公开(公告)号：US4411149A

公开(公告)日：1983-10-25

申请号：US326591

申请日：1981-12-02

申请人： Raymond L. Delorme

发明人： Raymond L. Delorme

IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L23/498 ,  H05K13/02 ,  B21D5/01

CPC分类号： H01L23/4985 ,  H01L21/4842 ,  H01L24/50 ,  H05K13/023 ,  H01L2924/14 ,  Y10T29/53183

摘要： The invention relates to an automatic machine for bending the extending conductors of an integrated circuit chip to form contacts for mounting the chip to a substrate. This machine comprises a bending base (20), movable bending pieces (18, 19) situated opposite the bases, a ribbon insulating support (2) for the chip (1), and a platform (27) to displace the support of the chip so as to being the chip onto the base, or to remove it therefrom. This machine is characterized in that the bending base (20) includes a housing (21) having the form of the chip for receiving the chip and having a plane rim (23) adapted to surround the body of the chip. The first movable piece (18) is located in the second movable piece and has a flat rim (24) opposite the flat rim (23) of the base. The extending conductors are wedged during the bending operation between these two rims (23, 24) and the bending is carried out by the second movable piece (19) which moves rectilinearly in a vertical direction.

摘要翻译： 本发明涉及一种用于弯曲集成电路芯片的延伸导体的自动机器，以形成用于将芯片安装到基板上的触点。 该机器包括弯曲基座（20），与基座相对设置的可移动弯曲块（18,19），用于芯片（1）的带状绝缘支撑件（2）和用于使芯片的支撑件移位的平台（27） 以便将芯片放在基座上或从中移除。 该机器的特征在于，弯曲基座（20）包括具有用于接收芯片的芯片形式的壳体（21），并具有适于围绕芯片主体的平面边缘（23）。 第一可移动件（18）位于第二可移动件中并且具有与基座的平坦边缘（23）相对的平坦的边缘（24）。 在这两个边缘（23,24）之间的弯曲操作期间，延伸导体楔入，并且通过在垂直方向上直线移动的第二可动片（19）进行弯曲。

公开(公告)号：US4283845A

公开(公告)日：1981-08-18

申请号：US917279

申请日：1978-06-20

申请人： Pierre L. Sigel ,  Raymond L. Delorme ,  Henri Grosjean

发明人： Pierre L. Sigel ,  Raymond L. Delorme ,  Henri Grosjean

IPC分类号： H05K13/04 ,  B23P19/00

CPC分类号： H05K13/04 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191

摘要： A positioning system for electrical components to be mounted on a carrier includes establishing a first reference system and bringing the carrier on which the components are to be mounted to a predetermined position in relation to the first system. The locations for the articles to be mounted on the carrier are defined. A second reference system is established with respect to the first reference system and the carrier is positioned in relation to the articles to be mounted on the carrier using the second reference system. Each reference system is defined by at least three fixed points against which the carrier comes to bear and the points of the second reference system duplicate the points of the first reference system so that the carrier is in the exact position to enable the components to be mounted at the exact predetermined location.

摘要翻译： 一种用于安装在载体上的电气部件的定位系统包括：建立第一参考系统并使其上安装有组件的载体相对于第一系统的预定位置。 定义要安装在载体上的物品的位置。 相对于第一参考系统建立第二参考系统，并且使用第二参考系统相对于待安装在载体上的物品定位承载件。 每个参考系统由至少三个固定点限定，承载者承载着至少三个固定点，第二参考系统的点与第一参考系统的点重复，使得载体处于确定位置以使部件能够安装 在确切的预定位置。

公开(公告)号：US4255644A

公开(公告)日：1981-03-10

申请号：US895791

申请日：1978-04-12

申请人： Raymond L. Delorme

发明人： Raymond L. Delorme

IPC分类号： H05K3/34 ,  B23K3/03 ,  B23K3/047 ,  B23K3/02 ,  H05B3/24 ,  H05K13/04

CPC分类号： B23K3/0471

摘要： A tool for micro-soldering the connecting tags of an integrated circuit chip to corresponding terminals on a substrate by Joule heating includes a high conductivity bit having a planar bottom face adapted to contact the tags and press them against the terminals while applying sufficient heat to the tags to solder them to the terminals. The face has a perimeter and a centrally apertured portion adapted to receive and accommodate the circuit chip. The apertured portion forms a geometric loop on the planar face having opposite sides spaced from each other and adapted to contact the tags of the chip. A continuous high electrical conductivity flange extends upwardly from all portions of the perimeter of the face to provide rigidity to the bit.A pair of high conductivity strips extend from facing segments of the flange for applying current to and removing current from the flange on opposite sides of the loop so that a pair of symmetrical current half loops extend about the face between the opposite sides thereof. Each strip has a reduced cross-sectional area symmetrical with the side of the face and removed from the intersection of the strip with the flange.

摘要翻译： 用于通过焦耳加热将集成电路芯片的连接标签与基板上的相应端子微连接的工具包括具有适于接触标签的平坦底面的高电导率位，并将其压靠端子，同时向该端子施加足够的热量 标签将其焊接到端子。 该面具有适于容纳和容纳电路芯片的外围和中心有孔部分。 有孔部分在平面上形成几何环，其具有彼此间隔开的相对侧并且适于接触芯片的标签。 连续的高导电性凸缘从面的周边的所有部分向上延伸，以提供刚度。 一对高导电性带从法兰的面对部分延伸，用于向环路的相对侧上的法兰施加电流并从电路的相反侧除去电流，使得一对对称的电流半环围绕其相对侧面之间延伸。 每个条带具有减小的横截面面积，与面的侧面对称并且从条带与法兰的交叉处移开。