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公开(公告)号：US20190035517A1
公开(公告)日：2019-01-31
申请号：US15663128
申请日：2017-07-28
Applicant: Raytheon Company
Inventor： Angelo M. Puzella , Lance A. Auer , Norman Armendariz , Donald A. Bozza , John B. Francis , Philip M. Henault , Randal W. Oberle , Susan C. Trulli , Dimitry Zarkh
Abstract: A coaxial transmission line structure having a center conductor section having an input contact and an output contact the output contact being larger than the input contact, the center conductor having a plurality of different geometrically shaped, electrically conductive layers having sizes progressively increasing from the input contact to the larger output contact to conductor transition from the input contact to the larger output contact, the electrically conductive layers being electrically interconnected by staggered microvias passing through dielectric layers to the center, and (B) an outer conductor section disposed about, coaxial with, and electrically isolated from, the center conductor by the dielectric layers.
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公开(公告)号：US20150015453A1
公开(公告)日：2015-01-15
申请号：US14505980
申请日：2014-10-03
Applicant: Raytheon Company
Inventor： Angelo M. Puzella , Donald A. Bozza , James R. Robbins , John B. Francis
CPC classification number: H01Q21/0025 , H01L2223/6677 , H01L2223/6683 , H01L2224/16227 , H01L2224/73253 , H01P1/38 , H01Q1/02 , H01Q9/0414 , H01Q21/00 , H01Q21/0087 , H01Q21/065 , H05K1/0206 , H05K1/0207
Abstract: A mixed-signal, multilayer printed wiring board fabricated in a single lamination step is described. The PWB includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the PWB. The PWB includes a number of unit cells with radiating elements and an RF cage disposed around each unit cell to isolate the unit cell. A plurality of flip-chip circuits are disposed on an external surface of the PWB and a heat sink can be disposed over the flip chip components.
Abstract translation: 描述了在单个层压步骤中制造的混合信号多层印刷线路板。 PWB包括组成PWB的不同电路板上的不同电路层之间的一个或多个射频（RF）互连。 PWB包括具有辐射元件的多个单元电池和围绕每个单元电池设置的RF笼以隔离晶胞。 多个倒装芯片电路设置在PWB的外表面上，并且散热器可以设置在倒装芯片部件之上。
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公开(公告)号：US10276282B2
公开(公告)日：2019-04-30
申请号：US15663128
申请日：2017-07-28
Applicant: Raytheon Company
Inventor： Angelo M. Puzella , Lance A. Auer , Norman Armendariz , Donald A. Bozza , John B. Francis , Philip M. Henault , Randal W. Oberle , Susan C. Trulli , Dimitry Zarkh
Abstract: A coaxial transmission line structure having a center conductor section having an input contact and an output contact the output contact being larger than the input contact, the center conductor having a plurality of different geometrically shaped, electrically conductive layers having sizes progressively increasing from the input contact to the larger output contact to conductor transition from the input contact to the larger output contact, the electrically conductive layers being electrically interconnected by staggered microvias passing through dielectric layers to the center, and (B) an outer conductor section disposed about, coaxial with, and electrically isolated from, the center conductor by the dielectric layers.
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公开(公告)号：US09172145B2
公开(公告)日：2015-10-27
申请号：US14505980
申请日：2014-10-03
Applicant: Raytheon Company
Inventor： Angelo M. Puzella , Donald A. Bozza , James A. Robbins , John B. Francis
CPC classification number: H01Q21/0025 , H01L2223/6677 , H01L2223/6683 , H01L2224/16227 , H01L2224/73253 , H01P1/38 , H01Q1/02 , H01Q9/0414 , H01Q21/00 , H01Q21/0087 , H01Q21/065 , H05K1/0206 , H05K1/0207
Abstract: A mixed-signal, multilayer printed wiring board fabricated in a single lamination step is described. The PWB includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the PWB. The PWB includes a number of unit cells with radiating elements and an RF cage disposed around each unit cell to isolate the unit cell. A plurality of flip-chip circuits are disposed on an external surface of the PWB and a heat sink can be disposed over the flip chip components.
Abstract translation: 描述了在单个层压步骤中制造的混合信号多层印刷线路板。 PWB包括组成PWB的不同电路板上的不同电路层之间的一个或多个射频（RF）互连。 PWB包括具有辐射元件的多个单元电池和围绕每个单元电池设置的RF笼以隔离晶胞。 多个倒装芯片电路设置在PWB的外表面上，并且散热器可以设置在倒装芯片部件之上。
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