glass) distributed around the pin within the ferrule.

    摘要翻译： 密封可植入医疗装置（IMD）设置有单针或多针布置，包括用于馈通的选定的玻璃与金属密封件，包括联接到与体液潜在接触的密封玻璃表面的陶瓷盘构件。 通过明智选择组件材料（套圈，密封绝缘子和销）可为电气馈通（具有单针或多针阵列）提供压缩或匹配密封，提供IMD中要求的耐腐蚀性和生物相容性。 所产生的馈通配置在单个套圈内容纳一个销或在单个套圈中的至少两个销，其中具有由绝缘体材料包围的销（例如，氧化铝陶瓷，氧化锆陶瓷，氧化锆硅酸盐陶瓷，莫来石，其熔点比密封件高 围绕套圈内的销分布的玻璃分布在套圈周围的销子周围，或者具有比密封玻璃更低的熔点的长石瓷材料或铝硅酸盐玻璃）。