公开(公告)号：US5836736A

公开(公告)日：1998-11-17

申请号：US698034

申请日：1996-08-15

申请人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright ,  Darryl S. Byle

发明人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright ,  Darryl S. Byle

IPC分类号： B65G49/07 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677

CPC分类号： H01L21/67781 ,  H01L21/67173 ,  H01L21/67313 ,  H01L21/67326 ,  H01L21/67742 ,  H01L21/67754 ,  H01L21/67766 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  Y10S414/138

摘要： A processor for processing integrated circuit wafers, semiconductor substrates, data disks and similar units requiring very low contamination levels. The processor has an interface section which receives wafers in standard wafer carriers. The interface section transfers the wafers from carriers onto novel trays for improved processing. The interface unit can hold multiple groups of multiple trays. A conveyor having an automated arm assembly moves wafers supported on a tray. The conveyor moves the trays from the interface along a track to several processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.

公开(公告)号：US06960257B2

公开(公告)日：2005-11-01

申请号：US10434304

申请日：2003-05-07

申请人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright ,  Darryl S. Byle

发明人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright ,  Darryl S. Byle

IPC分类号： B65G49/07 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677 ,  B05C11/02 ,  B05C21/00

CPC分类号： H01L21/67781 ,  H01L21/67173 ,  H01L21/67313 ,  H01L21/67326 ,  H01L21/67742 ,  H01L21/67754 ,  H01L21/67766 ,  H01L21/67769 ,  H01L21/67775 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/138 ,  Y10S414/14

摘要： A processor for processing integrated circuit wafers, semiconductor substrates, data disks and similar units requiring very low contamination levels. The processor has an interface section which receives wafers in standard wafer carriers. The interface section transfers the wafers from carriers onto novel trays for improved processing. The interface unit can hold multiple groups of multiple trays. A conveyor having an automated arm assembly moves wafers supported on a tray. The conveyor moves the trays from the interface along a track to several processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.

摘要翻译： 用于处理集成电路晶片，半导体衬底，数据盘以及需要非常低的污染水平的类似单元的处理器。 处理器具有在标准晶片载体中接收晶片的接口部分。 接口部分将晶片从载体转移到新的托盘上以改进处理。 接口单元可以容纳多组多个托盘。 具有自动臂组件的输送机移动支撑在托盘上的晶片。 输送机将托盘从接口沿轨道移动到多个处理站。 处理站从与接口部分相邻的封闭区域进行访问。

公开(公告)号：US5660517A

公开(公告)日：1997-08-26

申请号：US415927

申请日：1995-03-31

申请人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright ,  Darryl S. Byle ,  John M. Pedersen

发明人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright ,  Darryl S. Byle ,  John M. Pedersen

IPC分类号： B65G49/07 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677

CPC分类号： H01L21/67781 ,  H01L21/67173 ,  H01L21/67313 ,  H01L21/67326 ,  H01L21/67742 ,  H01L21/67754 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/138 ,  Y10S414/14 ,  Y10S414/141

摘要： A processor for processing integrated circuit wafers, semiconductor substrates, data disks and similar units requiring very low contamination levels. The processor has an interface section which receives wafers in standard wafer carriers. The interface section transfers the wafers from carriers onto novel trays for improved processing. The interface unit can hold multiple groups of multiple trays. A conveyor having an automated arm assembly moves wafers supported on a tray. The conveyor moves the trays from the interface along a track to several processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.

摘要翻译： 用于处理集成电路晶片，半导体衬底，数据盘以及需要非常低的污染水平的类似单元的处理器。 处理器具有在标准晶片载体中接收晶片的接口部分。 接口部分将晶片从载体转移到新的托盘上以改进处理。 接口单元可以容纳多组多个托盘。 具有自动臂组件的输送机移动支撑在托盘上的晶片。 输送机将托盘从接口沿轨道移动到多个处理站。 处理站从与接口部分相邻的封闭区域进行访问。

公开(公告)号：US5678320A

公开(公告)日：1997-10-21

申请号：US415240

申请日：1995-04-03

申请人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright

发明人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright

IPC分类号： B65G49/07 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677 ,  F26B17/24

CPC分类号： H01L21/67781 ,  H01L21/67173 ,  H01L21/67313 ,  H01L21/67326 ,  H01L21/67742 ,  H01L21/67754 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/138 ,  Y10S414/14 ,  Y10S414/141

摘要： A processor for processing semiconductor articles, such as integrated circuit wafers, flat panel displays, semiconductor substrates, and data disks. The processor has an interface section which receives articles in article carriers. The interface section transfers the articles from carriers into processing arrays. A conveyor having an automated arm assembly moves article arrays to and between processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.

摘要翻译： 用于处理诸如集成电路晶片，平板显示器，半导体衬底和数据盘的半导体产品的处理器。 处理器具有接收物品载体中的物品的接口部分。 接口部分将物品从载体转移到处理阵列中。 具有自动臂组件的输送机将物品阵列移动到处理站之间和处理站之间。 处理站从与接口部分相邻的封闭区域进行访问。

公开(公告)号：US5544421A

公开(公告)日：1996-08-13

申请号：US236424

申请日：1994-04-28

申请人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright

发明人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright

IPC分类号： B65G49/07 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677 ,  F26B17/24

CPC分类号： H01L21/67781 ,  H01L21/67173 ,  H01L21/67313 ,  H01L21/67326 ,  H01L21/67742 ,  H01L21/67754 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/138 ,  Y10S414/14 ,  Y10S414/141

摘要： A processor for processing integrated circuit wafers, semiconductor substrates, data disks and similar units requiring very low contamination levels. The processor has an interface section which receives wafers in standard wafer carriers. The interface section transfers the wafers from carriers onto trays for processing. The interface unit can hold multiple groups of multiple trays. A conveyor having an automated arm assembly moves wafers supported on a tray. The conveyor moves the trays from the interface along a track to several processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.

摘要翻译： 用于处理集成电路晶片，半导体衬底，数据盘以及需要非常低的污染水平的类似单元的处理器。 处理器具有在标准晶片载体中接收晶片的接口部分。 接口部分将晶片从载体转移到托盘上用于处理。 接口单元可以容纳多组多个托盘。 具有自动臂组件的输送机移动支撑在托盘上的晶片。 输送机将托盘从接口沿轨道移动到多个处理站。 处理站从与接口部分相邻的封闭区域进行访问。

公开(公告)号：US5882168A

公开(公告)日：1999-03-16

申请号：US881553

申请日：1997-06-24

申请人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright

发明人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright

IPC分类号： B65G49/07 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677 ,  B65B21/02

CPC分类号： H01L21/67754 ,  H01L21/67173 ,  H01L21/67313 ,  H01L21/67326 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/67781 ,  Y10S414/138 ,  Y10S414/141

摘要： A processor for processing semiconductor articles, such as integrated circuit wafers, flat panel displays, semiconductor substrates, and data disks. The processor has an interface section which receives articles in article carriers. The interface section transfers the articles from carriers into processing arrays. A conveyor having an automated arm assembly moves article arrays to and between processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.

摘要翻译： 用于处理诸如集成电路晶片，平板显示器，半导体衬底和数据盘的半导体产品的处理器。 处理器具有接收物品载体中的物品的接口部分。 接口部分将物品从载体转移到处理阵列中。 具有自动臂组件的输送机将物品阵列移动到处理站之间和处理站之间。 处理站从与接口部分相邻的封闭区域进行访问。

公开(公告)号：US5784802A

公开(公告)日：1998-07-28

申请号：US881682

申请日：1997-06-24

申请人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright

发明人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright

IPC分类号： B65G49/07 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677 ,  F26B5/08

CPC分类号： H01L21/67754 ,  H01L21/67173 ,  H01L21/67313 ,  H01L21/67326 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/67781 ,  Y10S414/138 ,  Y10S414/141

摘要： A processor for processing semiconductor articles, such as integrated circuit wafers, flat panel displays, semiconductor substrates, and data disks. The processor has an interface section which receives articles in article carriers. The interface section transfers the articles from carriers into processing arrays. A conveyor having an automated arm assembly moves article arrays to and between processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.

公开(公告)号：US6014817A

公开(公告)日：2000-01-18

申请号：US229542

申请日：1999-01-13

申请人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright

发明人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright

IPC分类号： B65G49/07 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677 ,  F26B17/24

CPC分类号： H01L21/67781 ,  H01L21/67173 ,  H01L21/67313 ,  H01L21/67326 ,  H01L21/67742 ,  H01L21/67754 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/138 ,  Y10S414/14 ,  Y10S414/141

摘要： A processor for processing integrated circuit wafers, semiconductor substrates, data disks and similar units requiring very low contamination levels. The processor has an interface section which receives wafers in standard wafer carriers. The interface section transfers the wafers from carriers onto novel trays for improved processing. The interface unit can hold multiple groups of multiple trays. A conveyor having an automated arm assembly moves wafers supported on a tray. The conveyor moves the trays from the interface along a track to several processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.

摘要翻译： 用于处理集成电路晶片，半导体衬底，数据盘以及需要非常低的污染水平的类似单元的处理器。 处理器具有在标准晶片载体中接收晶片的接口部分。 接口部分将晶片从载体转移到新的托盘上以改进处理。 接口单元可以容纳多组多个托盘。 具有自动臂组件的输送机移动支撑在托盘上的晶片。 输送机将托盘从接口沿轨道移动到多个处理站。 处理站从与接口部分相邻的封闭区域进行访问。

公开(公告)号：US5996241A

公开(公告)日：1999-12-07

申请号：US813860

申请日：1997-03-07

申请人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright

发明人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright

IPC分类号： B65G49/07 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677 ,  F26B17/24

CPC分类号： H01L21/67781 ,  H01L21/67173 ,  H01L21/67313 ,  H01L21/67326 ,  H01L21/67742 ,  H01L21/67754 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/138 ,  Y10S414/14 ,  Y10S414/141

摘要： A processor for processing integrated circuit wafers, semiconductor substrates, data disks and similar units requiring very low contamination levels. The processor has an interface section which receives wafers in standard wafer carriers. The interface section transfers the wafers from carriers onto novel trays for improved processing. The interface unit can hold multiple groups of multiple trays. A conveyor having an automated arm assembly moves wafers supported on a tray. The conveyor moves the trays from the interface along a track to several processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.

摘要翻译： 用于处理集成电路晶片，半导体衬底，数据盘以及需要非常低的污染水平的类似单元的处理器。 处理器具有在标准晶片载体中接收晶片的接口部分。 接口部分将晶片从载体转移到新的托盘上以改进处理。 接口单元可以容纳多组多个托盘。 具有自动臂组件的输送机移动支撑在托盘上的晶片。 输送机将托盘从接口沿轨道移动到多个处理站。 处理站从与接口部分相邻的封闭区域进行访问。

公开(公告)号：US5788454A

公开(公告)日：1998-08-04

申请号：US623659

申请日：1996-03-29

申请人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright

发明人： Raymon F. Thompson ,  Robert W. Berner ,  Gary L. Curtis ,  Stephen P. Culliton ,  Blaine G. Wright

IPC分类号： B65G49/07 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677

CPC分类号： H01L21/67781 ,  H01L21/67173 ,  H01L21/67313 ,  H01L21/67326 ,  H01L21/67742 ,  H01L21/67754 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/138 ,  Y10S414/14 ,  Y10S414/141

摘要： A processor for processing integrated circuit wafers, semiconductor substrates, data disks and similar units requiring very low contamination levels. The processor has an interface section which receives wafers in standard wafer carriers. The interface section transfers the wafers from carriers onto novel trays for improved processing. The interface unit can hold multiple groups of multiple trays. A conveyor having an automated arm assembly moves wafers supported on a tray. The conveyor moves the trays from the interface along a track to several processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.