Contact pressure sensor and method for manufacturing the same
    1.
    发明申请
    Contact pressure sensor and method for manufacturing the same 有权
    接触式压力传感器及其制造方法

    公开(公告)号:US20050007721A1

    公开(公告)日:2005-01-13

    申请号:US10615413

    申请日:2003-07-08

    IPC分类号: G01L1/22 H01H47/12

    CPC分类号: G01L1/2293

    摘要: A contact pressure sensor (10) and method for manufacturing a contact pressure sensor for detecting contact pressure between two surfaces is disclosed. The contact pressure sensor disclosed comprises a substrate (40) for supporting the sensor and a contact pressure sensitive layer (26) sensitive to pressure applied to the contact pressure sensor. The method disclosed also comprises transferring a process post structure (8) that is formed on a first process support substrate (20) from the first process support substrate to a second contact pressure sensor support substrate (40).

    摘要翻译: 公开了一种用于制造用于检测两个表面之间的接触压力的接触压力传感器的接触压力传感器(10)和方法。 所公开的接触压力传感器包括用于支撑传感器的基板(40)和对施加到接触压力传感器的压力敏感的接触压敏层(26)。 所公开的方法还包括将形成在第一工艺支撑衬底(20)上的工艺柱结构(8)从第一工艺支撑衬底转移到第二接触压力传感器支撑衬底(40)。

    Contact pressure sensor and method for manufacturing the same
    2.
    发明授权
    Contact pressure sensor and method for manufacturing the same 有权
    接触式压力传感器及其制造方法

    公开(公告)号:US07127949B2

    公开(公告)日:2006-10-31

    申请号:US10615413

    申请日:2003-07-08

    IPC分类号: G01B7/16

    CPC分类号: G01L1/2293

    摘要: A contact pressure sensor (10) and method for manufacturing a contact pressure sensor for detecting contact pressure between two surfaces is disclosed. The contact pressure sensor disclosed comprises a substrate (40) for supporting the sensor and a contact pressure sensitive layer (26) sensitive to pressure applied to the contact pressure sensor. The method disclosed also comprises transferring a process post structure (8) that is formed on a first process support substrate (20) from the first process support substrate to a second contact pressure sensor support substrate (40).

    摘要翻译: 公开了一种用于制造用于检测两个表面之间的接触压力的接触压力传感器的接触压力传感器(10)和方法。 所公开的接触压力传感器包括用于支撑传感器的基板(40)和对施加到接触压力传感器的压力敏感的接触压敏层(26)。 所公开的方法还包括将形成在第一工艺支撑衬底(20)上的工艺柱结构(8)从第一工艺支撑衬底转移到第二接触压力传感器支撑衬底(40)。