摘要:
A sensor apparatus for measuring a plasma process parameter for processing a workpiece. The sensor apparatus includes a base, an information processor supported on or in the base, and at least one sensor supported on or in the base. The at least one sensor includes at least one sensing element configured for measuring an electrical property of a plasma and may include a transducer coupled to the at least one sensing element. The transducer can be configured to receive a signal from the sensing element and convert the signal into a second signal for input to the information processor.
摘要:
A sensor apparatus for measuring a plasma process parameter for processing a workpiece. The sensor apparatus includes a base, an information processor supported on or in the base, and at least one sensor supported on or in the base. The at least one sensor includes at least one sensing element configured for measuring an electrical property of a plasma and may include a transducer coupled to the at least one sensing element. The transducer can be configured to receive a signal from the sensing element and convert the signal into a second signal for input to the information processor.
摘要:
A sensor apparatus for measuring a plasma process parameter for processing a workpiece. The sensor apparatus includes a base, an information processor supported on or in the base, and at least one sensor supported on or in the base. The at least one sensor includes at least one sensing element configured for measuring an electrical property of a plasma and at least one transducer coupled to the at least one sensing element. The transducer is configured so as to receive a signal from the sensing element and converting the signal into a second signal for input to the information processor.
摘要:
Data are collected for deriving response models and information required for developing and maintaining processes and process tools. Methods and apparatus for collecting the data include a sensor apparatus capable of collecting data with less perturbation and fewer disruptions than is usually possible using standard methods. The sensor apparatus is capable of being loaded into a process tool. From within the process tool, the sensor apparatus is capable of measuring data, processing data, storing data, and transmitting data. The sensor apparatus has capabilities for near real time data collection and communication.
摘要:
One or more problems related to processing workpieces using processes that involve optical radiation are presented along with solutions to one or more of the problems. One embodiment of the invention comprises a sensor apparatus for collecting optical radiation data representing one or more process conditions used for processing a workpiece. In a further embodiment, the sensor apparatus is also configured for measuring data other than optical radiation.
摘要:
Some problems related to processing workpieces are presented along with solutions to one or more of the problems. One embodiment of the invention comprises a sensor apparatus for collecting data representing one or more process conditions used for processing a workpiece. Another embodiment of the present invention is a combination comprising a sensor apparatus and a process tool for applications such as chemical mechanical planarization of workpieces and chemical mechanical polishing of workpieces.
摘要:
Data are collected for deriving response models and information required for developing and maintaining processes and process tools. Methods and apparatus for collecting the data include a process tolerant sensor apparatus capable of collecting data with less perturbation and fewer disruptions than is usually possible using standard methods.
摘要:
A pinch seal in which particle generation by frictional contact is prevented so that the pinch seal can be used in a semiconductor processing apparatus where elimination of particulate contamination is desirable. The pinch seal is particularly adapted for use in connection with a semiconductor wafer transport device, such as a linear transport device. The pinch seal is formed in a barrier provided between a transport device and a semiconductor processing work environment. One or more support members for transporting a wafer extend through the pinch seal. In one embodiment, the pinch seal includes a flexible sealing member with a magnetic strip extending along the length of the flexible sealing member. A mechanism which does not physically contact the flexible sealing member, such as a device generating a magnetic field, is used to selectively open and close the flexible sealing member to prevent contact between the flexible sealing member and the support member passing through the flexible sealing member while retaining the isolating function of the shielding member.