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公开(公告)号:US20050007721A1
公开(公告)日:2005-01-13
申请号:US10615413
申请日:2003-07-08
申请人: Ramam Akkipeddi , Christopher Sperring , Siew Toh , Cho Tay , Mustafizur Rahman , Soo Chua
发明人: Ramam Akkipeddi , Christopher Sperring , Siew Toh , Cho Tay , Mustafizur Rahman , Soo Chua
CPC分类号: G01L1/2293
摘要: A contact pressure sensor (10) and method for manufacturing a contact pressure sensor for detecting contact pressure between two surfaces is disclosed. The contact pressure sensor disclosed comprises a substrate (40) for supporting the sensor and a contact pressure sensitive layer (26) sensitive to pressure applied to the contact pressure sensor. The method disclosed also comprises transferring a process post structure (8) that is formed on a first process support substrate (20) from the first process support substrate to a second contact pressure sensor support substrate (40).
摘要翻译: 公开了一种用于制造用于检测两个表面之间的接触压力的接触压力传感器的接触压力传感器(10)和方法。 所公开的接触压力传感器包括用于支撑传感器的基板(40)和对施加到接触压力传感器的压力敏感的接触压敏层(26)。 所公开的方法还包括将形成在第一工艺支撑衬底(20)上的工艺柱结构(8)从第一工艺支撑衬底转移到第二接触压力传感器支撑衬底(40)。
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公开(公告)号:US07127949B2
公开(公告)日:2006-10-31
申请号:US10615413
申请日:2003-07-08
申请人: Ramam Akkipeddi , Christopher P Sperring , Siew Lok Toh , Cho Jui Tay , Mustafizur Rahman , Soo Jin Chua
发明人: Ramam Akkipeddi , Christopher P Sperring , Siew Lok Toh , Cho Jui Tay , Mustafizur Rahman , Soo Jin Chua
IPC分类号: G01B7/16
CPC分类号: G01L1/2293
摘要: A contact pressure sensor (10) and method for manufacturing a contact pressure sensor for detecting contact pressure between two surfaces is disclosed. The contact pressure sensor disclosed comprises a substrate (40) for supporting the sensor and a contact pressure sensitive layer (26) sensitive to pressure applied to the contact pressure sensor. The method disclosed also comprises transferring a process post structure (8) that is formed on a first process support substrate (20) from the first process support substrate to a second contact pressure sensor support substrate (40).
摘要翻译: 公开了一种用于制造用于检测两个表面之间的接触压力的接触压力传感器的接触压力传感器(10)和方法。 所公开的接触压力传感器包括用于支撑传感器的基板(40)和对施加到接触压力传感器的压力敏感的接触压敏层(26)。 所公开的方法还包括将形成在第一工艺支撑衬底(20)上的工艺柱结构(8)从第一工艺支撑衬底转移到第二接触压力传感器支撑衬底(40)。
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3.
公开(公告)号:US07208096B2
公开(公告)日:2007-04-24
申请号:US10602714
申请日:2003-06-25
CPC分类号: H01S5/0201 , H01S5/0014 , H01S5/0202 , H01S5/0213 , H01S2304/12
摘要: A laser device has a substrate and at least one GaN-based layer upon a first surface of the substrate, and the laser device is cleaved by cutting linear grooves into a second surface of the substrate such that the grooves are in alignment with vertical planes of the substrate. The substrate and the at least one GaN-based layer are cleaved along the vertical planes. The cutting is performed using a laser beam from an external laser source.
摘要翻译: 激光装置在衬底的第一表面上具有衬底和至少一个GaN基层,并且激光器件通过将线性沟槽切割到衬底的第二表面而被切割,使得沟槽与 底物。 衬底和至少一个GaN基层沿垂直平面切割。 使用来自外部激光源的激光束进行切割。
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