Electrical detection of V-groove width
    4.
    发明授权
    Electrical detection of V-groove width 有权
    V型槽宽电气检测

    公开(公告)号:US06396297B1

    公开(公告)日:2002-05-28

    申请号:US09736803

    申请日:2000-12-14

    IPC分类号: G01R3126

    摘要: An apparatus detects the width of a V-groove formed on a semiconductor wafer. A resistor overlaps a chip area and an area upon which the V-groove is to be etched on the wafer. A pad etched on the silicon wafer is coupled to the resistor. A tester supplies voltage to the pad after the V-groove has been etched into the silicon wafer; and a circuit coupled to the pad determines the width of the etched V-groove.

    摘要翻译: 一种装置检测形成在半导体晶片上的V形槽的宽度。 一个电阻器重叠在晶片上的芯片区域和要蚀刻V形槽的区域。 在硅晶片上蚀刻的焊盘耦合到电阻器。 在V沟被蚀刻到硅晶片之后,测试仪向焊盘提供电压; 并且耦合到焊盘的电路确定蚀刻的V形槽的宽度。

    Highly integrated wafer bonded MEMS devices with release-free membrane manufacture for high density print heads
    5.
    发明授权
    Highly integrated wafer bonded MEMS devices with release-free membrane manufacture for high density print heads 有权
    高度集成的晶片粘合MEMS器件,具有无释放膜制造用于高密度打印头

    公开(公告)号:US08455271B2

    公开(公告)日:2013-06-04

    申请号:US11693209

    申请日:2007-03-29

    IPC分类号: H01L21/00 B41J2/135

    摘要: A method of fabricating a MEMS inkjet type print head and the resulting device is disclosed. The method includes providing a driver component and separately providing an actuatable membrane component, the actuatable membrane component being formed in the absence of an acid etch removing a sacrificial layer. The separately provided actuatable membrane component is bonded to the driver component and a nozzle plate is attached to the actuatable membrane component subsequent to the bonding. Separately fabricating the components removes the need for hydrofluoric acid etch removal of a sacrificial layer previously required for forming the actuatable membrane with respect to the driver component.

    摘要翻译: 公开了制造MEMS喷墨型打印头的方法和所得到的装置。 该方法包括提供驱动器部件并且单独地提供可致动的膜部件,可致动的膜部件在不存在去除牺牲层的酸蚀刻的情况下形成。 单独提供的致动膜部件被结合到驱动器部件,并且在接合之后将喷嘴板附接到可致动膜部件。 单独制造组件不需要先前为相对于驱动器部件形成可致动膜所需的牺牲层的氢氟酸蚀刻去除。

    HIGHLY INTEGRATED WAFER BONDED MEMS DEVICES WITH RELEASE-FREE MEMBRANE MANUFACTURE FOR HIGH DENSITY PRINT HEADS
    6.
    发明申请
    HIGHLY INTEGRATED WAFER BONDED MEMS DEVICES WITH RELEASE-FREE MEMBRANE MANUFACTURE FOR HIGH DENSITY PRINT HEADS 有权
    具有高密度打印头的无释放膜制造的高度集成的波形粘结MEMS器件

    公开(公告)号:US20080238997A1

    公开(公告)日:2008-10-02

    申请号:US11693209

    申请日:2007-03-29

    IPC分类号: B41J2/145 H01L21/00

    摘要: A method of fabricating a MEMS inkjet type print head and the resulting device is disclosed. The method includes providing a driver component and separately providing an actuatable membrane component, the actuatable membrane component being formed in the absence of an acid etch removing a sacrificial layer. The separately provided actuatable membrane component is bonded to the driver component and a nozzle plate is attached to the actuatable membrane component subsequent to the bonding. Separately fabricating the components removes the need for hydrofluoric acid etch removal of a sacrificial layer previously required for forming the actuatable membrane with respect to the driver component.

    摘要翻译: 公开了制造MEMS喷墨型打印头的方法和所得到的装置。 该方法包括提供驱动器部件并且单独地提供可致动的膜部件,可致动的膜部件在不存在去除牺牲层的酸蚀刻的情况下形成。 单独提供的致动膜部件被结合到驱动器部件,并且在接合之后将喷嘴板附接到可致动膜部件。 单独制造组件不需要先前为相对于驱动器部件形成可致动膜所需的牺牲层的氢氟酸蚀刻去除。